Abstract: In an embodiment, a slim imager is disclosed. The slim imager includes a substrate including an aperture, an image sensor, and an optics unit. The image sensor is on a bottom side of the substrate, spans the aperture, and has an aperture-facing top surface. The optics unit is on a top side of the substrate, spans the aperture, and includes a transmissive optical element having an aperture-facing bottom surface. A volume partially bound by the aperture-facing top surface and the aperture-facing bottom surface has a refractive index less than 1.01 at visible wavelengths.

Abstract: A method for forming a lens barrel includes aligning each of a plurality of upper apertures of an upper wafer to (i) a respective one of a plurality of middle apertures of a middle wafer and (ii) a respective one of a plurality of lower apertures of a lower wafer. The middle wafer is between the upper wafer and the lower wafer. The method also includes bonding the middle wafer to the upper wafer to form a lens barrel wafer. Each triad of co-aligned upper, middle, and lower apertures forms a wafer aperture spanning between a top surface of the upper wafer and a bottom surface of the lower wafer. Each upper aperture has a respective upper width and each middle aperture has a respective middle width less than the respective upper width to form, in each triad, a ledge for supporting a lens in the upper aperture.

Abstract: A cover-glass-free array camera with individually light-shielded cameras includes an image sensor array having a plurality of photosensitive pixel arrays formed in a silicon substrate, and a lens array bonded to the silicon substrate, wherein the lens array includes (a) a plurality of imaging objectives respectively registered to the photosensitive pixel arrays to form respective individual cameras therewith, and (b) a first opaque material between each of the imaging objectives to prevent crosstalk between individual cameras.

Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.

Abstract: In an embodiment, a slim imager is disclosed. The slim imager includes a substrate including an aperture, an image sensor, and an optics unit. The image sensor is on a bottom side of the substrate, spans the aperture, and has an aperture-facing top surface. The optics unit is on a top side of the substrate, spans the aperture, and includes a transmissive optical element having an aperture-facing bottom surface. A volume partially bound by the aperture-facing top surface and the aperture-facing bottom surface has a refractive index less than 1.01 at visible wavelengths.

Abstract: Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner and outer dams. The device may further include an optics system including a lens and an adhesive positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of the inner and outer dams. The trench may be dimensioned to receive a portion of the excess adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, laterally confining the excess adhesive and reducing lateral bleeding of the adhesive.

Abstract: A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the glue gate and the lens plate. The glue ring is between the spacer ring and the top surface and has (i) an outer region between the top surface and a bottom surface of the spacer base, and (ii) an inner region, having an inner thickness, between the top surface and a bottom surface of the glue gate. The lens plate, the spacer ring, the glue ring, and the top surface form a sealed cavity having a cavity height equal to at least a sum of the inner thickness, the gate height, and the base height.

Abstract: A method for forming an image sensor device is provided. First, a lens is provided and a first sacrificial element is formed thereon. An electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens. A peripheral region of the selected portion of the lens remains exposed. A light-shielding layer is formed on the electromagnetic interference pattern, second sacrificial element, and peripheral region of the selected portion of the lens. The second sacrificial element and light-shielding pattern are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Abstract: A method for forming an image sensor device is provided. First, a lens is provided and a first sacrificial element is formed thereon. An electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens. A peripheral region of the selected portion of the lens remains exposed. A light-shielding layer is formed on the electromagnetic interference pattern, second sacrificial element, and peripheral region of the selected portion of the lens. The second sacrificial element and light-shielding pattern are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Abstract: Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Abstract: The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.

Abstract: The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.

Abstract: Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Abstract: An optical microstructure plate and mold for fabricating the same is disclosed. The optical microstructure plate comprises a substrate. An optical microstructure element is formed on the substrate. A period alignment mark is disposed on the substrate to provide alignment for fabricating the optical microstructure element by a mold. A universal alignment mark is disposed on the substrate to provide alignment for bonding another plate therewith. Specifically, the mold comprises a concave within a mold substrate, a spoiler around the concave, and a buffer zone adjacent to the spoiler.

Abstract: A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.

Abstract: Soft mold and fabrication method thereof. The soft mold of the present invention comprises: a polymer layer having a printing pattern on a first surface thereof; at least one air channel on the first surface; and a back-plate attached to a second surface of the polymer layer. Additionally, the method for fabricating the soft mold includes: providing a mold having a predetermined pattern; positioning the mold in a cavity and calibrating the horizontal thereof; forming a polymer layer on the mold; attaching a back-plate to a top surface of the polymer layer and the dam; separating the polymer layer from the mold, wherein the polymer layer has a patterned surface; and cutting at least one air channel on the patterned surface of the polymer layer.

Abstract: An optical microstructure plate and mold for fabricating the same is disclosed. The optical microstructure plate comprises a substrate. An optical microstructure element is formed on the substrate. A period alignment mark is disposed on the substrate to provide alignment for fabricating the optical microstructure element by a mold. A universal alignment mark is disposed on the substrate to provide alignment for bonding another plate therewith. Specifically, the mold comprises a concave within a mold substrate, a spoiler around the concave, and a buffer zone adjacent to the spoiler.

Abstract: A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.