Abstract: The invention relates to a light emitting device comprising: a support, at least two light-emitting elements at a top side of the support, first connection locations and a single second connection location at a bottom side of the support, wherein each light-emitting element comprises a first contact location and a second contact location at a side facing away from the support, each first contact location is connected to one of the first connection locations via a first connection, all of the second contact locations are connected to the second connection location via a second connection, the first connections run along an outer surface of the support, and the second connection runs through the support.

Abstract: A method of producing optoelectronic semiconductor devices includes in the stated order: A) providing a semiconductor layer sequence on a transparent wafer, the semiconductor layer sequence including an active layer; B) applying electrical contact pads on a mounting face of the semiconductor layer sequence; C) coating the semiconductor layer sequence at the mounting face and/or on the electrical contact pads with a protective layer; D) dicing the semiconductor layer sequence and the wafer to form semiconductor chips with side faces; E) forming a casting body all around the semiconductor chips directly on the side faces, the protective layer having anti-wetting properties towards a material of the casting body; and F) dicing the casting body to the optoelectronic semiconductor devices, wherein the protective layer remains on the mounting face and/or on the electrical contact pads in the finished optoelectronic semiconductor devices.

Abstract: A method of producing optoelectronic semiconductor devices includes in the stated order: A) providing a semiconductor layer sequence on a transparent wafer, the semiconductor layer sequence including an active layer; B) applying electrical contact pads on a mounting face of the semiconductor layer sequence; C) coating the semiconductor layer sequence at the mounting face and/or on the electrical contact pads with a protective layer; D) dicing the semiconductor layer sequence and the wafer to form semiconductor chips with side faces; E) forming a casting body all around the semiconductor chips directly on the side faces, the protective layer having anti-wetting properties towards a material of the casting body; and F) dicing the casting body to the optoelectronic semiconductor devices, wherein the protective layer remains on the mounting face and/or on the electrical contact pads in the finished optoelectronic semiconductor devices.

Abstract: The invention relates to a light emitting device comprising: a support, at least two light-emitting elements at a top side of the support, first connection locations and a single second connection location at a bottom side of the support, wherein each light-emitting element comprises a first contact location and a second contact location at a side facing away from the support, each first contact location is connected to one of the first connection locations via a first connection, all of the second contact locations are connected to the second connection location via a second connection, the first connections run along an outer surface of the support, and the second connection runs through the support.