Abstract: Transmit-receive circuitry for an electronic device capable of wireless communication includes: an antenna input/output, for coupling to an antenna; a transmit path, coupled to the antenna input/output, the transmit path including: a power amplifier, for receiving a transmission signal to be transmitted via the antenna; and a transformer; and a receive path, coupled to the antenna input/output, the receive path including: a low noise amplifier, for receiving a reception signal from the antenna. In a receive mode, the low noise amplifier is configured to receive reception signals via the antenna input/output, and the transmit path is connected to the antenna input/output such that the reception signals experience gain as a result of the transformer in the transmit path.

Abstract: A shielded system for reducing energy dissipation from an RF component into a semiconductor substrate, the shielded system comprising: a semiconductor substrate; an RF component in connection with the semiconductor substrate; an electrically connected shielding structure having a galvanic connection to ground or the semiconductor substrate, the electrically connected shielding structure being electrically connected to the RF component; and an electrically isolated shielding structure having no galvanic connection to ground, the semiconductor substrate or the RF component.

Abstract: An integrated circuit chip including: a chip pin configured to direct signals on and off chip; a first signal path from the chip pin to a first electrostatic discharge (ESD) susceptible circuit susceptible to a voltage greater than a first voltage level; a first protection circuit coupled to a first node on the first signal path, the first protection circuit being operable to limit the voltage of a signal directed on chip to a second voltage level, the second voltage level being higher than the first voltage level; and a second protection circuit coupled to a second node on the first signal path between the first node and the first ESD susceptible circuit, the second protection circuit being operable to limit the voltage of the signal directed on chip to the first voltage level.

Abstract: An integrated circuit chip including a chip pin configured to direct radio frequency signals on and off chip; a signal path from the chip pin which divides into a first signal path coupled to an input unit and a second signal path coupled to an output unit; a first filter between the chip pin and the input unit on the first signal path; a second filter between the chip pin and the output unit on the second signal path; a first switch coupling the first signal path to ground; and a second switch coupling the second signal path to ground; wherein the first and second switches are controllable to isolate the input unit from the output unit when the integrated circuit chip is transmitting a radio frequency signal, and to isolate the output unit from the input unit when the integrated circuit chip is receiving a radio frequency signal.

Abstract: An integrated circuit includes a digital interface for connection to a host controller; an antenna connection for connection to an antenna; a radio frequency transceiver for communicating data in accordance with one or more radio communication protocols, the radio frequency transceiver being configured to communicate radio frequency signals over the antenna connection in response to data exchanged over the digital interface; and radio loop-through circuitry for exchanging radio frequency signals with another integrated circuit, the radio loop-through circuitry being configured to provide radio frequency signals received at the antenna connection to an output connection of the integrated circuit.

Abstract: A transceiver includes a first circuit having a connector for connection to an antenna and receiving circuitry, and a second circuit having transmitting circuitry. The first and second circuits are coupled using a balun, where the balun is arranged so that its unbalanced side is in the first circuit and its balanced side is in the second circuit.

Abstract: A shielded system for reducing energy dissipation from an RF component into a semiconductor substrate, the shielded system comprising: a semiconductor substrate; an RF component in connection with the semiconductor substrate; an electrically connected shielding structure having a galvanic connection to ground or the semiconductor substrate, the electrically connected shielding structure being electrically connected to the RF component; and an electrically isolated shielding structure having no galvanic connection to ground, the semiconductor substrate or the RF component.

Abstract: A transceiver includes a first circuit having a connector for connection to an antenna and receiving circuitry, and a second circuit having transmitting circuitry. The first and second circuits are coupled using a balun, where the balun is arranged so that its unbalanced side is in the first circuit and its balanced side is in the second circuit.

Abstract: An integrated circuit includes a digital interface for connection to a host controller; an antenna connection for connection to an antenna; a radio frequency transceiver for communicating data in accordance with one or more radio communication protocols, the radio frequency transceiver being configured to communicate radio frequency signals over the antenna connection in response to data exchanged over the digital interface; and radio loop-through circuitry for exchanging radio frequency signals with another integrated circuit, the radio loop-through circuitry being configured to provide radio frequency signals received at the antenna connection to an output connection of the integrated circuit.