Patents by Inventor Teng-Fang Kou

Teng-Fang Kou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHAMBERS AND COATINGS FOR REDUCING BACKSIDE DAMAGE
    Publication number: 20230077578
    Abstract: Methods of semiconductor processing may include forming a plasma of a carbon-containing material within a processing region of a semiconductor processing chamber. The methods may include depositing a carbon-containing material on a backside of a substrate housed within the processing region of the semiconductor processing chamber. A front side of the substrate may be maintained substantially free of carbon-containing material. The methods may include performing an etch process on the front-side of the substrate. The methods may include removing the carbon-containing material from the backside of the substrate.
    Type: Application
    Filed: September 13, 2021
    Publication date: March 16, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Leonard M. Tedeschi, Kartik Ramaswamy, Benjamin CE Schwarz, Changgong Wang, Vahid Firouzdor, Sumanth Banda, Teng-Fang Kou