Abstract: A graded-index polymer waveguide (30) and a manufacturing method thereof are provided. The method includes providing a waveguide substrate (1); manufacturing a waveguide lower cladding layer (2) on a surface of the waveguide substrate (1); coating a material of a waveguide core layer (3) having UV photosensitivity on a surface of the waveguide lower cladding layer (2) away from the waveguide substrate (1); performing a hot imprinting process for the material of the waveguide core layer by means of a flexible transfer film mold and forming a waveguide core layer (3) having an imprinted waveguide link structure; performing a heat treatment process for the waveguide core layer (3); performing a pre-exposure process for the waveguide core layer; coating a waveguide upper cladding layer on a surface of a waveguide core layer (3); and curing the waveguide core layer (3) and the waveguide upper cladding layer (4).

Abstract: A flexible optical waveguide board and a method of manufacturing the same are provided. The flexible optical waveguide board includes: a flexible substrate, wherein a surface of a side of the flexible substrate is a rough surface; an optical waveguide, disposed on the rough surface of the flexible substrate; a cover layer, disposed on a surface of a side of the optical waveguide away from the flexible substrate. In this way, structural reliability and environmental ageing resistance of the flexible optical waveguide board is improved.

Abstract: The present disclosure provides an optical fiber circuit board and a manufacturing method thereof, a multilayer optical fiber circuit board, an optical transmission device, a photo-electric hybrid circuit board, and a signal transmission device. The optical fiber circuit board includes at least two substrates stacked and spaced apart, at least one optical fiber assembly and a bonding layer. Each of the at least one optical fiber assembly is disposed between each adjacent two of the at least two substrates. Each of the at least one optical fiber assembly includes at least one optical fiber. The bonding layer is filled in a remaining space between adjacent two of the at least two substrates apart from a corresponding optical fiber assembly of the at least one optical fiber assembly to fix each of the at least one optical fiber relative to the adjacent two substrates.