Abstract: A wet-processing apparatus for processing substrates is provided. The wet-processing apparatus for processing substrates includes a conveyor type cleaning system and a spinner type wet-processing unit connected to the conveyor type cleaning system. In an embodiment of the present invention, the wet-processing apparatus further includes a cassette station for storing the substrates and a robot installed in the cassette station, wherein the substrate is delivered from the cassette station to the conveyor type cleaning system by the robot. The wet-processing apparatus mentioned above has excellent process uniformity, low consumption of the chemical, good cleaning ability, and low substrate broken frequency.

Abstract: Transflective display panel and fabrication methods thereof. A substrate with a transmissive area disposed thereon is provided. A planarization layer is deposited on the substrate and a hole is then formed in the planarization layer to expose the transmissive area. A first reflective layer and a second reflective layer are formed on the planarization layer in sequence. An etching process is then performed to pattern the first reflective layer and the second reflective layer to expose the transmissive area. The etching process has a first etching rate to the first reflective layer and a second etching rate to the second reflective layer, which is larger than the first etching rate. A transparent electrode layer is then formed on the second reflective layer and the transmissive area.

Abstract: Transflective display panel and fabrication methods thereof. A substrate with a transmissive area disposed thereon is provided. A planarization layer is deposited on the substrate and a hole is then formed in the planarization layer to expose the transmissive area. A first reflective layer and a second reflective layer are formed on the planarization layer in sequence. An etching process is then performed to pattern the first reflective layer and the second reflective layer to expose the transmissive area. The etching process has a first etching rate to the first reflective layer and a second etching rate to the second reflective layer, which is larger than the first etching rate. A transparent electrode layer is then formed on the second reflective layer and the transmissive area.

Abstract: A method for post-treating a dry-etched metal film is provided. The dry-etched metal film includes an unetched portion covered by a photoresist and an etched portion exposed from the photoresist and having thereon an etching by-product. According to the method, a stripping agent is used to remove the photoresist on the unetched portion, while reacting the stripping agent with the etching by-product to form a passivation layer on the exposed metal film. Then, a washing agent is used to remove the passivation layer after the photoresist is removed. A system for performing combined etching and stripping procedures of a metal film is also provided. The system comprises dry-etching chambers, stripping and cleaning chambers and a transportation device. In the stripping and cleaning chambers, the photoresist on the unetched portion is removed by a stripping agent and a passivation layer is formed on the etched portion by reacting the stripping agent.