Abstract: A laser processing apparatus includes a laser beam applying unit for applying a laser beam to a workpiece, and a control unit. The laser beam applying unit includes a laser oscillator for emitting a laser, a condensing lens, a concave mirror having a focal point at a focused spot of the condensing lens and having a spherical reflecting surface, a beam splitter for transmitting therethrough the laser beam emitted from the laser oscillator toward the condensing lens and branching off a reflected beam, and a wavefront measuring unit for receiving the reflected beam and acquiring wavefront data. The control unit changes a phase pattern to be displayed on a display portion of a spatial light modulator on the basis of the wavefront data.

Abstract: A conveying unit for conveying a device chip onto a predetermined electrode of a board has a chip chuck that holds under suction one surface of the device chip, a support base to which the chip chuck is fixed in an inclinable manner, and a moving unit that moves the support base, in which a fixing mechanism that fixes the chip chuck to the support base has a plurality of leaf springs extending laterally radially from the chip chuck, the plurality of leaf springs are connected to the support base in the surroundings of the chip chuck, and the plurality of leaf springs are pulled one another, so that the chip chuck is supported in air in an inclinable manner.

Abstract: A laser beam irradiation unit of a laser beam irradiation apparatus includes a laser beam source that emits a laser beam and a spatial light modulator that modulates the laser beam emitted from the laser beam source, according to a phase pattern, and that emits the laser beam. A controller has a storing section that stores the phase pattern to be displayed in the spatial light modulator and a rotation instructing section that rotates the phase pattern stored in the storing section. The controller uniformizes the power density of the laser beam with which a plate-shaped workpiece is irradiated, by rotating the phase pattern while the plate-shaped workpiece is irradiated with the laser beam.

Abstract: An inspection method includes applying a laser beam to a semiconductor chip to reflow a bump disposed on a surface of the semiconductor chip and included in an irradiation range of the workpiece, the laser beam being applied from an opposite surface of the semiconductor chip, capturing an image of the irradiation range with use of a thermal camera while the laser beam is applied to the semiconductor chip, and acquiring temperature information regarding the semiconductor chip from the captured image, storing in advance reference temperature information that represents temperature information obtained when the semiconductor chip and the board have normally been bonded to each other by the laser beam applied thereto, and determining whether or not the semiconductor chip and the board have normally been bonded to each other by the laser beam applied thereto, on the basis of the reference temperature information and the temperature information.

Abstract: A laser beam applying apparatus has a laser beam applying unit including a laser beam source for emitting the laser beam, a spatial light modulator for modulating the laser beam, according to phase patterns, and emitting the modulated laser beam, and a beam focusing assembly for focusing the laser beam modulated by the spatial light modulator and applying the focused laser beam to a plate-shaped workpiece. The laser beam applying apparatus also has a controller including a phase pattern storage section for storing a plurality of phase patterns representing respective different positions in a plane of the plate-shaped workpiece where the laser beam is applied when the phase patterns are displayed on the spatial light modulator, and a phase pattern control section for switching to predetermined phase patterns among the phase patterns stored in the phase pattern storage section as the phase patterns displayed on the spatial light modulator.

Abstract: A method of manufacturing a wafer includes a wafer preparing step of preparing a wafer including a plurality of semiconductor devices joined to a substrate by respective adhesive layers, a determining step of determining whether each of the semiconductor devices joined to the substrate is defective or non-defective, a laser beam applying step of applying a laser beam to heat one of the adhesive layers by which one of the semiconductor devices that has been determined as defective is bonded to the substrate, thereby melting the adhesive layer in an area of the wafer that is irradiated with the laser beam, and a treating step of treating the semiconductor device released from a bonded state due to the adhesive layer being melted in the laser beam applying step.

Abstract: A laser reflow method includes a preparation step of preparing a workpiece including a board and semiconductor chips that each have bumps formed on one surface thereof and are placed on the board with the bumps interposed therebetween and a laser beam irradiation step of irradiating the semiconductor chips with a laser beam from a side of another surface opposite to the one surface, thereby reflowing bumps formed within an irradiated area of the workpiece. In the laser beam irradiation step, the irradiation with the laser beam is carried out while an irradiation range of the laser beam is changed in stages from a region including an outer peripheral portion of the irradiated area toward a region including a central portion of the irradiated area.

Abstract: A laser beam irradiating apparatus includes a laser oscillator configured to emit a laser beam, a first polarization beam splitter configured to separate the laser beam into a first laser beam of s-polarized light and a second laser beam of p-polarized light, a first spatial light modulator configured to modulate the first laser beam according to a phase pattern, and emit the resulting first laser beam, a second spatial light modulator configured to modulate the second laser beam according to a phase pattern, and emit the resulting second laser beam; a second polarization beam splitter configured to synthesize the first laser beam emitted from the first spatial light modulator and the second laser beam emitted from the second spatial light modulator, and an imaging unit configured to image the synthesized laser beam, and irradiate a target object with the resulting laser beam.

Abstract: A laser beam spot shape correcting method includes a laser beam irradiating step of irradiating a concave mirror with a laser beam, an imaging step of imaging reflected light by a beam profiler, an image forming step of forming an XZ plane image or a YZ plane image from an XY plane image imaged in the imaging step, and a comparing step of comparing the image formed in the image forming step with an XZ plane image or a YZ plane image of an ideal laser beam. A phase pattern displayed on a display unit of a spatial light modulator is changed such that the XZ plane image or the YZ plane image formed in the image forming step coincides with the XZ plane image or the YZ plane image of the ideal laser beam.

Abstract: A conveying unit for conveying a device chip onto a predetermined electrode of a board has a chip chuck that holds under suction one surface of the device chip, a support base to which the chip chuck is fixed in an inclinable manner, and a moving unit that moves the support base, in which a fixing mechanism that fixes the chip chuck to the support base has a plurality of leaf springs extending laterally radially from the chip chuck, the plurality of leaf springs are connected to the support base in the surroundings of the chip chuck, and the plurality of leaf springs are pulled one another, so that the chip chuck is supported in air in an inclinable manner.

Abstract: A laser beam spot shape correcting method includes a laser beam irradiating step of irradiating a concave mirror with a laser beam, an imaging step of imaging reflected light by a beam profiler, an image forming step of forming an XZ plane image or a YZ plane image from an XY plane image imaged in the imaging step, and a comparing step of comparing the image formed in the image forming step with an XZ plane image or a YZ plane image of an ideal laser beam. A phase pattern displayed on a display unit of a spatial light modulator is changed such that the XZ plane image or the YZ plane image formed in the image forming step coincides with the XZ plane image or the YZ plane image of the ideal laser beam.

Abstract: A laser processing apparatus includes a laser beam applying unit for applying a laser beam to a workpiece, and a control unit. The laser beam applying unit includes a laser oscillator for emitting a laser, a condensing lens, a concave mirror having a focal point at a focused spot of the condensing lens and having a spherical reflecting surface, a beam splitter for transmitting therethrough the laser beam emitted from the laser oscillator toward the condensing lens and branching off a reflected beam, and a wavefront measuring unit for receiving the reflected beam and acquiring wavefront data. The control unit changes a phase pattern to be displayed on a display portion of a spatial light modulator on the basis of the wavefront data.