Patents by Inventor Teppei Kimura

Teppei Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11415536
    Abstract: A package is configured such that a length in a direction parallel to a semiconductor chip is larger than a length in a direction orthogonal to the semiconductor chip, and the package includes a substrate to which the semiconductor chip is electrically connected and fixed, a side wall firmly attached to the substrate, and a cover firmly attached to the side wall. The package includes a detection space in which gas flows around the semiconductor chip. The package includes openings formed in the side wall and/or between the side wall and the cover and communicated with the detection space.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: August 16, 2022
    Assignee: Nissha Co., Ltd.
    Inventors: Teppei Kimura, Hiroaki Suzuki
  • Publication number: 20220221416
    Abstract: Problem To extend the life of a MEMS gas sensor. Solution means A MEMS gas sensor 1 includes an insulator (3), a gas sensitive material (33), a first oxide film (6) and an interlayer insulating film (13), a heater wiring pattern (23), a lower protective film (11), and an upper protective film (20). The insulator includes a cavity (3c). The gas sensitive material (33) is provided corresponding to the cavity (3c). The first oxide film (6) and the interlayer insulating film (13) are provided on the insulator (3) and arranged to overlap each other in a plan view. The heater wiring pattern (23) serves to heat the gas sensitive material (33) and is disposed between the first oxide film (6) and the interlayer insulating film (13). The lower protective film (11) and the upper protective film (20) cover, in direct contact, an upper surface (23c), a lower surface (23d), and a side surface (23e) of the heater wiring pattern (23).
    Type: Application
    Filed: August 28, 2019
    Publication date: July 14, 2022
    Inventors: Teppei KIMURA, Hiroaki SUZUKI, Kazuo TERASAWA
  • Publication number: 20220146445
    Abstract: A MEMS gas sensor mount body includes a MEMS gas sensor chip and a printed circuit board. The MEMS gas sensor chip includes a base having a cavity, an insulating film having an opening portion, a gas sensing unit, and a plurality of pads. The printed circuit board includes a gas introduction path, and a plurality of connection terminals. The MEMS gas sensor chip is mounted on the printed circuit board to cover the opening portion, with the cavity and the gas introduction path overlapping in plan view, and with the plurality of pads electrically connected to the plurality of connection terminals. The gas introduction path is provided on the printed circuit board in a region other than a region on which the gas sensing unit is positioned.
    Type: Application
    Filed: March 5, 2020
    Publication date: May 12, 2022
    Inventors: Teppei KIMURA, Hiroaki SUZUKI
  • Publication number: 20190383761
    Abstract: A package is configured such that a length in a direction parallel to a semiconductor chip is larger than a length in a direction orthogonal to the semiconductor chip, and the package includes a substrate to which the semiconductor chip is electrically connected and fixed, a side wall firmly attached to the substrate, and a cover firmly attached to the side wall. The package includes a detection space in which gas flows around the semiconductor chip. The package includes openings formed in the side wall and/or between the side wall and the cover and communicated with the detection space.
    Type: Application
    Filed: November 6, 2017
    Publication date: December 19, 2019
    Inventors: Teppei Kimura, Hiroaki Suzuki
  • Patent number: 9972933
    Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: May 15, 2018
    Assignee: Japan Electronic Materials Corporation
    Inventors: Teppei Kimura, Noriyuki Fukushima, Atsuo Urata, Naoki Arita, Tomoyuki Takeda
  • Patent number: 9841438
    Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: December 12, 2017
    Assignee: Japan Electronic Materials Corporation
    Inventors: Teppei Kimura, Liwen Fan
  • Publication number: 20170346211
    Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.
    Type: Application
    Filed: August 11, 2017
    Publication date: November 30, 2017
    Applicant: Japan Electronic Materials Corporation
    Inventors: Teppei Kimura, Noriyuki Fukushima, Atsuo Urata, Naoki Arita, Tomoyuki Takeda
  • Patent number: 9774121
    Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: September 26, 2017
    Assignee: Japan Electronics Material Corporation
    Inventors: Teppei Kimura, Noriyuki Fukushima, Atsuo Urata, Naoki Arita, Tomoyuki Takeda
  • Publication number: 20170082657
    Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
    Type: Application
    Filed: November 22, 2016
    Publication date: March 23, 2017
    Inventors: Teppei KIMURA, Liwen FAN
  • Patent number: 9535096
    Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: January 3, 2017
    Assignee: Japan Electronic Materials Corporation
    Inventors: Teppei Kimura, Liwen Fan
  • Patent number: 9459287
    Abstract: The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: October 4, 2016
    Assignees: JAPAN ELECTRONIC MATERIALS CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Teppei Kimura, Akinori Shiraishi, Kosuke Fujihara
  • Publication number: 20150301083
    Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
    Type: Application
    Filed: July 25, 2013
    Publication date: October 22, 2015
    Inventors: Teppei KIMURA, Liwen FAN
  • Publication number: 20150280345
    Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.
