Patents by Inventor Tein Wang

Tein Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Differential sense amplifier circuit and method triggered by a clock signal through a switch circuit
    Publication number: 20070115031
    Abstract: A differential sense amplifier is described that can be configured as a preamplifier or a latch circuit as triggered by a clock signal connected to a switch circuit. When the clock signal is set at a first signal level, the switch circuit in the differential sense amplifier is activated so that the differential sense amplifier is configured as a preamplifier with a positive feedback circuit. When the clock signal is set at a second signal level, the switch circuit in the differential sense amplifier is deactivated so that the differential sense amplifier is configured as the latch circuit. For one read cycle, the differential sense amplifier operates first as the preamplifier and then as the latch circuit.
    Type: Application
    Filed: November 21, 2005
    Publication date: May 24, 2007
    Applicant: Macronix International Co., Ltd.
    Inventors: Jer Hsu, Tein Wang
  • Package structure of organic electroluminescence panel
    Patent number: 6858874
    Abstract: A package structure of an OEL panel includes a printed circuit board, at least one OEL panel, and several bumps. Wherein, the OEL panel has several poly solder interconnections arranged in an array structure. The printed circuit board has several solder pads, which are also implemented with bumps. The at least one OEL panel is disposed on the printed circuit board to have the electric connection with the printed circuit board through the poly solder interconnections and the bumps.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: February 22, 2005
    Assignee: RiTdisplay Corporation
    Inventors: Chin-Long Wu, Tung-Yang Tang, Shih-Ming Hsu, Shang-Wei Chen, Tein-Wang Huang
  • [PACKAGE STRUCTURE OF ORGANIC ELECTROLUMINESCENCE PANEL]
    Publication number: 20040251045
    Abstract: A package structure of an OEL panel includes a printed circuit board, at least one OEL panel, and several bumps. Wherein, the OEL panel has several poly solder interconnections arranged in an array structure. The printed circuit board has several solder pads, which are also implemented with bumps. The at least one OEL panel is disposed on the printed circuit board to have the electric connection with the printed circuit board through the poly solder interconnections and the bumps.
    Type: Application
    Filed: June 11, 2003
    Publication date: December 16, 2004
    Inventors: CHIN-LONG WU, twTUNG-YANG TANG, SHIH-MING HSU, SHANG-WEI CHEN, TEIN-WANG HUANG