Abstract: A tape laying device includes a tape transmission mechanism, a compaction head mechanism, a cutter mechanism, a heating mechanism and a motion mechanism. The tape transmission mechanism is configured to transmit the pre-impregnated tape. The compaction head mechanism, connected with the tape transmission mechanism, is configured to depress and drive the pre-impregnated tape transmitted by the tape transmission mechanism to follow a moving path so as to adhere the pre-impregnated tape onto the mould surface. The cutter mechanism is configured to cut the pre-impregnated tape. The heating mechanism, disposed downstream to the cutter mechanism, is configured to heat the pre-impregnated tape. The motion mechanism is used to have the cutter mechanism having an active path to move toward the moving path while the cutter mechanism cuts the pre-impregnated tape.

Abstract: A semiconductor device includes a gate structure on a substrate, in which the gate structure includes a main branch extending along a first direction on the substrate and a sub-branch extending along a second direction adjacent to the main branch. The semiconductor device also includes a first doped region overlapping the main branch and the sub-branch according to a top view and a second doped region overlapping the first doped region.

Abstract: A method includes forming a gate stack, which includes a gate dielectric and a metal gate electrode over the gate dielectric. An inter-layer dielectric is formed on opposite sides of the gate stack. The gate stack and the inter-layer dielectric are planarized. The method further includes forming an inhibitor film on the gate stack, with at least a portion of the inter-layer dielectric exposed, selectively depositing a dielectric hard mask on the inter-layer dielectric, with the inhibitor film preventing the dielectric hard mask from being formed thereon, and etching to remove a portion of the gate stack, with the dielectric hard mask acting as a portion of a corresponding etching mask.

Abstract: Disclosed are calibration techniques that can be implemented by a device that conducts biological tests. In certain embodiments, the device for testing a biological specimen includes a receiving mechanism to receive a carrier, a camera module arranged to capture imagery of the carrier, and a processor. Some examples of the processor can detect a calibration mode trigger. In calibration mode, the processor can divide the captured imagery into segments and selectively perform one or more calibration procedures for each segment. Then, the processor records a calibration result for each segment.

Abstract: An induction motor with on-rotor slip power recovery may have a rotor and a stator element. The rotor element has a rotor winding system with a number of winding units wound-distributed for inducing a rotor magnetic field. Each winding unit has an induction and an augmentation subwinding. The induction subwinding has two legs of each a number of induction conductor segments. The induction subwinding induces an emf that drives a rotor current in the rotor winding system to generate a basic induction component for the rotor magnetic field when the induction conductor segments move in the stator element. The augmentation subwinding has two legs of each a number of augmentation conductor segments aligned parallel to the induction conductor segments. The augmentation subwinding being wound that the two legs of augmentation conductor segments are immediately next to each other and positioned mid-way between the two legs of induction conductor segments.

Abstract: An alignment pipeline is arranged on an outer casing and configured to connect to a communication pipe which has a communication pipe axis line. The alignment pipeline includes a pipe body, a connection piece, and a plurality of balls. The pipe body has a pipe body axis line, and includes a first end and a second end opposite to the first end. The first end is configured to connect to the communication pipe. The connection piece surrounds the pipe body, is arranged at the second end, and is movably connected to the outer casing. The plurality of balls is arranged on the connection piece in a rolling and dispersing manner. At least a part of the balls are in contact with the outer casing, so that the connection piece is movable relative to the outer casing along a radial direction of the pipe body axis line.

Abstract: A disclosed semiconductor device includes a package substrate, a first semiconductor die coupled to the package substrate, a package lid attached to the package substrate and covering the semiconductor die, and a thermal interface material located between a top surface of the semiconductor die and an internal surface of the package lid. The semiconductor device may further include a dam formed on the internal surface of the package lid. The dam may constrain the thermal interface material on one or more sides of the first semiconductor die such that the thermal interface material is located within a predetermined volume between the top surface of the first semiconductor die and the internal surface of the package lid during a reflow operation. The package lid may include a metallic material and the dam may include an epoxy material formed as a single continuous structure or may be formed as several disconnected structures.

