Patents by Inventor Teppei Niino

Teppei Niino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12284757
    Abstract: A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: April 22, 2025
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Hiroaki Machitani, Teppei Niino
  • Patent number: 12238859
    Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: February 25, 2025
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Teppei Niino, Yosuke Nakanishi
  • Patent number: 12238858
    Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: February 25, 2025
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Teppei Niino, Yosuke Nakanishi
  • Patent number: 12137522
    Abstract: A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: November 5, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Rihito Fukushima, Shusaku Shibata, Teppei Niino
  • Patent number: 12120829
    Abstract: An assembly sheet as a wiring circuit board assembly sheet includes a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate includes a product region and a frame region adjacent thereto. The wiring circuit structure portion is disposed on one surface in a thickness direction of the metal substrate in the product region, and includes a terminal portion. The dummy structure portion is disposed on one surface in the thickness direction of the metal substrate in the frame region, includes a plurality of conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: October 15, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Shun Shiga, Teppei Niino
  • Patent number: 12114438
    Abstract: A method for manufacturing a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layers, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: October 8, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Rihito Fukushima, Teppei Niino
  • Publication number: 20240292528
    Abstract: A wiring circuit board includes a base insulating layer, a conductive layer, and a cover insulating layer. The conductive layer has a terminal and a wiring. The wiring has a body portion and a connecting portion. The connecting portion connects the body portion to the terminal. The cover insulating layer has a cover body portion and a protruding portion. The cover body portion covers the body portion. The protruding portion covers the connecting portion. The protruding portion protrudes from the cover body portion.
    Type: Application
    Filed: February 16, 2024
    Publication date: August 29, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takaya KOUCHI, Teppei NIINO
  • Publication number: 20240260173
    Abstract: A method for producing a wiring circuit board assembly sheet includes a marking step of forming a mark made of a recessed portion in a metal support board, and after the marking step, an insulating layer forming step of forming a base insulating layer on one surface in a thickness direction of the metal support board formed with the mark.
    Type: Application
    Filed: January 21, 2022
    Publication date: August 1, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusaku TAMAKI, Rihito FUKUSHIMA, Teppei NIINO
  • Publication number: 20240206053
    Abstract: A method for producing a wiring circuit board includes a step (1) of producing a substrate with a metal support board including a metal support board and a step (2) of etching the metal support board. The wiring circuit board includes a frame, a mounting portion, an opening portion, and a joint. Each of the frame and the mounting portion includes a metal support layer, a base insulating layer, a conductive layer, and a cover insulating layer. The joint does not include the metal support layer. In step (2), by etching the metal support board corresponding to the opening portion and the joint from the other side in the thickness direction by using an etching resist, the metal support layer is formed.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 20, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takahiro IKEDA, Teppei NIINO, Shusaku SHIBATA, Shoei TETSUKAWA
  • Publication number: 20240206079
    Abstract: A wiring circuit board includes a metal supporting layer, an adhesion layer, a first conductive layer, an insulating layer, and a second conductive layer. The adhesion layer is disposed on one-side surface of the metal supporting layer in the thickness direction, and contains at least one metal selected from the group Zr, Ti, W, Mo, V, Y, Nb, and Ta. The first conductive layer is disposed on one-side surface of the adhesion layer in the thickness direction, and has an insulating layer with a penetrating hole disposed on a one-side surface thereof. The second conductive layer includes a portion electrically connected with the metal supporting layer through the adhesion layer located in the penetrating hole. The second conductive layer is located at one side of the metal supporting layer in the penetrating hole and one side of the insulating layer in the thickness direction.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 20, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takahiro IKEDA, Teppei NIINO
  • Publication number: 20240090128
    Abstract: A wiring circuit board includes a metal supporting substrate, an insulating layer, and a conductive layer in this order in a thickness direction. The conductive layer includes at least one terminal portion and a wiring portion extending from the terminal portion. The metal supporting substrate has an opening portion. The opening portion penetrates the metal supporting substrate in the thickness direction and faces the terminal portion through the insulating layer. The opening portion has a first opening peripheral edge on one side in the thickness direction and a second opening peripheral edge on the other side in the thickness direction. In a projected view in the thickness direction, the second opening peripheral edge is disposed outside the first opening peripheral edge and extends along the first opening peripheral edge.
