Patents by Inventor Teong Guan T.G. Yew

Teong Guan T.G. Yew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9606955
    Abstract: Techniques for embedded high speed serial interface methods are described herein. The method includes issuing a single-ended one (SE1) signal on each of a pair of embedded high speed serial interface data lines, the SE1 indicating a register access protocol (RAP) message follows the SE1 signal. The method also includes accessing a register of an embedded high speed serial interface component based on the RAP message.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: March 28, 2017
    Assignee: Intel Corporation
    Inventors: Huimin Chen, Jia Jun Lee, Amit Kumar Srivastava, Teong Guan T. G. Yew, Tim McKee
  • Publication number: 20150227489
    Abstract: Techniques for embedded high speed serial interface methods are described herein. The method includes issuing a single-ended one (SE1) signal on each of a pair of embedded high speed serial interface data lines, the SE1 indicating a register access protocol (RAP) message follows the SE1 signal. The method also includes accessing a register of an embedded high speed serial interface component based on the RAP message.
    Type: Application
    Filed: August 12, 2014
    Publication date: August 13, 2015
    Applicant: INTEL CORPORATION
    Inventors: Huimin Chen, Jia Jun Lee, Amit Kumar Srivastava, Teong Guan T.G. Yew, Tim McKee