Patents by Inventor Teppei Takahashi

Teppei Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11036138
    Abstract: There is provided a substrate processing apparatus which includes: a rotation holding part configured to hold a substrate and rotate the substrate at a predetermined rotation speed around a rotation axis which extends in a direction perpendicular to a front surface of the substrate; a processing liquid supply part provided with a processing liquid nozzle located in proximity of the front surface and configured to supply a processing liquid onto the front surface from the processing liquid nozzle; a solvent supply part provided with at least one discharge nozzle located in proximity of the front surface and configured to supply an organic solvent onto the front surface from the at least one discharge nozzle; and a controller configured to execute a first process and a second process.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: June 15, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Teppei Takahashi
  • Publication number: 20210119008
    Abstract: A semiconductor device has: a semiconductor substrate; a drift layer of a first conductivity type; a well region of a second conductivity type; a high-concentration region of the second conductivity type, a source region of the first conductivity type; an insulating film provided on the drift layer; a first contact metal film in contact with the source region and the high-concentration region through a first opening provided in the insulating film; and a second contact metal film formed on a surface of the first contact metal film and contacting the high-concentration region through a second opening provided in the first contact metal film; a source electrode film formed on a surface of a contact metal layer including the first contact metal film and the second contact metal film. The first contact metal film includes titanium nitride, and the second contact metal film includes titanium.
    Type: Application
    Filed: April 11, 2018
    Publication date: April 22, 2021
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Teppei TAKAHASHI, Tetsuto INOUE, Akihiko SUGAI, Takashi MOCHIZUKI, Shunichi NAKAMURA
  • Patent number: 10926288
    Abstract: A coating sequence includes supplying a resist liquid onto a wafer under a condition that a liquid puddle of the resist liquid is formed at a central portion thereof; supplying, while rotating the wafer at a first rotation speed where the liquid puddle stays at an inner side than an edge of the wafer, a diluting liquid and moving a supply position of the diluting liquid from an outside of the liquid puddle to an edge portion thereof; moving, after the moving of the supply position from the outside to the edge portion, the supply position from the edge portion to the outside while continuously rotating the wafer at the first rotation speed; and rotating, after the moving of the supply position from the edge portion to the outside, the wafer at a rotation speed higher than the first rotation speed to diffuse the resist liquid toward the edge.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: February 23, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Teppei Takahashi
  • Publication number: 20200338589
    Abstract: A substrate treatment method for treating a substrate, includes: (a) applying a coating solution to a front surface of the substrate by a spin coating method to form a coating film; (b) supplying a solvent for the coating solution to a projection of the coating film formed at a front surface peripheral edge of the substrate at (a); and (c) rotating the substrate in a state where the supply of the solvent is stopped, to move a top of the projection to an outside in a radial direction of the substrate, (b) and (c) being repeatedly performed.
    Type: Application
    Filed: April 10, 2020
    Publication date: October 29, 2020
    Inventor: Teppei TAKAHASHI
  • Publication number: 20190146345
    Abstract: There is provided a substrate processing apparatus which includes: a rotation holding part configured to hold a substrate and rotate the substrate at a predetermined rotation speed around a rotation axis which extends in a direction perpendicular to a front surface of the substrate; a processing liquid supply part provided with a processing liquid nozzle located in proximity of the front surface and configured to supply a processing liquid onto the front surface from the processing liquid nozzle; a solvent supply part provided with at least one discharge nozzle located in proximity of the front surface and configured to supply an organic solvent onto the front surface from the at least one discharge nozzle; and a controller configured to execute a first process and a second process.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 16, 2019
    Inventor: Teppei TAKAHASHI
  • Publication number: 20180369856
    Abstract: A coating sequence includes supplying a resist liquid onto a wafer under a condition that a liquid puddle of the resist liquid is formed at a central portion thereof; supplying, while rotating the wafer at a first rotation speed where the liquid puddle stays at an inner side than an edge of the wafer, a diluting liquid and moving a supply position of the diluting liquid from an outside of the liquid puddle to an edge portion thereof; moving, after the moving of the supply position from the outside to the edge portion, the supply position from the edge portion to the outside while continuously rotating the wafer at the first rotation speed; and rotating, after the moving of the supply position from the edge portion to the outside, the wafer at a rotation speed higher than the first rotation speed to diffuse the resist liquid toward the edge.
    Type: Application
    Filed: June 25, 2018
    Publication date: December 27, 2018
    Inventor: Teppei Takahashi
  • Patent number: 9450246
    Abstract: Disclosed are carbon particles for a negative electrode of a lithium ion secondary battery, the carbon particles having a pore volume of pores having a size of 2×10 to 2×104 ?, of 0.1 ml/g or less with respect to the mass of the carbon particles; having an interlayer distance d(002) of a graphite crystal as determined by an X-ray diffraction analysis, of 3.38 ? or less; having a crystallite size Lc in the C-axis direction of 500 ? or more; and having a degree of circularity of the particle cross-section in the range of 0.6 to 0.9. Therefore, the carbon particles for the negative electrode of the lithium ion secondary battery enables to have high capacity and have superior rapid charge characteristics, a negative electrode for a lithium ion secondary battery using the carbon particles, and a lithium ion secondary battery can be provided.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: September 20, 2016
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Teppei Takahashi, Yoshito Ishii, Keiji Okabe, Yuriko Ida, Nobushige Nakamura
  • Publication number: 20120219863
    Abstract: Disclosed are carbon particles for a negative electrode of a lithium ion secondary battery, the carbon particles having a pore volume of pores having a size of 2×10 to 2×104 ?, of 0.1 ml/g or less with respect to the mass of the carbon particles; having an interlayer distance d(002) of a graphite crystal as determined by an X-ray diffraction analysis, of 3.38 ? or less; having a crystallite size Lc in the C-axis direction of 500 ? or more; and having a degree of circularity of the particle cross-section in the range of 0.6 to 0.9. Therefore, the carbon particles for the negative electrode of the lithium ion secondary battery enables to have high capacity and have superior rapid charge characteristics, a negative electrode for a lithium ion secondary battery using the carbon particles, and a lithium ion secondary battery can be provided.
    Type: Application
    Filed: October 20, 2010
    Publication date: August 30, 2012
    Inventors: Teppei Takahashi, Yoshito Ishii, Keiji Okabe, Yuriko Ida, Nobushige Nakamura