Abstract: A power module includes a first circuit structure having a first bus substrate. The first bus structure has a first side on which is disposed a first circuit element. A second circuit structure has a second bus substrate and a second side on which is disposed a second circuit element. The first circuit structure and the second circuit structure are oriented in a stacked configuration such that the first side is disposed facing the second side, and the first circuit element partially overlaps the second circuit element. An output bus is disposed between the first circuit structure and the second circuit structure.

Abstract: A power module assembly has a first substrate including a first layer, second layer and a third layer. The first layer is configured to carry a switch current flowing in a first direction. A second substrate is operatively connected to the first substrate and includes a fourth layer, fifth layer and a sixth layer. A conductive joining layer connects the third layer of the first substrate and the fourth layer of the second substrate. The conductive joining layer may be a first sintered layer. The third layer of the first substrate, the first sintered layer and the fourth layer of the second substrate are configured to function together as a unitary conducting layer carrying the switch current in a second direction substantially opposite to the first direction. The net inductance is reduced by a cancellation effect of the switch current going in opposite directions.

Abstract: A power module includes a first circuit structure having a first bus substrate. The first bus structure has a first side on which is disposed a first circuit element. A second circuit structure has a second bus substrate and a second side on which is disposed a second circuit element. The first circuit structure and the second circuit structure are oriented in a stacked configuration such that the first side is disposed facing the second side, and the first circuit element partially overlaps the second circuit element. An output bus is disposed between the first circuit structure and the second circuit structure.

Abstract: A power module assembly has a first substrate including a first layer, second layer and a third layer. The first layer is configured to carry a switch current flowing in a first direction. A second substrate is operatively connected to the first substrate and includes a fourth layer, fifth layer and a sixth layer. A conductive joining layer connects the third layer of the first substrate and the fourth layer of the second substrate. The conductive joining layer may be a first sintered layer. The third layer of the first substrate, the first sintered layer and the fourth layer of the second substrate are configured to function together as a unitary conducting layer carrying the switch current in a second direction substantially opposite to the first direction. The net inductance is reduced by a cancellation effect of the switch current going in opposite directions.

Abstract: A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.

Abstract: A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.

Abstract: A partially segmented rotor assembly for an electric motor and a method for the same is provided. The partially segmented rotor assembly includes a first rotor segment and a plurality of second rotor segments. The first rotor segment has a plurality of first poles wound with a wire and defines a first circumferential gap between the wire of each adjacent pair of the first poles. Each second rotor segment has a second pole wound with the wire and is rigidly attached to the first rotor segment in a respective one of the first circumferential gaps to form a plurality of second circumferential gaps between the wire of each first pole and the wire of the adjacent second poles. The first and second rotor segments are configured to cooperate with one another to minimize the second circumferential gaps.

Abstract: Methods are provided for forming/inserting a magnet in a rotor. One method includes coating a plurality of magnetizable particles with a non-metallic material, inserting the coated particles in a rotor, and magnetizing the coated particles. Another method includes inserting a plurality of magnetizable particles into a rotor, submersing the rotor in motor varnish or another viscous, non-metallic material to coat the particles, and magnetizing the particles. Yet another method includes inserting a plurality of magnetizable particles in a rotor, inserting a non-metallic material into the rotor, mixing the particles and non-metallic material to form a mixture, curing the mixture to coat each particle with non-metallic material, and magnetizing the particles.

Abstract: Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink.

Abstract: A power converter assembly is provided. The power converter assembly includes first, second, and third power modules. The second power module is coupled to the first power module such that the second power module is separated from the first power module by a first distance. The third power module is coupled to the first and second power modules such that the third power module is separated from the second power module by a second distance and is separated from the first power module by a third distance. The first, second, and third distances are substantially the same.

Abstract: A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.

Abstract: An automotive power converter is provided. The automotive power converter includes a substrate, first and second electronic devices on the substrate, at least one conductive member coupled to the substrate and having a first device portion electrically coupled to the first electronic device and a second device portion electrically coupled to the second electronic device, and first and second terminals electrically coupled to the at least one conductive member. When a power supply is coupled to the first and second terminals, current flows from the first terminal to the first device portion substantially in a first direction and from the second terminal to the second device portion substantially in a second direction. The first direction has a first component and the second direction has a second component opposing the first component.

Abstract: Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.

Abstract: A semiconductor subassembly is provided for use in a switching module of an inverter circuit for a high power, alternating current motor application. The semiconductor subassembly includes a wafer having first and second opposed metallized faces; a semiconductor switching device electrically coupled to the first metallized face of the wafer and having at least one electrode region; and an interconnect bonded to the semiconductor switching device. The interconnect includes a first metal layer bonded to the at least one electrode region of the semiconductor switching device, a ceramic layer bonded to the first metal layer, the ceramic layer defining a via for accessing the first metal layer, a second metal layer bonded to the ceramic layer, and a conducting substance disposed in the via of the ceramic layer to electrically couple the first metal layer to the second metal layer.

Abstract: Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

Abstract: A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated.

Abstract: A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.

Abstract: Damping mechanisms and motor assemblies are provided. In an embodiment, by way of example only, a damping mechanism includes an end cap, a bearing retainer plate, a bearing damper ring, a bearing assembly, and first and second lateral dampers. The bearing damper ring is disposed in an annular cavity inwardly from an inner diameter surface of the end cap and has a radially inwardly-extending flange. The bearing assembly is disposed in the annular cavity radially inwardly relative to the bearing damper ring. The first lateral damper is disposed between a radially inwardly-extending wall of the end cap and the bearing damper ring. The second lateral damper is disposed between the bearing damper ring and the bearing retainer plate.

Abstract: Non-direct bond copper isolated lateral wide band gap semiconductor devices are provided. One semiconductor device includes a heat sink, a buffer layer directly overlying the heat sink, and an epitaxial layer formed of a group-III nitride overlying the buffer layer. Another semiconductor device includes a heat sink, a substrate directly overlying the heat sink, a buffer layer directly overlying the substrate, and an epitaxial layer formed of a group-III nitride overlying the buffer layer. Being formed of a group-III nitride enables the various epitaxial layers to be electrically isolated from their respective heat sinks.

Abstract: Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.