Patents by Inventor Terence Graham

Terence Graham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11980009
    Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: May 7, 2024
    Assignee: Ciena Corporation
    Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
  • Publication number: 20240049434
    Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
    Type: Application
    Filed: October 10, 2023
    Publication date: February 8, 2024
    Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
  • Publication number: 20230039781
    Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
    Type: Application
    Filed: September 9, 2022
    Publication date: February 9, 2023
    Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
  • Publication number: 20220352651
    Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.
    Type: Application
    Filed: September 9, 2020
    Publication date: November 3, 2022
    Inventors: Mitchell O'Leary, Victor Aldea, Kamran Rahmani, Trevor Meunier, Peter Ajersch, Terence Graham, Marc Leclair
  • Patent number: 11421313
    Abstract: An article, at least a surface of the article being made of or containing an organic material, and a thermally sprayed layer of coating material on the surface.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: August 23, 2022
    Assignee: ZIRCOTECIP LIMITED
    Inventors: Terence Graham, Andrew Robert McCabe, Thomas Campbell Prentice
  • Publication number: 20210243915
    Abstract: A hardened optical platform includes a hardened enclosure including a door that when closed environmentally seals the hardened enclosure; a first set including one of more modules; a second set including one or more modules arranged substantially perpendicular to the first set; and high-speed cabling interconnecting the first set to the second set, wherein the hardened optical platform is passively cooled with the hardened enclosure and the door being weatherproof thereby having no airflow internally from a surrounding environment.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 5, 2021
    Inventors: Peter Saturley, Terence Graham, Daniel Rivaud, Jeffrey Scott Moynihan
  • Publication number: 20210213006
    Abstract: Described herein are methods of treating or preventing an ASK1 or DYRK1A associated disease, disorder, or condition comprising administering to a subject in need thereof a dual inhibitor of ASK1 and DYRK1A; including administering pharmaceutically acceptable salts and solvates thereof.
    Type: Application
    Filed: August 27, 2019
    Publication date: July 15, 2021
    Inventors: Artur PLONOWSKI, Kathleen Ann ELIAS, Samuel David BROWN, Terence Graham PORTER, Neil Dwayne MCDONNELL
  • Patent number: 10986757
    Abstract: A module in a hardened optical platform includes one or more Printed Circuit Boards (PCB) and associated components; at least one cage configured to receive a pluggable optical module, wherein the at least one cage is on a PCB of the one or more PCBs; and a housing enclosing the one or more PCBs, wherein the housing covers the one or more PCBs, the associated components, and the at least one cage with the pluggable optical module, with respect to airflow, wherein a thermally conductive conduit is formed between the pluggable optical module once inserted and the housing, enabling the pluggable optical module to operate in the housing which is sealed with respect to airflow.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: April 20, 2021
    Assignee: Ciena Corporation
    Inventors: Peter Saturley, Terence Graham
  • Publication number: 20210112683
    Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
    Type: Application
    Filed: October 15, 2020
    Publication date: April 15, 2021
    Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Sherman
  • Publication number: 20210084746
    Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.
    Type: Application
    Filed: September 16, 2019
    Publication date: March 18, 2021
    Inventors: Mitchell O'Leary, Victor Aldea, Kamran Rahmani, Trevor Meunier, Peter Ajersch, Terence Graham, Marc Leclair
  • Patent number: 10939536
    Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: March 2, 2021
    Assignee: Ciena Corporation
    Inventors: Mitchell O'Leary, Victor Aldea, Kamran Rahmani, Trevor Meunier, Peter Ajersch, Terence Graham, Marc Leclair
  • Patent number: 10935742
    Abstract: The present disclosure provides pluggable optical modules that are prevented from reaching potentially dangerous temperatures when a fiber optic connector is not present and engaged with the associated module housing. Further, the present disclosure provides fiber optic connectors and/or pluggable optical modules that incorporate a port heat shield external to the associated face plate when the pluggable optical modules and fiber optic connectors are engaged, thereby preventing a user from contacting potentially hot and dangerous metallic surfaces of the module housings, as well as providing access for cooling air flow. The solutions presented herein are equally applicable to fixed optical ports and connectors as well.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: March 2, 2021
    Assignee: Ciena Corporation
    Inventors: Eric Maniloff, Victor Aldea, Terence Graham, Bonnie Lynne Mack
  • Patent number: 10877230
    Abstract: A thermal control system for pluggable optics in an optical platform. The thermal control system includes a heatsink and an actuator. The heatsink is configured to dissipate heat from a pluggable optical module in the optical platform. The heatsink includes a mating surface configured to make thermal contact with a module surface of the pluggable optical module inserted into the optical platform. The actuator is configured to manipulate the mating surface to change a contact area between the mating surface and the module surface such that the contact area between the mating surface and the module surface is larger for a temperature above a predetermined temperature than for a temperature below a predetermined temperature.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: December 29, 2020
