Abstract: A Time-of-Flight (ToF) ranging device and a ToF ranging method are provided. The ToF ranging device includes a signal processor, a light emitter, and a light sensor. The light emitter sequentially emits a plurality of intense pulsed lights to a sensing target. The light sensor sequentially receives the plurality of intense pulsed lights reflected by the sensing target to correspondingly output a plurality of pixel voltage signals. The signal processor generates a plurality of read-out voltage signals according to the plurality of pixel voltage signals. The signal processor compares the plurality of read-out voltage signals with a plurality of count signals to obtain a plurality of count values. The signal processor calculates an average value of the plurality of count values and determines a distance between the ToF ranging device and the sensing target according to the average value.

Abstract: A multimedia system applying ToF ranging and its operating method are provided. The multimedia system includes a plurality of electronic devices. Each of the electronic devices includes a processing module, a ToF module, and a communication module. The ToF module is configured to perform a ToF operation. The communication module is configured to perform wireless communication. The electronic devices communicate via respective communication modules to formulate an operation protocol and respective UIDs and to perform a time slot synchronization between different electronic devices. The electronic devices sequentially perform the ToF ranging operation according to the operation protocol and the respective UIDs.

Abstract: A method for manufacturing an optical sensor is provided. The operations of the method for manufacturing the optical sensor includes providing a semiconductive layer having an electrical circuit area and an optical sensing area; forming a first electrical contact directly over the electrical circuit area; forming a first light guiding part directly over the optical sensing area simultaneously with forming the first electrical contact; forming a first metal layer directly over the first electrical contact; forming a second light guiding part directly over the first light guiding part simultaneously with forming a second electrical contact directly over the first electrical contact; forming a thick metal layer over the electrical circuit area and an optical sensing area; and forming an aperture in the thick metal layer, wherein the aperture aligning with the optical sensing area.

Abstract: An image sensor with a distance sensing function and an operating method thereof are provided. The image sensor includes a pixel array, a cluster analog to digital converter readout circuit, and a column readout circuit. The pixel array includes a plurality of sub-pixel groups arranged in an array. The plurality of sub-pixel groups are spaced apart from each other by a circuit layout area. The cluster analog to digital converter readout circuit is disposed in the circuit layout area of the pixel array. A distance sensing pixel of each of the plurality of sub-pixel groups is configured to perform time-of-flight ranging. The column readout circuit is disposed adjacent to the pixel array. A plurality of image sensing pixels of each of plurality of the sub-pixel groups are configured to perform image sensing.

Abstract: A multimedia system applying ToF ranging and its operating method are provided. The multimedia system includes a plurality of electronic devices. Each of the electronic devices includes a processing module, a ToF module, and a communication module. The ToF module is configured to perform a ToF operation. The communication module is configured to perform wireless communication. The electronic devices communicate via respective communication modules to formulate an operation protocol and respective UIDs and to perform a time slot synchronization between different electronic devices. The electronic devices sequentially perform the ToF ranging operation according to the operation protocol and the respective UIDs.

Abstract: A ToF ranging module, its operating method, and a multimedia system are provided. The ToF ranging module has an optical communication function and is adapted to be disposed on an electronic device communicating with another electronic device through a wireless communication module to synchronize ToF ranging periods and optical communication periods of the two electronic devices and determine a communication order of the two electronic devices. The ToF ranging module includes a processing unit, a light sensing unit, and a light emitting unit. During the ToF ranging period, the processing unit drives the light emitting unit and the light sensing unit to perform ToF ranging to obtain distance data between the two electronic devices. During the optical communication period, the processing unit outputs the distance data and drives the light sensing unit or the light emitting unit to optically communicate with another ToF ranging module of the another electronic device.

Abstract: An image sensor with a distance sensing function and an operating method thereof are provided. The image sensor includes a pixel array, a cluster analog to digital converter readout circuit, and a column readout circuit. The pixel array includes a plurality of sub-pixel groups arranged in an array. The plurality of sub-pixel groups are spaced apart from each other by a circuit layout area. The cluster analog to digital converter readout circuit is disposed in the circuit layout area of the pixel array. A distance sensing pixel of each of the plurality of sub-pixel groups is configured to perform time-of-flight ranging. The column readout circuit is disposed adjacent to the pixel array. A plurality of image sensing pixels of each of plurality of the sub-pixel groups are configured to perform image sensing.

