Abstract: A fixture and method for use in deposition of a material over a substrate make use of an apparatus for actively heating and cooling the substrate during the deposition process. The active heating and cooling structure enables careful control of the temperature of the substrate, and can provide rapid temperature adjustment in response to temperature variation. The fixture and method are thereby capable of accelerating the overall deposition process. The fixture and method also make use of structure for reducing warpage in the fixture during the deposition process due to thermal gradients. By reducing the susceptibility of the fixture to warpage and providing improved temperature control, the fixture and method enable fabrication of layers with more consistent characteristics.