Patents by Inventor Teiji Takahashi
Teiji Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230176105Abstract: An insulation defect detection method for magnet wire coating includes: a running step of causing a magnet wire to run in a line direction; a first discharge detection step of detecting a first discharge by applying AC voltage to a measurement point on the running magnet wire; a second discharge detection step of detecting a second discharge by applying AC voltage to a measurement point on the magnet wire after the first discharge is detected; and a determination step of determining whether or not the magnet wire coating has an insulation defect by comparing the first discharge with the second discharge.Type: ApplicationFiled: January 20, 2021Publication date: June 8, 2023Applicant: Mitsubishi Electriic CorporationInventors: Teiji TAKAHASHI, Takahiro MISAWA, Xutao LI
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Patent number: 8138442Abstract: Provided are a wire electric discharge machining method for poorly conductive materials, such as solar cell silicon, and a semiconductor wafer manufacturing method and a solar battery cell manufacturing method based on the wire electric discharge machining method. Electrical discharge machining of a high volume resistivity, hard and brittle materials, having a volume resistivity that is equal to or higher than 0.5 ?·cm and equal to or lower than 5 ?·cm is performed by applying a pulse voltage having a pulse width that is equal to or higher than 1 ?sec and equal to or lower than 4 ?sec and having a peak current at the time of machining a wire electrode that is equal to or higher than 10A and equal to or lower than 50A to a wire electrode and generating a discharge pulse between the wire electrode and a subject to be machined.Type: GrantFiled: November 16, 2005Date of Patent: March 20, 2012Assignee: Mitsubishi Electric CorporationInventors: Tatsushi Sato, Yoshihito Imai, Teiji Takahashi, Takeshi Sakata, Tomoko Sendai, Yoichiro Nishimoto, Shigeru Matsuno, Takeyuki Maegawa, Takaaki Iwata
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Publication number: 20090212026Abstract: Provided are a wire electric discharge machining method for poorly conductive materials, such as solar cell silicon, and a semiconductor wafer manufacturing method and a solar battery cell manufacturing method based on the wire electric discharge machining method. Electrical discharge machining of a high volume resistivity, hard and brittle materials, having a volume resistivity that is equal to or higher than 0.5 ?·cm and equal to or lower than 5 ?·cm is performed by applying a pulse voltage having a pulse width that is equal to or higher than 1 ?sec and equal to or lower than 4 ?sec and having a peak current at the time of machining a wire electrode that is equal to or higher than 10A and equal to or lower than 50A to a wire electrode and generating a discharge pulse between the wire electrode and a subject to be machined.Type: ApplicationFiled: November 16, 2005Publication date: August 27, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tatsushi Sato, Yoshihito Imai, Teiji Takahashi, Takeshi Sakata, Tomoko Sendai, Yoichiro Nishimoto, Shigeru Matsuno, Takeyuki Maegawa, Takaaki Iwata
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Patent number: 7557589Abstract: A signal processing portion obtains the reciprocal of a composite impedance of gap static capacitance and a plasma impedance, obtains composite static capacitance which is the sum of the gap static capacitance and a static capacitance component included in the plasma impedance from an imaginary part of the reciprocal, and obtains a resistance component included in the plasma impedance from a real part of the reciprocal. A gap detection device obtains the static capacitance component by using a model representing the characteristics of the reciprocal of the plasma impedance and the resistance component and obtains the gap static capacitance by subtracting the static capacitance component from the composite static capacitance. The gap detection device obtains a gap from the obtained gap static capacitance. Thus provided is a technique to detect a gap between a nozzle of a laser beam machine for outputting a laser beam and an object to be machined with high accuracy.Type: GrantFiled: October 31, 2006Date of Patent: July 7, 2009Assignee: Mitsubishi Electric CorporationInventors: Takaaki Iwata, Hiroyoshi Omura, Yoshihito Imai, Teiji Takahashi
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Publication number: 20070284348Abstract: A signal processing portion obtains the reciprocal of a composite impedance of gap static capacitance and a plasma impedance, obtains composite static capacitance which is the sum of the gap static capacitance and a static capacitance component included in the plasma impedance from an imaginary part of the reciprocal, and obtains a resistance component included in the plasma impedance from a real part of the reciprocal. A gap detection device obtains the static capacitance component by using a model representing the characteristics of the reciprocal of the plasma impedance and the resistance component and obtains the gap static capacitance by subtracting the static capacitance component from the composite static capacitance. The gap detection device obtains a gap from the obtained gap static capacitance. Thus provided is a technique to detect a gap between a nozzle of a laser beam machine for outputting a laser beam and an object to be machined with high accuracy.Type: ApplicationFiled: October 31, 2006Publication date: December 13, 2007Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Takaaki IWATA, Hiroyoshi OMURA, Yoshihito IMAI, Teiji TAKAHASHI