Abstract: A sensing device including a semiconductor substrate, a filtering structure and a sensing structure is provided. The semiconductor substrate has a sample excitation region and an optical sensor region. The optical sensor region laterally encircles the sample excitation region. The filtering structure is embedded in the semiconductor substrate. The filtering structure is located in the sample excitation region and has a sample containing portion. The sample containing portion is adapted to contain a sample and receive an excitation beam. The sensing structure is embedded in the semiconductor substrate. At least a portion of the sensing structure is disposed in the optical sensor region and the sensing structure at least laterally encircles the filtering structure.

Abstract: A time-of-flight ranging sensor and a time-of-flight ranging method are provided. The time-of-flight ranging sensor includes a signal processing circuit, a light emitter, and a light sensor. The light emitter emits a pulsed light having a first polarization direction to a sensing target. The light sensor senses the pulsed light reflected by the sensing target to output a first sensing signal via a first sub-pixel repeating unit and output a second sensing signal via a second sub-pixel repeating unit to the signal processing circuit. The signal processing circuit determines a pulse signal according to the first sensing signal and the second sensing signal, and the signal processing circuit determines a depth information of the sensing target according to the pulsed light and the pulse signal.

Abstract: A Time-of-Flight (ToF) ranging device and a ToF ranging method are provided. The ToF ranging device includes a signal processor, a light emitter, and a light sensor. The light emitter sequentially emits a plurality of intense pulsed lights to a sensing target. The light sensor sequentially receives the plurality of intense pulsed lights reflected by the sensing target to correspondingly output a plurality of pixel voltage signals. The signal processor generates a plurality of read-out voltage signals according to the plurality of pixel voltage signals. The signal processor compares the plurality of read-out voltage signals with a plurality of count signals to obtain a plurality of count values. The signal processor calculates an average value of the plurality of count values and determines a distance between the ToF ranging device and the sensing target according to the average value.

Abstract: A sensing apparatus adapted to detect samples is provided. The sensing apparatus includes a light source, a light-penetrating medium, a metal thin film, and a plurality of sensors. The light source is adapted to provide a light beam. The light-penetrating medium has an optical surface. The metal thin film is disposed on the optical surface of the light-penetrating medium. The samples are adapted to be placed on the metal thin film. After the light beam enters the light-penetrating medium from a side away from the optical surface, the light beam is adapted to be totally internally reflected at the optical surface, such that surface plasmon resonance occurs at a surface of the metal thin film to excite the samples. The samples are adapted to emit signal light beams after being excited. The plurality of sensors are adapted to sense the signal light beams. The metal thin film is disposed between the plurality of sensors and the light-penetrating medium.

Abstract: A method for manufacturing an optical sensor is provided. The operations of the method for manufacturing the optical sensor includes providing a semiconductive layer having an electrical circuit area and an optical sensing area; forming a first electrical contact directly over the electrical circuit area; forming a first light guiding part directly over the optical sensing area simultaneously with forming the first electrical contact; forming a first metal layer directly over the first electrical contact; forming a second light guiding part directly over the first light guiding part simultaneously with forming a second electrical contact directly over the first electrical contact; forming a thick metal layer over the electrical circuit area and an optical sensing area; and forming an aperture in the thick metal layer, wherein the aperture aligning with the optical sensing area.

Abstract: Some embodiments of the present disclosure provide an optical sensor. The optical sensor includes a semiconductive substrate; a light sensing region on the semiconductive substrate; a waveguide region configured to guide light from a wave insert portion through a waveguide portion and to a sample holding portion; and an interconnect region below the waveguide region, and the interconnect region being disposed above the light sensing region. The waveguide portion includes a first dielectric layer comprising a first refractive index and at least one second dielectric layer comprising a second refractive index, wherein the second refractive index is smaller than the first refractive index.

