Patents by Inventor Teng Hock Kuah
Teng Hock Kuah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240262019Abstract: A molding apparatus includes a mold and a wedge structure. The mode has a first mold member and a second mold member configured to be movable towards the first mold member along a first direction, the first and second mold members cooperating in use to form a molding cavity for encapsulating an electronic component. The wedge structure has a first wedge member attached to the second mold member and a second wedge member configured to be in contact with the first wedge member and movable in a second direction perpendicular to the first direction to adjust contacting portions between a first contacting surface of the first wedge member and a second contacting surface of the second wedge member, thereby biasing the second mold member towards the first mold member to form the molding cavity, wherein at least one of the first and second contacting surfaces includes a first protection film attached thereon.Type: ApplicationFiled: February 8, 2023Publication date: August 8, 2024Inventors: Teng Hock KUAH, Kai Yew LEE, Ji Yuan HAO, Jian Jun CHEN, Yi LIN
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Patent number: 11955347Abstract: One or more electronic devices that are mounted on a substrate, including at least one cooling plate in contact with the one or more electronic devices, are encapsulated. The substrate is clamped between a first mold half and a second mold half which define a molding cavity for molding the one or more electronic devices. A cavity insert movably located in the first mold half is projected into the cavity in order to contact and apply a sealing pressure onto the at least one cooling plate. After introducing a molding compound into the cavity at a first fill pressure, the molding compound in the cavity is packed by applying a second fill pressure which is higher than the first fill pressure. During this time, the sealing pressure is maintained at values that are higher than the first fill pressure and the second fill pressure.Type: GrantFiled: December 2, 2021Date of Patent: April 9, 2024Assignee: ASMPT SINGAPORE PTE. LTD.Inventors: Teng Hock Kuah, Yi Lin, Ravindra Raghavendra, Kar Weng Yan, Angelito Barrozo Perez
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Publication number: 20240030181Abstract: A sintering apparatus for simultaneously sintering an electronic device onto a substrate, and a metallic sheet onto the electronic device includes a sinter tool and a compressible film positionable onto the metallic sheet and the electronic device. A thickness of the compressible film is greater than a height of the metallic sheet. The compressible film is adapted to conform to a shape of the metallic sheet and the electronic device to simultaneously cover the metallic sheet and at least a part of the electronic device when the sinter tool applies a sintering force onto the compressible film during a sintering process.Type: ApplicationFiled: July 22, 2022Publication date: January 25, 2024Inventors: Jiapei DING, Teng Hock KUAH, Bin YUAN, Yi LIN, Jian LIAO
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Patent number: 11676937Abstract: An apparatus having a seal plate which includes rigid hard portions and one or more flexible soft portions located between the hard portions is used for bonding at least one semiconductor device onto a substrate that is supported on a platform. The seal plate is movable between a first position which is spaced from the substrate and a second position whereat a first side of the seal plate is configured to be in contact with the substrate. A diaphragm covers a second side of the seal plate opposite to the first side. A fluid pressure generator exerts a fluid pressure onto the diaphragm to actuate the diaphragm to compress the one or more soft portions to transmit a bonding force onto the at least one semiconductor device during bonding.Type: GrantFiled: May 4, 2021Date of Patent: June 13, 2023Assignee: ASMPT SINGAPORE PTE. LTD.Inventors: Jiapei Ding, Rolan Ocuaman Camba, Teng Hock Kuah, Jian Liao, Kar Weng Yan
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Publication number: 20230178382Abstract: One or more electronic devices that are mounted on a substrate, including at least one cooling plate in contact with the one or more electronic devices, are encapsulated. The substrate is clamped between a first mold half and a second mold half which define a molding cavity for molding the one or more electronic devices. A cavity insert movably located in the first mold half is projected into the cavity in order to contact and apply a sealing pressure onto the at least one cooling plate. After introducing a molding compound into the cavity at a first fill pressure, the molding compound in the cavity is packed by applying a second fill pressure which is higher than the first fill pressure. During this time, the sealing pressure is maintained at values that are higher than the first fill pressure and the second fill pressure.Type: ApplicationFiled: December 2, 2021Publication date: June 8, 2023Inventors: Teng Hock KUAH, Yi LIN, Ravindra RAGHAVENDRA, Kar Weng YAN, Angelito Barrozo PEREZ
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Patent number: 11621181Abstract: A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate. First and second pots have plungers for compressing molding compound placed therein. First and second runners connect the first and second pots to the first and second sections of the molding cavity for introducing the molding compound onto both sides of the substrate. In particular, the runners extend at least from an edge of the substrate along both sides of the substrate to the molding cavity.Type: GrantFiled: May 5, 2020Date of Patent: April 4, 2023Assignee: ASMPT SINGAPORE PTE. LTD.Inventors: Teng Hock Kuah, Yi Lin, Kar Weng Yan, Perez Angelito Barrozo