Abstract: A package structure and a formation method of a package structure are provided. The method includes disposing a chip structure over a substrate and forming a first adhesive element directly on the chip structure. The first adhesive element has a first thermal conductivity. The method also includes forming a second adhesive element directly on the chip structure. The second adhesive element has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The method further includes attaching a protective lid to the chip structure through the first adhesive element and the second adhesive element.

Abstract: A method of fabricating a casing including steps of providing a polycarbonate substrate, printing a first material on the polycarbonate substrate to form a light shielding layer by using a first screen, and printing a second material on the light shielding layer to form a light transmission layer by using a second screen is provided. The light shielding layer has at least one patterned transmissive region. The light transmission layer covers the at least one patterned transmissive region and a portion of polycarbonate substrate exposed by the at least one patterned transmissive region. Mesh counts of the first screen is greater than that of the second screen. A casing including a polycarbonate substrate, a light shielding layer, and a light transmission layer is provided. A thickness of the light transmission layer is greater than a thickness of the light shielding layer. An electronic device adopting the casing is provided.

Abstract: A method of fabricating a casing including steps of providing a polycarbonate substrate, printing a first material on the polycarbonate substrate to form a light shielding layer by using a first screen, and printing a second material on the light shielding layer to form a light transmission layer by using a second screen is provided. The light shielding layer has at least one patterned transmissive region. The light transmission layer covers the at least one patterned transmissive region and a portion of polycarbonate substrate exposed by the at least one patterned transmissive region. Mesh counts of the first screen is greater than that of the second screen. A casing including a polycarbonate substrate, a light shielding layer, and a light transmission layer is provided. A thickness of the light transmission layer is greater than a thickness of the light shielding layer. An electronic device adopting the casing is provided.

Abstract: The invention provides an adhesive composition. The adhesive composition includes a halohydrin compound, a blocked isocyanate compound and latex, in which the adhesive composition does not include resorcinol, formaldehyde and epoxy compound. The invention also provides a method for treating organic fiber. The method includes impregnating an organic fiber or a fabric with the abovementioned adhesive composition; and drying the organic fiber or the fabric.

Abstract: A fund transaction platform includes a transaction database, a receiving module, a processing module and a transmitting module. The receiving module respectively receives a fund borrowing information from a fund borrower end and a plurality of investing information corresponding to the fund borrowing information from investor ends through a network. The processing module determines bid winning investor ends from the investor ends according to the fund borrowing information and the plurality of investing information, and produces a transaction formed information. The transmitting module respectively transmits the transaction formed information to the fund borrower end and each the bid winning investor ends through the network. The investor ends can freely determine the fund transaction conditions to conduct peer-to-peer lending on the fund transaction platform of the present application, so that the targets of financial inclusion are achieved.

Abstract: An adjusting mechanism has a longitudinal axis, a lateral axis, a first assembling component, a second assembling component, a worm assembly, a ratchet component, and a knob. The longitudinal axis and the lateral axis are perpendicular to each other. The second assembling component is pivotally mounted to the first assembling component and is able to swing along the longitudinal axis. The worm assembly is mounted to the first assembling component, is able to rotate along the lateral axis, and has a thread twisting along the lateral axis. The ratchet component is mounted to the first assembling component, is able to rotate along the longitudinal axis, is connected to the second assembling component, and has a toothed portion with multiple engaging teeth parallel with the longitudinal axis engaging with the thread of the worm assembly. The knob is mounted to the worm assembly and is rotatable with the worm assembly.

Abstract: A quality of service control system includes an input device, a processing unit and an output device. The input device receives a packet. The processing unit obtains an Internet Protocol (IP) version and adds at least one extension column in an undefined IP header, so as to generate a quality of service control packet. The output device transmits the quality of service control packet. Similarly, an input device receives the quality of service control packet and achieves the effect of transmitting the packet with higher priority, determining a transmission rate and keeping data accessed for a specific time according to a packet rate control parameter configuration in the quality of service control packet.

