Patents by Inventor Teppei YAMAGUCHI

Teppei YAMAGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TISSUE-SPECIFIC WNT SIGNAL ENHANCING MOLECULES AND USES THEREOF
    Publication number: 20240279303
    Abstract: The present disclosure provides tissue-specific Wnt signal enhancing molecules, and related methods of using these molecules to increase Wnt signaling in targeted tissues.
    Type: Application
    Filed: March 6, 2024
    Publication date: August 22, 2024
    Inventors: Zhengjian ZHANG, Jennifer Jean BRADY, Aaron Ken SATO, Wen-Chen YEH, Yang LI, Teppei YAMAGUCHI
  • Package, and method for manufacturing power semiconductor module
    Patent number: 11978682
    Abstract: A first frame is supported by a heat sink plate, surrounds an unmounted region of the heat sink plate, contains a resin, and has a first surface. A second frame contains a resin, and has a second surface opposing the first surface. An external terminal electrode passes between the first surface and the second surface. An adhesive layer contains a resin, and includes a lower portion, an upper portion, and an intermediate portion. The lower portion connects the external terminal electrode and the first surface to each other. The upper portion connects the external terminal electrode and the second surface to each other. The intermediate portion is disposed within a through hole of the external terminal electrode, and connects the lower portion and the upper portion to each other.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: May 7, 2024
    Assignees: NGK ELECTRONICS DEVICES, INC., NGK INSULATORS, LTD.
    Inventors: Yoshio Tsukiyama, Akiyoshi Osakada, Teppei Yamaguchi
  • Tissue-specific Wnt signal enhancing molecules and uses thereof
    Patent number: 11958891
    Abstract: The present disclosure provides tissue-specific Wnt signal enhancing molecules, and related methods of using these molecules to increase Wnt signaling in targeted tissues.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: April 16, 2024
    Assignee: Surrozen Operating, Inc.
    Inventors: Zhengjian Zhang, Jennifer Jean Brady, Aaron Ken Sato, Wen-Chen Yeh, Yang Li, Teppei Yamaguchi
  • Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith
    Patent number: 11901268
    Abstract: An external terminal electrode is attached to a frame, and the frame contains a first resin, and has a first adhered surface. A heat sink plate supports the frame, has an unmounted region where a power semiconductor element is to be mounted within the frame in plan view, is made of metal, and has a second adhered surface. An adhesive layer contains a second resin different from the first resin, and adheres the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other. One of the first and second adhered surfaces includes a flat portion and a protruding portion. The protruding portion protrudes from the flat portion and opposes the other one of the first adhered surface and the second adhered surface with the adhesive layer therebetween.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: February 13, 2024
    Assignees: NGK Electronics Devices, Inc., NGK INSULATORS, LTD.
    Inventors: Yoshio Tsukiyama, Teppei Yamaguchi
  • PACKAGE, AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR MODULE
    Publication number: 20220077011
    Abstract: A first frame is supported by a heat sink plate, surrounds an unmounted region of the heat sink plate, contains a resin, and has a first surface. A second frame contains a resin, and has a second surface opposing the first surface. An external terminal electrode passes between the first surface and the second surface. An adhesive layer contains a resin, and includes a lower portion, an upper portion, and an intermediate portion. The lower portion connects the external terminal electrode and the first surface to each other. The upper portion connects the external terminal electrode and the second surface to each other. The intermediate portion is disposed within a through hole of the external terminal electrode, and connects the lower portion and the upper portion to each other.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventors: Yoshio TSUKIYAMA, Akiyoshi OSAKADA, Teppei YAMAGUCHI
  • PACKAGE, AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR MODULE
    Publication number: 20220077033
    Abstract: An external terminal electrode is attached to a frame, and the frame contains a first resin, and has a first adhered surface. A heat sink plate supports the frame, has an unmounted region where a power semiconductor element is to be mounted within the frame in plan view, is made of metal, and has a second adhered surface. An adhesive layer contains a second resin different from the first resin, and adheres the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other. One of the first and second adhered surfaces includes a flat portion and a protruding portion. The protruding portion protrudes from the flat portion and opposes the other one of the first adhered surface and the second adhered surface with the adhesive layer therebetween.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventors: Yoshio TSUKIYAMA, Teppei YAMAGUCHI
  • TISSUE-SPECIFIC WNT SIGNAL ENHANCING MOLECULES AND USES THEREOF
    Publication number: 20200048324
    Abstract: The present disclosure provides tissue-specific Wnt signal enhancing molecules, and related methods of using these molecules to increase Wnt signaling in targeted tissues.
    Type: Application
    Filed: January 26, 2018
    Publication date: February 13, 2020
    Inventors: Zhengjian ZHANG, Jennifer Jean BRADY, Aaron Ken SATO, Wen-Chen YEH, Yang LI, Teppei YAMAGUCHI