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Patent number: 11548273Abstract: After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.Type: GrantFiled: January 31, 2020Date of Patent: January 10, 2023Assignee: ASMPT SINGAPORE PTE. LTD.Inventors: Ji Yuan Hao, Patrocinio Jr Go Torres, Teng Hock Kuah, Kai Wu, Moung Kai Kong
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Publication number: 20220359459Abstract: An apparatus having a seal plate which includes rigid hard portions and one or more flexible soft portions located between the hard portions is used for bonding at least one semiconductor device onto a substrate that is supported on a platform. The seal plate is movable between a first position which is spaced from the substrate and a second position whereat a first side of the seal plate is configured to be in contact with the substrate. A diaphragm covers a second side of the seal plate opposite to the first side. A fluid pressure generator exerts a fluid pressure onto the diaphragm to actuate the diaphragm to compress the one or more soft portions to transmit a bonding force onto the at least one semiconductor device during bonding.Type: ApplicationFiled: May 4, 2021Publication date: November 10, 2022Inventors: Jiapei DING, Rolan Ocuaman CAMBA, Teng Hock KUAH, Jian LIAO, Kar Weng YAN
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Patent number: 11227779Abstract: The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion.Type: GrantFiled: September 12, 2017Date of Patent: January 18, 2022Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Jiapei Ding, Kar Weng Yan, Teng Hock Kuah, Jian Liao, Keng Yew Song, Bin Yuan, Deivasigamani Mouleeswaran
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Publication number: 20210351049Abstract: A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate. First and second pots have plungers for compressing molding compound placed therein. First and second runners connect the first and second pots to the first and second sections of the molding cavity for introducing the molding compound onto both sides of the substrate. In particular, the runners extend at least from an edge of the substrate along both sides of the substrate to the molding cavity.Type: ApplicationFiled: May 5, 2020Publication date: November 11, 2021Inventors: Teng Hock KUAH, Yi LIN, Kar Weng YAN, Perez ANGELITO BARROZO
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Publication number: 20210237422Abstract: After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.Type: ApplicationFiled: January 31, 2020Publication date: August 5, 2021Inventors: Ji Yuan HAO, Patrocinio Jr Go TORRES, Teng Hock KUAH, Kai WU, Moung Kai KONG
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Patent number: 10960583Abstract: A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising a first mold chase with a first mold chase surface and a second mold chase with a second mold chase surface opposite to the first mold chase surface, the first and second mold chase surfaces being operative to clamp onto the substrate and to apply a clamping pressure thereto. The molding system further comprises a first sensor located at a first position for determining a first relative distance between the substrate and a mold chase facing the substrate at the first position, and a second sensor located at a second position for determining a second relative distance between the substrate and a mold chase facing the substrate at the second position.Type: GrantFiled: July 19, 2016Date of Patent: March 30, 2021Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Shu Chuen Ho, Choon Hong Cheong, Chin Guan Ong, Kai Wu, Teng Hock Kuah, Ji Yuan Hao
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Publication number: 20190080939Abstract: The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion.Type: ApplicationFiled: September 12, 2017Publication date: March 14, 2019Inventors: Jiapei DING, Kar Weng YAN, Teng Hock KUAH, Jian LIAO, Keng Yew SONG, Bin YUAN, Deivasigamani MOULEESWARAN
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Publication number: 20190006339Abstract: An integrated fan-out wafer level package houses a semiconductor package having a first semiconductor die encapsulated by a dielectric compound. A plurality of redistribution layers are formed on a first side of the semiconductor package which are in electrical contact with contact pads of the first semiconductor die. A plurality of solder balls located on the first side of the semiconductor package is electrically connected to the contact pads of the semiconductor die via the redistribution layers. A second semiconductor die is further attached to the first side of the semiconductor package and is electrically connected to the contact pads of the first semiconductor die via the redistribution layers.Type: ApplicationFiled: June 28, 2017Publication date: January 3, 2019Inventors: Hon Shing, John LAU, Ming LI, Chun Ho FAN, Teng Hock KUAH, Qingqian LI
