Patents by Inventor Tek Sim Lee

Tek Sim Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Component Having Inner and Outer Semiconductor Component Housings
    Publication number: 20160111346
    Abstract: A semiconductor component includes an inner semiconductor component housing and an outer semiconductor component housing. The inner semiconductor component housing includes a semiconductor chip, a first plastic housing composition and first housing contact surfaces. At least side faces of the semiconductor chip are embedded in the first plastic housing composition and the first housing contact surfaces are free of the first plastic housing composition and include a first arrangement. The outer semiconductor component housing includes a second plastic housing composition and second housing contact surfaces which include a second arrangement. The inner semiconductor component housing is situated within the outer semiconductor component housing and is embedded in the second plastic housing composition. At least one of the first housing contact surfaces is electrically connected with at least one of the second housing contact surfaces.
    Type: Application
    Filed: October 9, 2015
    Publication date: April 21, 2016
    Inventors: Josef Hoeglauer, Tek Sim Lee, Ralf Otremba, Klaus Schiess, Xaver Schloegel, Juergen Schredl