Abstract: Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.

Abstract: A universal interconnection scheme enables system architecture modularization with a hot-pluggable external computing module, such as a PC-on-a-card device using USB type-C technology. With the flexibility to interchange the system computing module with an external module, system performance can be augmented to fulfill the essential needs of the user, whether the system is a portable low-power tablet device, a smartphone, a wearable device such as an Internet of Things device, or a high-performance PC.

Abstract: A universal interconnection scheme enables system architecture modularization with a hot-pluggable external computing module, such as a PC-on-a-card device using USB type-C technology. With the flexibility to interchange the system computing module with an external module, system performance can be augmented to fulfill the essential needs of the user, whether the system is a portable low-power tablet device, a smartphone, a wearable device such as an Internet of Things device, or a high-performance PC.

Abstract: Some example forms relate to an electrical interconnect for an electronic package. The electrical interconnect includes a dielectric layer that includes a trench formed into one surface of the dielectric layer and a signal conductor that fills the trench and extends above the one surface of dielectric layer. The electrical interconnect further includes a conductive reference layer mounted on an opposing side of the dielectric layer. The conductive reference layer is electromagnetically coupled to the signal conductor when current passes through the signal conductor.

Abstract: Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.

Abstract: Some example forms relate to an electrical interconnect for an electronic package. The electrical interconnect includes a dielectric layer that includes a trench formed into one surface of the dielectric layer and a signal conductor that fills the trench and extends above the one surface of dielectric layer. The electrical interconnect further includes a conductive reference layer mounted on an opposing side of the dielectric layer. The conductive reference layer is electromagnetically coupled to the signal conductor when current passes through the signal conductor.