Abstract: To provide an electrical penetration capable of being used in nuclear power plants which are designed assuming operation under conditions of the severe accident. An electrical penetration includes: a tubular sleeve member 10; two or more insulating seal members 20A and 20B arranged inside the sleeve member 10 so as to be spaced from each other; wiring members 60, 60 disposed along the longitudinal direction of the sleeve member 10 so as to extend across two insulating seal members of the two or more insulating seal members 20A and 20B; and outer seal members provided inside the sleeve member 10 and at the outermost portions of the two insulating seal members 20A and 20B. The wiring members 60, 60 are each covered with an insulator made of the same material as those of the outer seal members 21A and 21B.

Abstract: A package is configured such that a length in a direction parallel to a semiconductor chip is larger than a length in a direction orthogonal to the semiconductor chip, and the package includes a substrate to which the semiconductor chip is electrically connected and fixed, a side wall firmly attached to the substrate, and a cover firmly attached to the side wall. The package includes a detection space in which gas flows around the semiconductor chip. The package includes openings formed in the side wall and/or between the side wall and the cover and communicated with the detection space.

Abstract: Problem To extend the life of a MEMS gas sensor. Solution means A MEMS gas sensor 1 includes an insulator (3), a gas sensitive material (33), a first oxide film (6) and an interlayer insulating film (13), a heater wiring pattern (23), a lower protective film (11), and an upper protective film (20). The insulator includes a cavity (3c). The gas sensitive material (33) is provided corresponding to the cavity (3c). The first oxide film (6) and the interlayer insulating film (13) are provided on the insulator (3) and arranged to overlap each other in a plan view. The heater wiring pattern (23) serves to heat the gas sensitive material (33) and is disposed between the first oxide film (6) and the interlayer insulating film (13). The lower protective film (11) and the upper protective film (20) cover, in direct contact, an upper surface (23c), a lower surface (23d), and a side surface (23e) of the heater wiring pattern (23).

Abstract: A MEMS gas sensor mount body includes a MEMS gas sensor chip and a printed circuit board. The MEMS gas sensor chip includes a base having a cavity, an insulating film having an opening portion, a gas sensing unit, and a plurality of pads. The printed circuit board includes a gas introduction path, and a plurality of connection terminals. The MEMS gas sensor chip is mounted on the printed circuit board to cover the opening portion, with the cavity and the gas introduction path overlapping in plan view, and with the plurality of pads electrically connected to the plurality of connection terminals. The gas introduction path is provided on the printed circuit board in a region other than a region on which the gas sensing unit is positioned.

Abstract: A package is configured such that a length in a direction parallel to a semiconductor chip is larger than a length in a direction orthogonal to the semiconductor chip, and the package includes a substrate to which the semiconductor chip is electrically connected and fixed, a side wall firmly attached to the substrate, and a cover firmly attached to the side wall. The package includes a detection space in which gas flows around the semiconductor chip. The package includes openings formed in the side wall and/or between the side wall and the cover and communicated with the detection space.

Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.

Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.

Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.

Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

Abstract: The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film.

Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.

Abstract: The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film.

Abstract: The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object.

Abstract: It is an object of the present invention to provide an arch type probe capable of enduring a load caused by overdriving even if the probe is miniaturized, and a probe card using the same. An arch type probe 200 has a shape including a first quarter circle arc portion 210 which is supported at one end thereof by the base plate 100 and a second quarter circle arc portion 220 which is connected to the other end of the first quarter circle arc portion 210, extending toward the base plate and a little shorter than the first quarter circle arc portion 221. The top portion of the arch type probe 200 serves as a contact surface brought into contact with an electrode of a semiconductor water B.

Abstract: The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object.

Abstract: A probe card including rectilinear probes; a guide base plate having an insulating property, in which a plurality of guide holes are formed through which the probes are inserted in a freely movable manner and a length of a guide hole is shorter than a length of a probe; and a plurality of sheet members having an insulating property, disposed above the guide base plate facing the plate, and laminated one on another with a spacing therebetween so as not to be in contact with one another. The tail ends of some of the probes can be brought into contact with the electrode pads on a lowest sheet member, and the tail ends of the other probes penetrate through the lowest sheet member so as to be enabled to be in contact with electrode pads on other sheet members.

Abstract: An object of the present invention is to provide a probe card capable of readily arranging a wiring pattern without forming the through hole while using a silicon substrate as a supporting substrate. The probe card comprises: a supporting substrate 100, one surface of which is formed in a pyramid shape having one step; a plurality of probes 200 arranged on the surface of a thick part of the supporting substrate 100; a plurality of bumps 110 arranged on the surface of a thin part of the supporting substrate 100; and a plurality of wiring patterns 120 which are arranged on the one surface of the supporting substrate 100 and electrically connects each of the probes 200 with each of the bumps 110.