    Type: Application
    Filed: November 27, 2013
    Publication date: October 1, 2015
    Inventors: Teppei Kimura, Noriyuki Fukushima, Atsuo Urata, Naoki Arita, Tomoyuki Takeda
  • Publication number: 20140266275
    Abstract: The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicants: Shinko Electric Industries Co., LTD., Japan Electronic Materials Corporation
    Inventors: Teppei KIMURA, Akinori SHIRAISHI, Kosuke FUJIHARA
  • Patent number: 7268568
    Abstract: The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: September 11, 2007
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Kazumichi Machida, Atsuo Urata, Teppei Kimura
  • Patent number: 7208964
    Abstract: It is an object of the present invention to provide an arch type probe capable of enduring a load caused by overdriving even if the probe is miniaturized, and a probe card using the same. An arch type probe 200 has a shape including a first quarter circle arc portion 210 which is supported at one end thereof by the base plate 100 and a second quarter circle arc portion 220 which is connected to the other end of the first quarter circle arc portion 210, extending toward the base plate and a little shorter than the first quarter circle arc portion 221. The top portion of the arch type probe 200 serves as a contact surface brought into contact with an electrode of a semiconductor water B.
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: April 24, 2007
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Atsushi Mine, Toranosuke Furusho, Kazumichi Machida, Atsuo Urata, Teppei Kimura, Teruhisa Sakata
  • Publication number: 20070052432
    Abstract: The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object.
    Type: Application
    Filed: September 13, 2005
    Publication date: March 8, 2007
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventors: Kazumichi Machida, Atsuo Urata, Teppei Kimura
  • Patent number: 6980013
    Abstract: A probe card including rectilinear probes; a guide base plate having an insulating property, in which a plurality of guide holes are formed through which the probes are inserted in a freely movable manner and a length of a guide hole is shorter than a length of a probe; and a plurality of sheet members having an insulating property, disposed above the guide base plate facing the plate, and laminated one on another with a spacing therebetween so as not to be in contact with one another. The tail ends of some of the probes can be brought into contact with the electrode pads on a lowest sheet member, and the tail ends of the other probes penetrate through the lowest sheet member so as to be enabled to be in contact with electrode pads on other sheet members.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: December 27, 2005
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Kazumichi Machida, Atsuo Urata, Teppei Kimura
  • Publication number: 20050184743
    Abstract: An object of the present invention is to provide a probe card capable of readily arranging a wiring pattern without forming the through hole while using a silicon substrate as a supporting substrate. The probe card comprises: a supporting substrate 100, one surface of which is formed in a pyramid shape having one step; a plurality of probes 200 arranged on the surface of a thick part of the supporting substrate 100; a plurality of bumps 110 arranged on the surface of a thin part of the supporting substrate 100; and a plurality of wiring patterns 120 which are arranged on the one surface of the supporting substrate 100 and electrically connects each of the probes 200 with each of the bumps 110.
    Type: Application
    Filed: February 14, 2005
    Publication date: August 25, 2005
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventor: Teppei Kimura
  • Publication number: 20050151547
    Abstract: A probe card including rectilinear probes; a guide base plate having an insulating property, in which a plurality of guide holes are formed through which the probes are inserted in a freely movable manner and a length of a guide hole is shorter than a length of a probe; and a plurality of sheet members having an insulating property, disposed above the guide base plate facing the plate, and laminated one on another with a spacing therebetween so as not to be in contact with one another. The tail ends of some of the probes can be brought into contact with the electrode pads on a lowest sheet member, and the tail ends of the other probes penetrate through the lowest sheet member so as to be enabled to be in contact with electrode pads on other sheet members.
    Type: Application
    Filed: August 17, 2004
    Publication date: July 14, 2005
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventors: Kazumichi Machida, Atsuo Urata, Teppei Kimura