Patents by Inventor Teppei TSUKAMOTO

Teppei TSUKAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20120193793
    Abstract: According to an embodiment, a semiconductor device includes a first wiring member, an opening portion and an electrode terminal portion. The first wiring member is provided on a first interlayer insulating film on a semiconductor substrate and used as a wiring layer. The opening portion is provided in a second interlayer insulating film on the first wiring member. The electrode terminal portion is provided on the opening portion and the second interlayer insulating film around the opening portion. In the electrode terminal portion, a barrier metal film in contact with the first wiring member, a seed metal film and a second wiring member are stacked and thus formed in such a manner as to cover the opening portion, and a coating metal film is formed on an upper portion and a side surface of the second wiring member.
    Type: Application
    Filed: January 31, 2012
    Publication date: August 2, 2012
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Teppei TSUKAMOTO