Patents by Inventor Tekelec, Inc.

Tekelec, Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130176908
    Abstract: The subject matter described herein includes systems, methods, and computer readable media for utilizing quota usage policy control in a Diameter-based communication network. An exemplary method includes, at a policy server, sending a request for quota usage information associated with a subscriber to an online charging system (OCS) node. The method further includes receiving the quota usage information from the OCS node, generating at least one policy and charging control (PCC) rule for modifying a quality of service (QoS) policy attribute associated with the subscriber based on the quota usage information, and communicating the at least one PCC rule to a Diameter network element.
    Type: Application
    Filed: January 7, 2013
    Publication date: July 11, 2013
    Applicant: TEKELEC, INC.
    Inventor: Tekelec, Inc
  • Publication number: 20130171990
    Abstract: The subject matter described herein includes methods, systems, and computer readable media for providing triggerless EIR service in a Diameter network. One method includes steps performed at a Diameter routing agent (DRA). The steps include, receiving a registration or authentication information request at the DRA. The steps further include performing, by the DRA, an EIR lookup in response to the registration or authentication information request message. The method further includes, relaying the registration or authentication information request message to a home subscriber server (HSS) or a home location register (HLR) or responding on behalf of the HSS or HLR based on results of the EIR lookup.
    Type: Application
    Filed: January 25, 2013
    Publication date: July 4, 2013
    Applicant: TEKELEC, INC.
    Inventor: Tekelec, Inc.
  • Publication number: 20130157620
    Abstract: Methods, systems, and computer readable media for seamless roaming between networks are disclosed. According to one aspect, the subject matter described herein includes a method for seamless roaming between networks. The method occurs at a home subscriber server (HSS). The method includes maintaining registration status information for a subscriber. The method also includes communicating with a first network via a first network interface and with a second network via a second network interface using the registration status information to facilitate roaming between the first network and the second network. The first network interface is configured to receive and send non-Diameter signaling messages for managing mobility of the subscriber and the second network interface is configured to receive and send Diameter signaling messages for managing mobility of the subscriber.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 20, 2013
    Applicant: TEKELEC, INC.
    Inventor: Tekelec, Inc.
  • Publication number: 20130151845
    Abstract: The subject matter described herein includes systems, methods, and computer readable media for encrypting Diameter identification information contained in Diameter signaling messages. The system includes a Diameter agent that comprises a network interface configured to receive, from a first Diameter node, a Diameter signaling message that includes Diameter identification information associated with the first Diameter node and a Diameter encryption topology hiding module (ETHM) configured to encrypt the Diameter identification information to generate encrypted Diameter identification information and to replace the Diameter identification information in the Diameter signaling message with the encrypted Diameter identification information. The Diameter agent further includes a routing module configured to route the Diameter signaling message with the encrypted Diameter identification information to a second Diameter node.
    Type: Application
    Filed: December 12, 2012
    Publication date: June 13, 2013
    Applicant: TEKELEC, INC.
    Inventor: Tekelec, Inc.