Patents by Inventor Teh Yang LIN

Teh Yang LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11950771
    Abstract: The present invention provides a supporting hook structure, comprising a sleeve, a fixing rod, a first limit unit, a hook and a fixing device. The fixing rod is connected to the side surface of the sleeve. The hook body is connected to one end of the sleeve. The first limit unit is arranged on the side surface of the sleeve and adjacent to the hook body. The first limit unit makes the hook body rotates with the axis direction of the sleeve as a rotation axis. The fixing device is connected to the other end of the sleeve to fix the rotating position of the hook body. Through the above, the hook part enters the proximal thigh from a surgical entrance and the hook part rotates to make the hook part abut against the proximal femur to complete the positioning and fixation of the femur hook structure to the femur.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 9, 2024
    Assignee: UNITED ORTHOPEDIC CORPORATION
    Inventors: Yan-Shen Lin, Jiann-Jong Liau, Yu-Liang Liu, Teh-Yang Lin, Wen-Chuan Chen
  • Publication number: 20230404831
    Abstract: A femoral lift apparatus includes a lift device and a hook device. The hook device is coupled to the lift device. The femoral lift apparatus is labor-saving and can avoid the problem that the conventional femoral lift apparatus may block the surgical view, hinder the operation position for a hip joint replacement surgery. With the assistance of this current femoral lift apparatus, the hip joint replacement surgery can be performed more smoothly.
    Type: Application
    Filed: September 26, 2022
    Publication date: December 21, 2023
    Inventors: EDWIN P SU, Yan-Shen Lin, Jiann-Jong Liau, Yu-Liang Liu, Teh-Yang Lin, Wen-Chuan Chen
  • Publication number: 20220370060
    Abstract: The present invention provides a supporting hook structure, comprising a sleeve, a fixing rod, a first limit unit, a hook and a fixing device. The fixing rod is connected to the side surface of the sleeve. The hook body is connected to one end of the sleeve. The first limit unit is arranged on the side surface of the sleeve and adjacent to the hook body. The first limit unit makes the hook body rotates with the axis direction of the sleeve as a rotation axis. The fixing device is connected to the other end of the sleeve to fix the rotating position of the hook body. Through the above, the hook part enters the proximal thigh from a surgical entrance and the hook part rotates to make the hook part abut against the proximal femur to complete the positioning and fixation of the femur hook structure to the femur.
    Type: Application
    Filed: August 16, 2021
    Publication date: November 24, 2022
    Inventors: YAN-SHEN LIN, JIANN-JONG LIAU, YU-LIANG LIU, TEH-YANG LIN, WEN-CHUAN CHEN
  • Patent number: 9608179
    Abstract: Disclosed is a SMD type LED package device, a method for manufacturing the same, and a light-emitting apparatus, wherein the surface-mount-device (SMD) type light-emitting diode (LED) package device comprises an assembly of an LED chip, two metal supporting frames, and a packaging body. The two metal supporting frames of the assembly are spaced apart from each other and disposed in parallel along the first axis. Each metal supporting frame has a first end electrically connected to the LED chip and a second end opposite to the first end. The packaging body has a lens portion and a supporting portion, which is integrally formed with the packaging body and covers the LED chip and the first ends of the metal supporting frames.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: March 28, 2017
    Assignee: Powerled Electronic Co., Ltd.
    Inventors: Wei Pin Hsu, Teh Yang Lin
  • Publication number: 20160133797
    Abstract: Disclosed is a SMD type LED package device, a method for manufacturing the same, and a light-emitting apparatus, wherein the surface-mount-device (SMD) type light-emitting diode (LED) package device comprises an assembly of an LED chip, two metal supporting frames, and a packaging body. The two metal supporting frames of the assembly are spaced apart from each other and disposed in parallel along the first axis. Each metal supporting frame has a first end electrically connected to the LED chip and a second end opposite to the first end. The packaging body has a lens portion and a supporting portion, which is integrally formed with the packaging body and covers the LED chip and the first ends of the metal supporting frames.
    Type: Application
    Filed: September 24, 2015
    Publication date: May 12, 2016
    Applicant: POWERLED ELECTRONIC CO., LTD.
    Inventors: Wei Pin HSU, Teh Yang LIN