Patents by Inventor Tej Pantha

Tej Pantha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10008653
    Abstract: A thermoelectric half-Heusler material comprising niobium (Nb), iron (Fe) and antimony (Sb) wherein the material comprises grains having a mean grain size less than one micron. A method of making a nanocomposite half-Heusler thermoelectric material includes melting constituent elements of the thermoelectric material to form an alloy of the thermoelectric material, comminuting (e.g., ball milling) the alloy of the thermoelectric material into nanometer scale mean size particles, and consolidating the nanometer size particles to form the half-Heusler thermoelectric material comprising at least niobium (Nb), iron (Fe) and antimony (Sb) and having grains with a mean grain size less than one micron.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: June 26, 2018
    Assignees: UNIVERSITY OF HOUSTON SYSTEM, U.S. DEPARTMENT OF ENERGY
    Inventors: Giri Joshi, Jian Yang, Michael Engber, Tej Pantha, Martin Cleary, Zhifeng Ren, Ran He, Boris Kozinsky
  • Publication number: 20150270465
    Abstract: A thermoelectric half-Heusler material comprising niobium (Nb), iron (Fe) and antimony (Sb) wherein the material comprises grains having a mean grain size less than one micron. A method of making a nanocomposite half-Heusler thermoelectric material includes melting constituent elements of the thermoelectric material to form an alloy of the thermoelectric material, comminuting (e.g., ball milling) the alloy of the thermoelectric material into nanometer scale mean size particles, and consolidating the nanometer size particles to form the half-Heusler thermoelectric material comprising at least niobium (Nb), iron (Fe) and antimony (Sb) and having grains with a mean grain size less than one micron.
    Type: Application
    Filed: March 24, 2015
    Publication date: September 24, 2015
    Inventors: Giri Joshi, Jian Yang, Michael Engber, Tej Pantha, Martin Cleary, Zhifeng Ren, Ran He, Boris Kozinsky