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Patent number: 6943522Abstract: A servo controller includes a mechanical characteristic compensation unit for attenuating components having predetermined frequencies and corresponding to characteristics of a machine, which are included in a position instruction signal corrected by a finite impulse response (FIR) filter, and computing feed-forward signals respectively associated with position, speed, and torque of the machine, and a feedback compensation unit for driving the machine according to the feed-forward signals. Therefore, the servo controller can reduce vibrations that originate from the characteristics of the machine. In addition, because the FIR filter can easily make the response path with respect to a symmetrical instructed path, become symmetrical, when the machine is made to travel between two positions along the same path, the two response paths of the round trip match each other, so machined surfaces having no irregularities can be provided when performing reciprocating machining.Type: GrantFiled: February 11, 2004Date of Patent: September 13, 2005Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kotaro Nagaoka, Tomonori Sato, Hidetoshi Ikeda, Teiji Takahashi
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Publication number: 20040183494Abstract: A servo controller includes a mechanical characteristic compensation unit for attenuating components having predetermined frequencies and corresponding to characteristics of a machine, which are included in a position instruction signal corrected by an FIR filter, so as to compute feed-forward signals respectively associated with the position, speed and torque of the machine, and a feedback compensation unit for driving the machine according to the feed-forward signals. Therefore, the servo controller can reduce vibrations that originate from the characteristics of the machine 2. In addition, because the FIR filter can easily make the response path with respect to a symmetric instructed path become symmetric, and, when the machine is made to travel between two positions along the same path, can make the two response paths of the round trip match each other, machined surfaces having no irregularities can be provided when performing reciprocating machining.Type: ApplicationFiled: February 11, 2004Publication date: September 23, 2004Applicant: Mitsubishi Denki Kabushiki KaishaInventors: Kotaro Nagaoka, Tomonori Sato, Hidetoshi Ikeda, Teiji Takahashi
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Patent number: 5961857Abstract: A laser machining apparatus according to the present invention describes characteristics of a laser oscillator with a function including laser power, pulse frequency and duty ratio, computes a command for a power supply unit in a feed forward control section according to a command based on the function and on the power, duty ratio and frequency, computes a command for a power supply unit in the feedback control section from a power command value and a power measurement value from the power sensor, and inputs these command to the power supply unit. Also the laser machining apparatus detects changes in characteristics in the laser oscillator and corrects the function for characteristics of the laser oscillator.Type: GrantFiled: September 12, 1997Date of Patent: October 5, 1999Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Teiji Takahashi, Yoshihito Imai, Atsushi Morita, Masato Matsubara, Osamu Nagano, Tsukasa Fukushima
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Patent number: 5955856Abstract: A numerical control apparatus and a numerical control method is provided which permit high-accuracy and high-velocity travel at a joint between paths as well as simple and rapid calculations for this purpose. A path is inserted at the joint between the paths so as to achieve a continuous curvature.Type: GrantFiled: May 19, 1998Date of Patent: September 21, 1999Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Tomonori Sato, Takashi Iwasaki, Teiji Takahashi
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Patent number: 5841096Abstract: A laser machining apparatus according to the present invention describes characteristics of a laser oscillator with a function including laser power, pulse frequency and duty ratio, computes a command for a power supply unit in a feed forward control section according to a command based on the function and on the power, duty ratio and frequency, computes a command for a power supply unit in the feedback control section from a power command value and a power measurement value from the power sensor, and inputs these command to the power supply unit. Also the laser machining apparatus detects changes in characteristics in the laser oscillator and corrects the function for characteristics of the laser oscillator.Type: GrantFiled: September 12, 1997Date of Patent: November 24, 1998Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Teiji Takahashi, Yoshihito Imai, Atsushi Morita, Masato Matsubara, Osamu Nagano, Tsukasa Fukushima