Patents by Inventor Tee-yeol Heo

Tee-yeol Heo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of packaging semiconductor wafers by molding a packing bag about a carrying device that contains the semiconductor wafers
    Publication number: 20020023413
    Abstract: Semiconductor wafers are packed by providing a carrying device that holds one or more semiconductor wafers. The carrying device is inserted into a packing bag and the packing bag is molded using at least a portion of the external form of the carrying device as a guide such that a portion of the packing bag substantially conforms to the portion of the external form of the carrying device. Thus, wafers may be packaged without using a vacuum while still inhibiting contamination from particles and the formation of haze on the surface of the wafers.
    Type: Application
    Filed: July 11, 2001
    Publication date: February 28, 2002
    Inventors: Tae-hun Shim, Tee-yeol Heo, Kyong-rim Kang, Jeong-hoon An