Abstract: A sensing device including a semiconductor substrate, a filtering structure and a sensing structure is provided. The semiconductor substrate has a sample excitation region and an optical sensor region. The optical sensor region laterally encircles the sample excitation region. The filtering structure is embedded in the semiconductor substrate. The filtering structure is located in the sample excitation region and has a sample containing portion. The sample containing portion is adapted to contain a sample and receive an excitation beam. The sensing structure is embedded in the semiconductor substrate. At least a portion of the sensing structure is disposed in the optical sensor region and the sensing structure at least laterally encircles the filtering structure.

Abstract: A sensing apparatus adapted to detect samples is provided. The sensing apparatus includes a light source, a light-penetrating medium, a metal thin film, and a plurality of sensors. The light source is adapted to provide a light beam. The light-penetrating medium has an optical surface. The metal thin film is disposed on the optical surface of the light-penetrating medium. The samples are adapted to be placed on the metal thin film. After the light beam enters the light-penetrating medium from a side away from the optical surface, the light beam is adapted to be totally internally reflected at the optical surface, such that surface plasmon resonance occurs at a surface of the metal thin film to excite the samples. The samples are adapted to emit signal light beams after being excited. The plurality of sensors are adapted to sense the signal light beams. The metal thin film is disposed between the plurality of sensors and the light-penetrating medium.

Abstract: Some embodiments of the present disclosure provide an optical sensor. The optical sensor includes a semiconductive block having a front side and a back side, a wave guide region, and a light sensing region. The wave guide region is positioned over the back side of the semiconductive block and having a core layer. The wave guide region is configured to guide an incident light. The light sensing region is positioned in the semiconductive block, having a multi-junction photodiode. The light sensing region is configured to sense emission lights from the wave guide region.

Abstract: An optical sensing module is configured to detect a characteristic of a sample. The optical sensing module includes a light source, a light guide plate, a first cladding layer, a light converging layer, a filter layer, and a plurality of sensors. The light source is configured to provide an exciting beam. Positions of the sensors correspond to positions of the holes. After the exciting beam enters the light guide plate, at least one portion of the exciting beam is transmitted to the sample through a portion of the surface of the light guide plate exposed by the holes, the sample is excited by the exciting beam to emit a signal beam, and the signal beam passes through the light converging layer and the filter layer in an order and travels to the sensors. Another optical sensing module is also provided.

Abstract: Some embodiments of the present disclosure provide an optical sensor. The optical sensor includes a semiconductive substrate; a light sensing region on the semiconductive substrate; a waveguide region configured to guide light from a wave insert portion through a waveguide portion and to a sample holding portion; and an interconnect region below the waveguide region, and the interconnect region being disposed above the light sensing region. The waveguide portion includes a first dielectric layer comprising a first refractive index and at least one second dielectric layer comprising a second refractive index, wherein the second refractive index is smaller than the first refractive index.

Abstract: An optical sensing module is configured to detect a characteristic of a sample. The optical sensing module includes a light source, a light guide plate, a first cladding layer, a light converging layer, a filter layer, and a plurality of sensors. The light source is configured to provide an exciting beam. Positions of the sensors correspond to positions of the holes. After the exciting beam enters the light guide plate, at least one portion of the exciting beam is transmitted to the sample through a portion of the surface of the light guide plate exposed by the holes, the sample is excited by the exciting beam to emit a signal beam, and the signal beam passes through the light converging layer and the filter layer in an order and travels to the sensors. Another optical sensing module is also provided.

Abstract: Some embodiments of the present disclosure provide an optical sensor. The optical sensor includes a semiconductive substrate. A light sensing region is on the semiconductive substrate. A waveguide region is configured to guide light from a wave insert portion through a waveguide portion and to a sample holding portion. The waveguide portion includes a first dielectric layer including a first refractive index. A second dielectric layer includes a second refractive index. The second refractive index is smaller than the first refractive index. A first interconnect portion is positioned in the waveguide portion, configured to transmit electrical signal from the light sensing region to an external circuit. The sample holding portion is over the light sensing region.