Abstract: A multi-band antenna includes a circuit board having an insulation dielectric layer, a first ground plane and an impedance matching circuit formed on a first plane of the circuit board, and a second ground plane formed on a second plane of the circuit board. A slot antenna radiation main body, formed at a location of the second ground plane and corresponding to the exposed part of the insulation dielectric layer, includes first and second radiation main bodies. The first radiation main body includes a first impedance matching part and a first resonance part. The second radiation main body includes a second impedance matching part and a second resonance part. The first resonance part includes a plurality of first bends, a first segment, and a second segment. The second resonance part includes a plurality of second bends, a third segment, and a fourth segment.

Abstract: A wideband antenna structure is disclosed. The wideband antenna is disposed on a printed circuit board, and includes a substrate, a first ground sheet, a main radiator and a parasitic element. The substrate has a first surface and a second surface opposite to the first surface. The first surface includes a first antenna area and a first grounding area connected to the first antenna area. The first antenna area has a first side along a first direction, a second side along a second direction, a third side opposite to the first side and a fourth side opposite to the second side. The first grounding sheet is disposed in the first grounding area, and next to the first, the second and the third sides. The main radiator is disposed in the first antenna area, and includes a feeding point near the second side; a first radiator extending from the feeding point along the first direction to a turning point; and a second radiator extending from the turning point toward the third side along the second direction.

Abstract: An aspect of the present invention relates to a method and system of providing a bed using a plurality of interchangeable adjustable firmness springs to provide localized comfort and support to the user of the bed. The plurality of interchangeable springs may have a plurality of different firmnesses to provide customizable local comfort to a user. The foam springs are color coded based on the firmness associated with the foam spring. The foam springs have markings and/or health devices attached to an end of the foam spring.

Abstract: Disclosed herein are an apparatus and a method of video pre-processing for motion estimation, the apparatus comprising a similarity description module, a storage module, a verdict module, and a motion estimation module. The similarity description module receives a first image in a video, the first image consisting of first blocks, and calculates the similarity descriptors of every first block and a second block of a second image in the video. The second block corresponds to a reference block among the first blocks. The similarity descriptor of each block, which corresponds to a pixel matrix, indicates whether the pixel values of at least one pair of adjacent pixels in the pixel matrix are identical. The verdict module determines whether the similarity descriptors of the second and reference blocks are identical and reaches a verdict, whereby motion estimation is selectively performed on the second block.

Abstract: A multi-band antenna includes a circuit board having an insulation dielectric layer, a first ground plane and an impedance matching circuit formed on a first plane of the circuit board, and a second ground plane formed on a second plane of the circuit board. A slot antenna radiation main body, formed at a location of the second ground plane and corresponding to the exposed part of the insulation dielectric layer, includes first and second radiation main bodies. The first radiation main body includes a first impedance matching part and a first resonance part. The second radiation main body includes a second impedance matching part and a second resonance part. The first resonance part includes a plurality of first bends, a first segment, and a second segment. The second resonance part includes a plurality of second bends, a third segment, and a fourth segment.

Abstract: The disclosure is related to a printed coupled-fed multi-band antenna, and a related electronic system. The antenna includes a first antenna member structurally with a mushroom-shaped radiation portion and an antenna connection portion being electrically connected with a ground plane. The mushroom-shaped radiation portion is employed to activate first band electromagnetic wave. The antenna includes a second antenna member, which may be shaped as a U-shaped radiation portion. The second antenna member is floating within a region surrounded by the mushroom-shaped radiation portion, the antenna connection portion and the ground plane. The U-shaped radiation portion is coupled with both the ground plane and the mushroom-shaped radiation portion. The coupling effect allows the second antenna member to activate a second band electromagnetic wave. The multiple band signaling paths are formed over the printed antenna for application of a multi-band antenna.