Abstract: A blind insert fluid connection module includes a first fluid connector located on a first assembly and a second fluid connector located on a second assembly. The second fluid connector is used to engage the first fluid connector in a first direction to form a fluid channel. The second assembly includes a main body, a guide structure, and a cushioning resilient member. The fastening member is located on the main body. The guide structure is located on the main body, and the second fluid connector is fixed on the guide structure. The cushioning resilient member is connected to the guide structure to provide a buffer displacement of the second fluid connector along the second direction when the first and second fluid connectors are joined, wherein an included angle is formed between the second direction and the first direction.

Abstract: A process for forming a conducting structure layer that can reduce metal etching residues, in which a pre in-situ metal layer is added before a metal layer is deposited. The pre in-situ metal layer enables the crystalloid of the metal layer to grow more 5 evenly, and thus reduces the etching residues of the conducting structure layer. A structure of a conducting structure layer is also provided.