Patents by Inventor Tennyson Nguty
Tennyson Nguty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11735689Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: GrantFiled: May 23, 2022Date of Patent: August 22, 2023Assignee: Meta Platforms Technologies, LLCInventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nannette Farrens, Ali Sengul, Tennyson Nguty
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Patent number: 11677051Abstract: Embodiments described herein are directed towards enhanced systems and methods for applying underfill (UF) material to fill a gap between electrically coupled semiconductor devices in an integrated device. In some embodiments, uncured UF material may be applied to one edge of the gap, and capillary flow may be employed to distribute the uncured UF material into a first portion of the gap. To fill a second portion of the gap, accelerated motion may be employed. For example, the integrated device may be affixed to a centrifuge, and the centrifuge can be used to spin the integrated device to spread the uncured UF material further into the gap. In some embodiments, the accelerated motion may be employed to distribute the uncured UF material substantially uniformly within the gap. Once the uncured UF material has been spread out, one or more curing processes may be employed to cure the sandwiched UF material.Type: GrantFiled: February 7, 2020Date of Patent: June 13, 2023Assignee: Meta Platforms Technologies, LLCInventors: Daniel Brodoceanu, Zheng Sung Chio, Tennyson Nguty, Chao Kai Tung, Oscar Torrents Abad
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Publication number: 20220393060Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: ApplicationFiled: June 24, 2022Publication date: December 8, 2022Inventors: Jeb Wu, Daniel Brodoceanu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad, Ali Sengul
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Publication number: 20220352412Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: ApplicationFiled: May 23, 2022Publication date: November 3, 2022Inventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nannette Farrens, Ali Sengul, Tennyson Nguty
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Patent number: 11417792Abstract: A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.Type: GrantFiled: March 19, 2020Date of Patent: August 16, 2022Assignee: Meta Platforms Technologies, LLCInventors: Ali Sengül, Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Tennyson Nguty
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Patent number: 11404600Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: GrantFiled: January 21, 2020Date of Patent: August 2, 2022Assignee: Meta Platforms Technologies, LLCInventors: Jeb Wu, Daniel Brodoceanu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad, Ali Sengul
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Patent number: 11374148Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: GrantFiled: January 21, 2020Date of Patent: June 28, 2022Assignee: Facebook Technologies, LLCInventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengul, Tennyson Nguty
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Patent number: 11349053Abstract: Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.Type: GrantFiled: January 14, 2020Date of Patent: May 31, 2022Assignee: Facebook Technologies, LLCInventors: Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu, Pooya Saketi, Chao Kai Tung, Tennyson Nguty, Allan Pourchet
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Patent number: 11239400Abstract: A light-emitting diode (LED) array is formed by bonding an LED chip or wafer to a backplane substrate via curved interconnects. The backplane substrate may include circuits for driving the LED's. One or more curved interconnects are formed on the backplane substrate. A curved interconnect may be electrically connected to a corresponding circuit of the backplane substrate, and may include at least a portion with curvature. The LED chip or wafer may include one or more LED devices. Each LED device may have one or more electrical contacts. The LED chip or wafer is positioned above the backplane substrate to spatially align electrical contacts of the LED devices with the curved interconnects on the backplane substrate. The electrical contacts are bonded to the curved interconnects to electrically connect the LED devices to corresponding circuits of the backplane substrate.Type: GrantFiled: January 8, 2020Date of Patent: February 1, 2022Assignee: Facebook Technologies, LLCInventors: Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi, Jeb Wu, Chao Kai Tung, Remi Alain Delille, Tennyson Nguty, Allan Pourchet
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Publication number: 20200395503Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: ApplicationFiled: January 21, 2020Publication date: December 17, 2020Inventors: Jeb Wu, Daniel Brodoceanu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad, Ali Sengul
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Publication number: 20200395520Abstract: The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be ?LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.Type: ApplicationFiled: January 21, 2020Publication date: December 17, 2020Inventors: Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Shari Farrens, Ali Sengul, Tennyson Nguty
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Patent number: 9307665Abstract: The invention provides an air cavity package for a component. The package has a connection lead structure in which the or each connection lead has a connection zone within the package for receiving a wire connector. A region of no connection lead material is provided directly between the connection zone and the neighboring outer edge of the cavity. This provides a trap for flowing interconnect material.Type: GrantFiled: April 21, 2014Date of Patent: April 5, 2016Assignee: SAMBA HOLDCO NETHERLANDS B.V.Inventors: Michael Asis, Albertus Reijs, Tennyson Nguty, An Xiao
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Publication number: 20140318854Abstract: The invention provides an air cavity package for a component. The package has a connection lead structure in which the or each connection lead has a connection zone within the package for receiving a wire connector. A region of no connection lead material is provided directly between the connection zone and the neighbouring outer edge of the cavity. This provides a trap for flowing interconnect material.Type: ApplicationFiled: April 21, 2014Publication date: October 30, 2014Applicant: NXP B.V.Inventors: Michael Asis, Albertus Reijs, Tennyson Nguty, An Xiao