Patents by Inventor Teppo Aapro

Teppo Aapro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7742309
    Abstract: An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: June 22, 2010
    Assignee: Nokia Corporation
    Inventors: Jussi Hakunti, Pekka Kilpi, Anssi Vänskä, Teppo Aapro, Harri Lasarov
  • Patent number: 7486517
    Abstract: A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: February 3, 2009
    Assignee: Nokia Corporation
    Inventors: Teppo Aapro, Harri Lasarov
  • Publication number: 20080158825
    Abstract: An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.
    Type: Application
    Filed: December 29, 2006
    Publication date: July 3, 2008
    Inventors: Jussi Hakunti, Pekka Kilpi, Anssi Vanska, Teppo Aapro, Harri Lasarov
  • Publication number: 20080151503
    Abstract: A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 26, 2008
    Inventors: Teppo Aapro, Harri Lasarov