Abstract: A packaged integrated circuit (10) includes a leadframe adhesively attached onto a semiconductor IC chip (11 ). The leadframe includes a pair of bus bars or support ties (14, 15), a pair of support tabs (22, 23) and a plurality of lead fingers (12, 13) for inputting and outputting signals. The support ties (14, 15) extend outside of the integrated circuit package during formation of the package on one end of the package only with each tie extending outside the package on the opposite end of the other. The support tabs (22, 23) are positioned linearly from the support ties (14, 15) on the end of the package which the respective tie does not extend to the outside of the package. The leadframe and the IC chip are connected by a plurality of sheets of insulating tape (16, 17), which have a recess or removed portion (31 ) at the location closer to the support ties (14, 15), to reduce the risk of delamination of the insulating tape and to increase the reliability of the packaged IC.