Patents by Inventor Tengfei WEN

Tengfei WEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11947982
    Abstract: A plurality of constraint relationships in a UI are identified and grouped into two types, a constraint relationship of a first type is solved in an integrated development environment (IDE), and a constraint relationship of a second type is a constraint relationship solved in a terminal or the IDE. The plurality of constraint relationships are used to determine a layout of one or more components in the UI. The IDE calculates a first intermediate solution set based on the constraint relationship of the first type in the plurality of constraint relationships. The first intermediate solution set is used to determine the layout of the one or more components in the UI together with the constraint relationship of the second type.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: April 2, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Tao Wen, Xiao Xu, Jun Liu, Tengfei Cui
  • Patent number: 11873684
    Abstract: A polycrystalline diamond compact including a polycrystalline diamond layer and a cemented carbide substrate. The polycrystalline diamond layer is in the form of a cylinder including an upper surface, a bottom surface, and a side wall connecting the upper surface and the bottom surface. The cemented carbide substrate is bonded to the bottom surface of the polycrystalline diamond layer. The upper surface includes a center part and an edge part. The edge part includes a plurality of radially distributed cutting edges and cutting removal grooves. The plurality of cutting edges and cutting removal grooves are alternately distributed on the upper surface. One end of each of the plurality of cutting edges and cutting removal grooves extends to communicate with the center part, and the other end of each of the plurality of cutting edges and cutting removal grooves extends to communicate with the side wall.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: January 16, 2024
    Assignee: SF DIAMOND CO., LTD.
    Inventors: Dongpeng Zhao, Weifeng Du, Tongjian Niu, Tengfei Wen, Chunlin Zhang, Haijiang Fang
  • Publication number: 20210164296
    Abstract: A polycrystalline diamond compact including a polycrystalline diamond layer and a cemented carbide substrate. The polycrystalline diamond layer is in the form of a cylinder including an upper surface, a bottom surface, and a side wall connecting the upper surface and the bottom surface. The cemented carbide substrate is bonded to the bottom surface of the polycrystalline diamond layer. The upper surface includes a center part and an edge part. The edge part includes a plurality of radially distributed cutting edges and cutting removal grooves. The plurality of cutting edges and cutting removal grooves are alternately distributed on the upper surface. One end of each of the plurality of cutting edges and cutting removal grooves extends to communicate with the center part, and the other end of each of the plurality of cutting edges and cutting removal grooves extends to communicate with the side wall.
    Type: Application
    Filed: February 8, 2021
    Publication date: June 3, 2021
    Inventors: Dongpeng ZHAO, Weifeng DU, Tongjian NIU, Tengfei WEN, Chunlin ZHANG, Haijiang FANG
  • Publication number: 20190203539
    Abstract: A polycrystalline diamond compact including a polycrystalline diamond layer and a cemented carbide substrate. The polycrystalline diamond layer is in the form of a cylinder including an upper surface, a bottom surface, and a side wall connecting the upper surface and the bottom surface. The cemented carbide substrate is bonded to the bottom surface of the polycrystalline diamond layer. The upper surface includes a center part and an edge part. The edge part includes a plurality of radially distributed cutting edges and cutting removal grooves. The plurality of cutting edges and cutting removal grooves are alternately distributed on the upper surface. One end of each of the plurality of cutting edges and cutting removal grooves extends to communicate with the center part, and the other end of each of the plurality of cutting edges and cutting removal grooves extends to communicate with the side wall.
    Type: Application
    Filed: March 11, 2019
    Publication date: July 4, 2019
    Inventors: Dongpeng ZHAO, Weifeng DU, Tongjian NIU, Tengfei WEN, Chunlin ZHANG, Haijiang FANG