Abstract: An electronic component is provided that includes a first die, a support with a die-attachment surface and a die-aligning element that is adjacent to the die-attachment surface. The die aligning element includes a first die-alignment wall. Moreover, a first side of the first die is horizontally fixed to the first die-alignment wall with a die-attach material. The side of the first die that is opposite to the first side of the first die is horizontally unfixed.

Abstract: An electronic component comprising a package base and an at least partly metallic cap which is attached to the package base to form an enclosure. A metallic sheet is fixed to the package base. The metallic sheet comprises a sheet side section and the cap comprises a cap side section. The sheet side section is in contact with the cap side section so that they together form a side-shield on the side of the enclosure.

Abstract: This disclosure describes an electronic component comprising a package base and a metallic cap. The metallic cap separates the enclosure into at least a first compartment and a second compartment. An electronic chip is in the first compartment, and the metallic cap separates the enclosure into the first and second compartments with its shape which forms a separator which extends from the ceiling of the first compartment toward the mounting plane of the electronic chip.

Abstract: A grinding method for single-disc cylindrical grinding of elongated objects, such as cylindrical paper machine rollers, in which method the object to be grounded is rotated about its axis and a grinding stone is rotated and its position on the surface of the object being ground is adjusted so that the grinding point of the grinding stone is held substantially at a constant distance from the center axis of the object being ground regardless of the deflection of the object. In the method, the position of the grinding stone is adjusted using an oscillating positioning controller synchronized with the rotation of the roller and receiving feedback from a measured quantity that bears a linear correlation to the change of position of the surface being ground.