Patents by Inventor Teong Yu Lim

Teong Yu Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for molding semiconductor packages
    Patent number: 5744083
    Abstract: The invention is to a transfer mold design utilized with conventional transfer encapsulation. The design utilizes a varying runner cross section with an intermediate varying depth well or reservoir from which a constant gate depth and gate entry angled to the mold cavities is employed. The method and apparatus of the invention is applicable to single and multi-plunger molding utilizing thermoset and thermoplastic encapsulants for semiconductors.
    Type: Grant
    Filed: November 6, 1996
    Date of Patent: April 28, 1998
    Assignee: Texas Instruments Incorporated
    Inventors: George A. Bednarz, Teong Yu Lim