Patents by Inventor Teemu Rämö
Teemu Rämö has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240310920Abstract: An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.Type: ApplicationFiled: May 28, 2024Publication date: September 19, 2024Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Harsha RAO, Rong HU, Carl Lennart STÅHL, Jie SU, Vadim KONRADI, Teemu RAMO, Anthony Stephen DOY
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Patent number: 12032744Abstract: An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.Type: GrantFiled: January 9, 2023Date of Patent: July 9, 2024Assignee: Cirrus Logic Inc.Inventors: Harsha Rao, Rong Hu, Carl Lennart Ståhl, Jie Su, Vadim Konradi, Teemu Ramo, Anthony Stephen Doy
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Patent number: 11500469Abstract: An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.Type: GrantFiled: October 6, 2021Date of Patent: November 15, 2022Assignee: Cirrus Logic, Inc.Inventors: Harsha Rao, Rong Hu, Carl Lennart Ståhl, Jie Su, Vadim Konradi, Teemu Ramo, Anthony Stephen Doy
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Publication number: 20220026989Abstract: An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.Type: ApplicationFiled: October 6, 2021Publication date: January 27, 2022Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Harsha RAO, Rong HU, Carl Lennart STÅHL, Jie SU, Vadim KONRADI, Teemu RAMO, Anthony Stephen DOY
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Publication number: 20200272239Abstract: An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.Type: ApplicationFiled: May 11, 2020Publication date: August 27, 2020Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Harsha RAO, Rong HU, Carl Lennart STÅHL, Jie SU, Vadim KONRADI, Teemu RAMO, Anthony Stephen DOY
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Patent number: 10732714Abstract: An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.Type: GrantFiled: October 2, 2017Date of Patent: August 4, 2020Assignee: Cirrus Logic, Inc.Inventors: Harsha Rao, Rong Hu, Carl Lennart Ståhl, Jie Su, Vadim Konradi, Teemu Ramo, Anthony Stephen Doy
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Patent number: 10248244Abstract: A device comprising a touch sensing element and a processing unit is provided. The device has one or more cover operation modes. The processing unit is adapted to activate one of the cover operation modes of the device when a non-conductive opaque cover element is applied to the device, and the device is adapted to be operated via the touch sensing element through the non-conductive opaque cover element when the cover operation mode of the device is active. A system comprising a device and a cover element is provided. A method for controlling a device comprising a touch sensing element is also provided.Type: GrantFiled: October 8, 2014Date of Patent: April 2, 2019Assignee: Microsoft Technology Licensing, LLCInventors: Toni Hemminki, Teemu Rämö
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Publication number: 20180321748Abstract: An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.Type: ApplicationFiled: October 2, 2017Publication date: November 8, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Harsha RAO, Rong HU, Carl Lennart STÅHL, Jie SU, Vadim KONRADI, Teemu RAMO, Anthony Stephen Doy
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Publication number: 20160103546Abstract: A device comprising a touch sensing element and a processing unit is provided. The device has one or more cover operation modes. The processing unit is adapted to activate one of the cover operation modes of the device when a non-conductive opaque cover element is applied to the device, and the device is adapted to be operated via the touch sensing element through the non-conductive opaque cover element when the cover operation mode of the device is active. A system comprising a device and a cover element is provided. A method for controlling a device comprising a touch sensing element is also provided.Type: ApplicationFiled: October 8, 2014Publication date: April 14, 2016Inventors: Toni Hemminki, Teemu Rämö
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Publication number: 20080316182Abstract: Touch detection within display devices with a first conductive layer with first and second electrodes, a second conductive layer with third electrodes, a spacer spatially spacing the first conductive layer from the second conductive layer, the first electrodes being arranged for capacitive touch detection, and the second and third electrodes being arranged for resistive touch detection.Type: ApplicationFiled: June 21, 2007Publication date: December 25, 2008Inventors: Mika Antila, Teemu Ramo, Marko Karhiniemi