Abstract: A SRAM cell wherein the pull up load of the cell is inherent ferroelectric leakage. The power down writeback may include boosting the word line. The power down writeback may also include discharging the plate from VDD to ground. Furthermore, the plate is held high during read and write operations.

Abstract: An embodiment of the invention is a four transistor SRAM 10 that contains at least one ferroelectric capacitor 20,21.

Abstract: An on-chip transient event detector (FIG., 1) is fabricated onto an integrated circuit chip to provide rapid response to a detected event, such as a transient radiation dose or other condition that can cause transient current pulses. The transient event detector includes a detector circuit 10 that includes a narrow p-channel FET (12), and a wide n-channel FET (14). These detector transistors are coupled together and biased so that the narrow-channel transistor is normally on and the wide-channel transistor is normally off. A transient event, such as a photocurrent induced by radiation, causes a current pulse in the normally off wide-channel transistor that is sufficiently greater than the current in the narrow-channel transistor to cause a change in logic output, providing an event signal. The event signal can be used to disable memory WRITE operations during the transient event. The detector circuit can be integrated with an on-chip time-delay circuit (30) to provide a time-delayed system reset signal.

Abstract: A memory cell is disclosed comprising cross-coupled inverters including gated diodes connected in the cross-coupling which increase the memory cell's resistance to single event upset. The layouts for constructing such a memory cell, which optimize READ and WRITE speeds, are also disclosed.

Abstract: An MOS transistor is disclosed which has a guard ring for prevention of source-to-drain conduction through the isolation oxide after exposure to ionizing radiation. In the described example of an n-channel transistor, a p+ region is formed at the edges of the source region in a self-aligned fashion relative to the gate electrode so as not to extend under the gate to contact the drain region. This p+ region forms a diode which retards source-drain conduction even if a channel is formed under the isolating field oxide where the gate electrode overlaps onto the field oxide. The structure may be silicided for improved series resistance. An example of the transistor formed in an SOI configuration is also disclosed.

Abstract: An MOS transistor is disclosed which has a guard ring for prevention of source-to-drain conduction through the isolation oxide after exposure to ionizing radiation. In the described example of an n-channel transistor, a p+ region is formed at the edges of the source region in a self-aligned fashion relative to the gate electrode so as not to extend under the gate to contact the drain region. This p+ region forms a diode which retards source-drain conduction even if a channel is formed under the isolating field oxide where the gate electrode overlaps onto the field oxide. The structure may be silicided for improved series resistance. An example of the transistor formed in an SOI configuration is also disclosed.

Abstract: A static random access memory wherein all cells have p-channel access transistors, p-channel driver transistors, and n-channel loads. The access transistors have a width to length ratio which is greater than the width to length ratio of the driver transistors.The bit lines are precharged close to VSS, and the wordlines are held near VCC in the off state. Thus the operating signals in the array of the SRAM of the present invention are opposite to those in SRAMs of the prior art.