    Assignee: Ciena Corporation
    Inventors: Terence Graham, Bonnie Mack, Mitchell O'Leary, Trevor Meunier, Eric Maniloff
  • Patent number: 10852497
    Abstract: The present disclosure provides pluggable optical modules that are prevented from reaching potentially dangerous temperatures when a fiber optic connector is not present and engaged with the associated module housing. Further, the present disclosure provides fiber optic connectors and/or pluggable optical modules that incorporate a port heat shield external to the associated face plate when the pluggable optical modules and fiber optic connectors are engaged, thereby preventing a user from contacting potentially hot and dangerous metallic surfaces of the module housings, as well as providing access for cooling air flow. The solutions presented herein are equally applicable to fixed optical ports and connectors as well.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: December 1, 2020
    Assignee: Ciena Corporation
    Inventors: Eric Maniloff, Victor Aldea, Terence Graham, Bonnie Lynne Mack
  • Publication number: 20200271878
    Abstract: The present disclosure provides pluggable optical modules that are prevented from reaching potentially dangerous temperatures when a fiber optic connector is not present and engaged with the associated module housing. Further, the present disclosure provides fiber optic connectors and/or pluggable optical modules that incorporate a port heat shield external to the associated face plate when the pluggable optical modules and fiber optic connectors are engaged, thereby preventing a user from contacting potentially hot and dangerous metallic surfaces of the module housings, as well as providing access for cooling air flow. The solutions presented herein are equally applicable to fixed optical ports and connectors as well.
    Type: Application
    Filed: October 15, 2019
    Publication date: August 27, 2020
    Inventors: Eric Maniloff, Victor Aldea, Terence Graham, Bonnie Lynne Mack
  • Publication number: 20200271877
    Abstract: The present disclosure provides pluggable optical modules that are prevented from reaching potentially dangerous temperatures when a fiber optic connector is not present and engaged with the associated module housing. Further, the present disclosure provides fiber optic connectors and/or pluggable optical modules that incorporate a port heat shield external to the associated face plate when the pluggable optical modules and fiber optic connectors are engaged, thereby preventing a user from contacting potentially hot and dangerous metallic surfaces of the module housings, as well as providing access for cooling air flow. The solutions presented herein are equally applicable to fixed optical ports and connectors as well.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 27, 2020
    Inventors: Eric Maniloff, Victor Aldea, Terence Graham, Bonnie Lynne Mack
  • Patent number: 10712103
    Abstract: A heat shield (10) comprises a metal sheet (12) with a thermal sprayed layer of ceramic material (14) thereon, the sheet (12) defining an array of dimples (16) and/or pimples (18) such that any notional plane intersecting the coated surface of the metal sheet (12) creates a notional line of intersection which intersects at least some dimples (16) and/or pimples (18).
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: July 14, 2020
    Assignee: Zircotec IP Limited
    Inventors: Terence Graham, Peter Whyman
  • Publication number: 20200100386
    Abstract: A module in a hardened optical platform includes one or more Printed Circuit Boards (PCB) and associated components; at least one cage configured to receive a pluggable optical module, wherein the at least one cage is on a PCB of the one or more PCBs; and a housing enclosing the one or more PCBs, wherein the housing covers the one or more PCBs, the associated components, and the at least one cage with the pluggable optical module, with respect to airflow, wherein a thermally conductive conduit is formed between the pluggable optical module once inserted and the housing, enabling the pluggable optical module to operate in the housing which is sealed with respect to airflow.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 26, 2020
    Inventors: Peter Saturley, Terence Graham
  • Publication number: 20180031335
    Abstract: A heat shield (10) comprises a metal sheet (12) with a thermal sprayed layer of ceramic material (14) thereon, the sheet (12) defining an array of dimples (16) and/or pimples (18) such that any notional plane intersecting the coated surface of the metal sheet (12) creates a notional line of intersection which intersects at least some dimples (16) and/or pimples (18).
    Type: Application
    Filed: February 11, 2016
    Publication date: February 1, 2018
    Inventors: Terence Graham, Peter Whyman
  • Patent number: 9648851
    Abstract: A pet grooming assembly includes a brush that has a handle portion and a bristle portion. The bristle portion has a chamber within the bristle portion. The handle portion has a reservoir within the handle portion wherein the reservoir may contain a liquid medication. The chamber and the reservoir are in fluid communication with each other. A valve is movably attached to the brush and the valve selectively inhibits a flow of the liquid medication from the reservoir to the chamber. A plurality of first bristles is attached to the bristle portion wherein each of the first bristles may brush an animal. A plurality of second bristles is attached to the bristle portion. Each of the second bristles is substantially hollow such that each of the second bristles is in fluid communication with the chamber. Thus, each of the second bristles may release the liquid medication onto the animal.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: May 16, 2017
    Inventor: La Terence Graham