Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.

Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.

Abstract: A wiring circuit board includes a metal support board, a first metal thin film, an insulating layer, a second metal thin film, and a conductive layer in a thickness direction order. The insulating layer includes a through hole penetrating in the thickness direction, which includes a first opening end at the first metal thin film side, a second opening end opposite to the first opening end, and an inner wall surface between the first and-the second opening ends. The first metal thin film includes a first opening portion, which overlaps the first opening end in a projection view in the thickness direction. The second metal thin film includes a second opening portion, which overlaps the first opening portion and the second opening end in a projection view in the thickness direction. The conductive layer has a via portion disposed in the through hole and connected to the metal support board.

Abstract: A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.

Abstract: A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.

Abstract: A method for manufacturing a wiring circuit board that is a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layer, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.

Abstract: A pressure-sensitive adhesive optical film of the present invention comprises: an optical film; and a pressure-sensitive adhesive layer placed on at least one side of the optical film, wherein the pressure-sensitive adhesive layer has an equilibrium moisture content ratio (a) of 0.5% by weight or less, the pressure-sensitive adhesive layer shows a displacement amount (b) of 600 ?m or less in one hour at 23° C., when a tensile shearing stress of 500 gf is applied to an adhesion area of 10 mm×10 mm having a thickness of 25 ?m, and the equilibrium moisture content ratio (a) and the displacement amount (b) satisfy the relation: b<1036.4×e?5.124a. The pressure-sensitive adhesive optical film can have high durability in high-temperature environments and be prevented from foaming in such environments, even when the optical film on which the pressure-sensitive adhesive layer is placed is made of a material with low moisture permeability.

Abstract: A pressure-sensitive adhesive optical film of the present invention comprises: an optical film; and a pressure-sensitive adhesive layer placed on at least one side of the optical film, wherein the pressure-sensitive adhesive layer has an equilibrium moisture content ratio (a) of 0.5% by weight or less, the pressure-sensitive adhesive layer shows a displacement amount (b) of 600 ?m or less in one hour at 23° C., when a tensile shearing stress of 500 gf is applied to an adhesion area of 10 mm×10 mm having a thickness of 25 ?m, and the equilibrium moisture content ratio (a) and the displacement amount (b) satisfy the relation: b<1036.4×e?5.124a. The pressure-sensitive adhesive optical film can have high durability in high-temperature environments and be prevented from foaming in such environments, even when the optical film on which the pressure-sensitive adhesive layer is placed is made of a material with low moisture permeability.