Patents by Inventor Teng-Zhi Qin

Teng-Zhi Qin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7922371
    Abstract: A thermal module for LED includes a base in direct contact with an LED module; a first radiating fin assembly consisting of a plurality of parallelly spaced radiating fins and being connected at one side to the base opposite to the LED module; at least one second radiating fin assembly consisting of a plurality of parallelly spaced radiating fins, so that an air passage is provided between any two adjacent radiating fins of the second radiating fin assembly; and at least one heat pipe having a conducting section extended through and closely bearing against an interface between the base and the first radiating fin assembly, and at least one radiating section outward extended from an end of the conducting section to extend through the second radiating fin assembly. The second radiating fin assembly and the air passages thereof largely upgrade the heat dissipating efficiency of the thermal module.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: April 12, 2011
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Teng-Zhi Qin
  • Publication number: 20110030920
    Abstract: A heat sink structure includes a heat dissipating body and at least one heat pipe. The heat dissipating body includes a main body having two opposite first and second end faces, and a plurality of radiating fins formed on two wall surfaces of the main body. The heat dissipating body is made of a heat-conducting plastic material through injection molding, and the heat pipe is embedded in the heat dissipating body during the process of injection molding the heat dissipating body. The heat pipe has two opposite first and second ends respectively exposed from the first and second end faces of the heat dissipating body for directly contacting with a heat source, and a pipe body helically extended between the first and second ends and embedded in the heat dissipating body. With these arrangements, the heat sink structure has reduced weight and material cost while providing good heat dissipating effect.
    Type: Application
    Filed: August 4, 2009
    Publication date: February 10, 2011
    Applicant: ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD.
    Inventors: Teng-Zhi Qin, Wen-Ji Lan
  • Publication number: 20100014299
    Abstract: A thermal module for LED includes a base in direct contact with an LED module; a first radiating fin assembly consisting of a plurality of parallelly spaced radiating fins and being connected at one side to the base opposite to the LED module; at least one second radiating fin assembly consisting of a plurality of parallelly spaced radiating fins, so that an air passage is provided between any two adjacent radiating fins of the second radiating fin assembly; and at least one heat pipe having a conducting section extended through and closely bearing against an interface between the base and the first radiating fin assembly, and at least one radiating section outward extended from an end of the conducting section to extend through the second radiating fin assembly. The second radiating fin assembly and the air passages thereof largely upgrade the heat dissipating efficiency of the thermal module.
    Type: Application
    Filed: December 18, 2008
    Publication date: January 21, 2010
    Applicant: Asia Vital Components (Shen Zhen) Co., Ltd.
    Inventor: Teng-Zhi Qin