Abstract: An integrated circuit package lead frame, comprising a plurality of leads and a spine electrically connected to said plurality of leads, said spine comprising indentations between a pair of said leads. The indentations prevent the pair of leads from becoming electrically connected to each other after a singulation process.

Abstract: A method for encapsulating an IC package is performed, in one example embodiment, by providing a lead frame member including the IC chip mounted on a portion of the lead frame member, wherein the lead frame member further includes a plurality of apertures disposed substantially around the mounted IC chip. The plurality of apertures in the lead frame member is then filled with an isolation material by dispensing the isolation material in each of the plurality of apertures. The lead frame member is then placed into a mold including a mold cavity such that the IC package including the plurality of apertures are disposed in the mold cavity. A mold compound is then injected into the mold cavity in a manner that fills the mold cavity with the mold compound to form an encapsulant over the IC package and the plurality of the apertures.

Abstract: An integrated circuit package lead frame, comprising a plurality of leads and a spine electrically connected to said plurality of leads, said spine comprising indentations between a pair of said leads. The indentations prevent the pair of leads from becoming electrically connected to each other after a singulation process.