Patents by Inventor Tenpei Inoue

Tenpei Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical transmission module
    Patent number: 7367717
    Abstract: An optical transmission module has: an optical module having an optical element and a receptacle portion; a circuit board that is electrically connected to the optical module through an electrical connection member; and a housing in which the optical module and the circuit board are placed. The optical module is in surface-contact with and fixed onto the housing. The receptacle portion and the circuit board are not in contact with the housing. The receptacle portion is restricted in position while having a positional degree of freedom at least in a direction perpendicular to an optical axis of light emitted from the optical element. The circuit board is restricted in position while having a positional degree of freedom at least in a direction of the optical axis.
    Type: Grant
    Filed: May 18, 2005
    Date of Patent: May 6, 2008
    Assignee: Hitachi Cable, Ltd.
    Inventors: Juhyun Yu, Kinya Yamazaki, Hidetaka Kawauchi, Tenpei Inoue, Hiroki Katayama
  • Mounting structure for electronic components
    Patent number: 7348497
    Abstract: A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.
    Type: Grant
    Filed: July 12, 2005
    Date of Patent: March 25, 2008
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hidetaka Kawauchi, Yoshiaki Ishigami, Kinya Yamazaki, Juhyun Yu, Tenpei Inoue, Hiroki Katayama
  • Optical transceiver
    Patent number: 7347635
    Abstract: An optical transceiver has: an optical subassembly that has a built-in chip portion and a receptacle portion; a board electrically connected to one end of the built-in chip portion; a housing that houses the optical subassembly and the board; and a holding member to hold the optical subassembly.
    Type: Grant
    Filed: June 21, 2005
    Date of Patent: March 25, 2008
    Assignee: Hitachi Cable, Ltd.
    Inventors: Juhyun Yu, Kinya Yamazaki, Hidetaka Kawauchi, Tenpei Inoue, Hiroki Katayama
  • Optical transceiver
    Publication number: 20060140551
    Abstract: An optical transceiver has: an optical subassembly that has a built-in chip portion and a receptacle portion; a board electrically connected to one end of the built-in chip portion; a housing that houses the optical subassembly and the board; and a holding member to hold the optical subassembly.
    Type: Application
    Filed: June 21, 2005
    Publication date: June 29, 2006
    Inventors: Juhyun Yu, Kinya Yamazaki, Hidetaka Kawauchi, Tenpei Inoue, Hiroki Katayama
  • Optical transmission module
    Publication number: 20060133819
    Abstract: An optical transmission module has: an optical module having an optical element and a receptacle portion; a circuit board that is electrically connected to the optical module through an electrical connection member; and a housing in which the optical module and the circuit board are placed. The optical module is in surface-contact with and fixed onto the housing. The receptacle portion and the circuit board are not in contact with the housing. The receptacle portion is restricted in position while having a positional degree of freedom at least in a direction perpendicular to an optical axis of light emitted from the optical element. The circuit board is restricted in position while having a positional degree of freedom at least in a direction of the optical axis.
    Type: Application
    Filed: May 18, 2005
    Publication date: June 22, 2006
    Applicant: Hitachi Cable, Ltd.
    Inventors: Juhyun Yu, Kinya Yamazaki, Hidetaka Kawauchi, Tenpei Inoue, Hiroki Katayama
  • Mounting structure for electronic components
    Publication number: 20060065432
    Abstract: A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.
    Type: Application
    Filed: July 12, 2005
    Publication date: March 30, 2006
    Inventors: Hidetaka Kawauchi, Yoshiaki Ishigami, Kinya Yamazaki, Juhyun Yu, Tenpei Inoue, Hiroki Katayama