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Patent number: 10115579Abstract: During the manufacture of a semiconductor package, a semiconductor wafer including a plurality of bond pads on a surface of the wafer is provided and the surface of the wafer is covered with a dielectric material to form a dielectric layer over the bond pads. Portions of the dielectric layer corresponding to positions of the bond pads are removed to form a plurality of wells, wherein each well is configured to form a through-hole between top and bottom surfaces of the dielectric layer for exposing each bond pad. A conductive material is then deposited into the wells to form a conductive layer between the bond pads and a top surface of the dielectric layer. Thereafter, the semiconductor wafer is singulated to form a plurality of semiconductor packages.Type: GrantFiled: November 17, 2017Date of Patent: October 30, 2018Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Chun Ho Fan, Teng Hock Kuah
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Publication number: 20180151342Abstract: During the manufacture of a semiconductor package, a semiconductor wafer including a plurality of bond pads on a surface of the wafer is provided and the surface of the wafer is covered with a dielectric material to form a dielectric layer over the bond pads. Portions of the dielectric layer corresponding to positions of the bond pads are removed to form a plurality of wells, wherein each well is configured to form a through-hole between top and bottom surfaces of the dielectric layer for exposing each bond pad. A conductive material is then deposited into the wells to form a conductive layer between the bond pads and a top surface of the dielectric layer. Thereafter, the semiconductor wafer is singulated to form a plurality of semiconductor packages.Type: ApplicationFiled: November 17, 2017Publication date: May 31, 2018Inventors: Chun Ho FAN, Teng Hock KUAH
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Publication number: 20180117813Abstract: The invention provides a molding apparatus comprising a first mold part operative to hold a semiconductor substrate, and a second mold part having a main surface facing the first mold part. The first and second mold parts are movable relative to each other between an open arrangement and a closed arrangement. The main surface comprises portions defining a mold cavity, and a recess at least partially surrounding the mold cavity. The main surface also comprises a compressible structure located within the recess, wherein at least a portion of the compressible structure extends out of the recess towards the first mold part and is compressible into the recess when the compressible structure contacts the semiconductor substrate in the closed arrangement. The second mold part also comprises one or more air conduits operative to introduce compressed air into the mold cavity.Type: ApplicationFiled: November 2, 2016Publication date: May 3, 2018Inventors: Shu Chuen HO, Teng Hock KUAH, Jiapei DING, Jian Xiong SU, Ravindra RAGHAVENDRA
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Patent number: 9947561Abstract: A semiconductor encapsulation apparatus for encapsulating a semiconductor device on a substrate, the apparatus comprising a mold comprising a cavity pressure zone that is configured to be at a molding process pressure during molding, a base vacuum pump conduit connecting a base vacuum pump to the cavity pressure zone, a base vacuum valve located along the base vacuum pump conduit such that the base vacuum pump is in fluid communication with the cavity pressure zone when the base vacuum valve is open, a reservoir vacuum pump conduit connecting a reservoir vacuum pump to the base vacuum pump conduit, and a reservoir vacuum valve located along the reservoir vacuum pump conduit such that the reservoir vacuum pump is in fluid communication with the base vacuum pump conduit when the reservoir vacuum valve is open.Type: GrantFiled: March 7, 2016Date of Patent: April 17, 2018Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Teng Hock Kuah, Chee Toh Teh, Shu Chuen Ho, Kai Wu, Chin Chong Lee
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Publication number: 20180021993Abstract: A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising a first mold chase with a first mold chase surface and a second mold chase with a second mold chase surface opposite to the first mold chase surface, the first and second mold chase surfaces being operative to clamp onto the substrate and to apply a clamping pressure thereto. The molding system further comprises a first sensor located at a first position for determining a first relative distance between the substrate and a mold chase facing the substrate at the first position, and a second sensor located at a second position for determining a second relative distance between the substrate and a mold chase facing the substrate at the second position.Type: ApplicationFiled: July 19, 2016Publication date: January 25, 2018Inventors: Shu Chuen HO, Choon Hong CHEONG, Chin Guan ONG, Kai WU, Teng Hock KUAH, Ji Yuan HAO
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Publication number: 20170252954Abstract: A semiconductor encapsulation apparatus for encapsulating a semiconductor device on a substrate, the apparatus comprising a mold comprising a cavity pressure zone that is configured to be at a molding process pressure during molding, a base vacuum pump conduit connecting a base vacuum pump to the cavity pressure zone, a base vacuum valve located along the base vacuum pump conduit such that the base vacuum pump is in fluid communication with the cavity pressure zone when the base vacuum valve is open, a reservoir vacuum pump conduit connecting a reservoir vacuum pump to the base vacuum pump conduit, and a reservoir vacuum valve located along the reservoir vacuum pump conduit such that the reservoir vacuum pump is in fluid communication with the base vacuum pump conduit when the reservoir vacuum valve is open.Type: ApplicationFiled: March 7, 2016Publication date: September 7, 2017Inventors: Teng Hock KUAH, Chee Toh TEH, Shu Chuen HO, Kai WU, Chin Chong LEE