    Type: Application
    Filed: December 3, 2021
    Publication date: March 14, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusaku TAMAKI, Shusaku SHIBATA, Teppei NIINO
  • Publication number: 20240023237
    Abstract: A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.
    Type: Application
    Filed: October 26, 2021
    Publication date: January 18, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Rihito FUKUSHIMA, Shusaku SHIBATA, Teppei NIINO
  • Publication number: 20240015884
    Abstract: Provided is a wiring circuit board that includes a metal supporting board; a first metal thin film; an insulating layer; a second metal thin film; and a conductive layer in order toward one side in a thickness direction. The metal supporting board includes a metal supporting layer and a surface metal layer. The surface metal layer is disposed on one surface in the thickness direction of the metal supporting layer and has higher conductivity than the metal supporting layer. The insulating layer has a through hole. The conductive layer has a via portion. The via portion is disposed in the through hole and is electrically connected to the metal supporting board.
    Type: Application
    Filed: October 28, 2021
    Publication date: January 11, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takahiro IKEDA, Teppei NIINO
  • Publication number: 20240008178
    Abstract: A wiring circuit board includes a metal supporting board; an insulating layer; and a conductive layer in this order in a thickness direction. The conductive layer includes a terminal portion, and a tail line portion extending from the terminal portion. The terminal portion has a via portion that penetrates the insulating layer in the thickness direction and is connected to the metal supporting board. The tail line portion has a base end portion that has a width different from a width of the terminal portion in a direction orthogonal to the extending direction of the tail line portion and that is connected with the terminal portion; and a second via portion that penetrates the insulating layer in the thickness direction and that is connected to the metal supporting board.
    Type: Application
    Filed: October 29, 2021
    Publication date: January 4, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takahiro IKEDA, Teppei NIINO
  • Publication number: 20230345640
    Abstract: An assembly sheet as a wiring circuit board assembly sheet includes a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate includes a product region and a frame region adjacent thereto. The wiring circuit structure portion is disposed on one surface in a thickness direction of the metal substrate in the product region, and includes a terminal portion. The dummy structure portion is disposed on one surface in the thickness direction of the metal substrate in the frame region, includes a plurality of conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion.
    Type: Application
    Filed: March 5, 2021
    Publication date: October 26, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Shun SHIGA, Teppei NIINO
  • Publication number: 20230141402
    Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.
    Type: Application
    Filed: November 9, 2022
    Publication date: May 11, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Teppei Niino, Yosuke Nakanishi
  • Publication number: 20230147342
    Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.
    Type: Application
    Filed: November 9, 2022
    Publication date: May 11, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Teppei NIINO, Yosuke NAKANISHI
  • Publication number: 20230133282
    Abstract: A wiring circuit board includes a metal support board, a first metal thin film, an insulating layer, a second metal thin film, and a conductive layer in a thickness direction order. The insulating layer includes a through hole penetrating in the thickness direction, which includes a first opening end at the first metal thin film side, a second opening end opposite to the first opening end, and an inner wall surface between the first and-the second opening ends. The first metal thin film includes a first opening portion, which overlaps the first opening end in a projection view in the thickness direction. The second metal thin film includes a second opening portion, which overlaps the first opening portion and the second opening end in a projection view in the thickness direction. The conductive layer has a via portion disposed in the through hole and connected to the metal support board.
    Type: Application
    Filed: October 25, 2022
    Publication date: May 4, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takahiro IKEDA, Teppei NIINO
  • Publication number: 20230098947
    Abstract: A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.
    Type: Application
    Filed: February 24, 2021
    Publication date: March 30, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hiroaki MACHITANI, Teppei NIINO
  • Publication number: 20230015337
    Abstract: A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.
    Type: Application
    Filed: December 15, 2020
    Publication date: January 19, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Rihito FUKUSHIMA, Shusaku SHIBATA, Teppei NIINO