Abstract: A structure comprised of an InAsSb layer adjacent to a GaSb layer, with the adjacent InAsSb and GaSb layers repeating to form a superlattice (SL). The structure is preferably an unstrained SL, wherein the composition of the InAsSb layer is InAs0.91Sb0.09; the InAs0.91 Sb0.09 layers are preferably lattice-matched to the GaSb layers. The SL structure is preferably arranged such that the Sb component of the InAsSb layers reduces the strain in the SL structure so that it is less than that found in an InAs/GaSb Type-II Strained Layer Superlattice (SLS). The present SL structure is suitably employed as part of an infrared photodetector.

Abstract: A cascode gain stage apparatus includes an input transistor having an RF input node and a transistor output node, an output transistor having a transistor input node and an RF output node, and a DC blocking capacitor connected between the transistor input and transistor output nodes.

Abstract: A self-aligning hybridization method enabling small pixel pitch hybridizations with self-alignment and run-out protection. The method requires providing a first IC, the surface of which includes at least one electrical contact for connection to a mating IC, depositing an insulating layer on the IC's surface, patterning and etching the insulating layer to provide recesses in the insulating layer above each of the electrical contacts, and depositing a deformable conductive material in each of the recesses. A mating IC is provided which includes conductive pins positioned to align with the deformable conductive material in respective ones of the recesses on the first chip. The first and mating ICs are then hybridized by bringing the conductive pins into contact with the deformable conductive material in the recesses, such that the conductive material deforms and the pins make electrical contact with the first IC's electrical contacts.

Abstract: A modular heat shield and heat spreader (“MHS”) includes top and bottom panels, and a plurality of thermally conductive pillars located between the panels and which support the top panel. A continuous pool of liquid between the panels surrounds some portion of the pillars. Heat to which the top panel is exposed is conducted through the top panel and at least some of the pillars. The heat changes the phase of some of the liquid to a vapor, which spreads the heat to an area larger than that of the heat source and thereby dissipates the heat away from the source at a lower heat flux than that associated with the flux from the source. The MHS preferably includes wicking material on some of the pillars and on the underside of the top panel, such that the wicking material is saturated with the liquid and heated by the conducted heat.

Abstract: A heat pipe apparatus having a sintered lattice wick structure includes a plurality of wicking walls having respective length, width and heights and spaced in parallel to wick liquid in a first direction along the respective lengths, the respective lengths being longer than the respective widths and the respective heights, the plurality of wicking walls being adjacent to one another and spaced apart to form vapor vents between them, a plurality of interconnect wicking walls to wick liquid between adjacent wicking walls in a second direction substantially perpendicular to the first direction, and a vapor chamber encompassing the sintered lattice wick structure, the vapor chamber having an interior condensation surface and interior evaporator surface, wherein the plurality of wicking walls and the plurality of interconnect wicking walls are configured to wick liquid in first and second directions and the vapor vents communicate vapor in a direction orthogonal to the first and second directions.