Abstract: A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.

Abstract: A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.

Abstract: A method of producing an electrically conductive material includes hardening, at a temperature in a range of 120° C. to 300° C., an electrically conductive adhesive that constitutes: (A) a polyether polymer having a backbone of a repeating unit of the formula —R1—O—, wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms and an end group which is a hydrolyzable silyl group; and (B) silver particles.

Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 ?m to 5 ?m and further contains an anionic surfactant but is substantially free from resin.

Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 ?m to 5 ?m and further contains an anionic surfactant but is substantially free from resin.

Abstract: A wavelength conversion module includes a base, a wavelength conversion member consisting of a phosphor, and a bonding member including a metal part that bonds the base and the wavelength conversion member. A thickness of the wavelength conversion member is less than 100 ?m.

Abstract: Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.

Abstract: Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.

Abstract: A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.

Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 ?m to 5 ?m and further contains an anionic surfactant but is substantially free from resin.

Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 ?m to 5 ?m and further contains an anionic surfactant but is substantially free from resin.

Abstract: The present disclosure provides a method for bonding an electronic component and a method for manufacturing a bonded body, which are capable of sintering a silver paste at a comparatively low temperature. Disclosed is a method for bonding an electronic component using a silver paste containing silver particles, the method including: applying a silver paste containing silver particles on a surface of a substrate and setting electronic components on the silver paste applied, heating in a reducing atmosphere at a temperature of lower than 300° C., and after heating in the reducing atmosphere, heating in an oxidizing atmosphere at a temperature of 300° C. or lower.

Abstract: A semiconductor device includes a base, a semiconductor element mounted on the base, a porous metal sintered body and a sealing member. The porous metal sintered body is provided on the base in an area different from an area on which the semiconductor element is mounted. The sealing member covers the semiconductor element. The sealing member is placed inside the porous metal sintered body.

Abstract: Provided is a metal powder sintering paste having a high resistance to thermal stress. The present invention provides a metal powder sintering paste containing silver particles having an average particle diameter (median diameter) of 0.3 ?m to 5 ?m as a main component, further containing inorganic spacer particles having a CV value (standard deviation/average value) of less than 5%, and containing substantially no resin.

Abstract: The present disclosure provides a method for bonding an electronic component and a method for manufacturing a bonded body, which are capable of sintering a silver paste at a comparatively low temperature. Disclosed is a method for bonding an electronic component using a silver paste containing silver particles, the method including: applying a silver paste containing silver particles on a surface of a substrate and setting electronic components on the silver paste applied, heating in a reducing atmosphere at a temperature of lower than 300° C., and after heating in the reducing atmosphere, heating in an oxidizing atmosphere at a temperature of 300° C. or lower.

Abstract: A semiconductor device includes a base, a semiconductor element mounted on the base, a porous metal sintered body and a sealing member. The porous metal sintered body is provided on the base in an area different from an area on which the semiconductor element is mounted. The sealing member covers the semiconductor element. The sealing member is placed inside the porous metal sintered body.

Abstract: Provided is a metal powder sintering paste having a high resistance to thermal stress. The present invention provides a metal powder sintering paste containing silver particles having an average particle diameter (median diameter) of 0.3 ?m to 5 ?m as a main component, further containing inorganic spacer particles having a CV value (standard deviation/average value) of less than 5%, and containing substantially no resin.

Abstract: Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.

Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 ?m to 5 ?m and further contains an anionic surfactant but is substantially free from resin.

Abstract: An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. In the semiconductor device, silver arranged on a semiconductor element and silver arranged on a base are bonded. No void is present or a small void, if any, is present at an interface between the semiconductor element and the silver arranged on the semiconductor element, no void is present or a small void, if any, is present at an interface between the base and the silver arranged on the base, and one or more silver abnormal growth grains and one or more voids are present in a bonded interface between the silver arranged on the semiconductor element and the silver arranged on the base.