Abstract: A cable recoil device includes a cable recoil device body, a pulley, a pulley yoke, a spring, and a cable. The pulley yoke is mounted to the pulley that is positioned within the cable recoil device body and has a wheel shaped body. The spring is connected to the cable recoil device body and to the pulley yoke. The cable is wound at least partially around a circumference of the wheel shaped body. When the cable recoil device is mounted for use in a device, the first end of the cable is connected to a body of the device and the second end of the cable is connected to a door of the device that moves relative to the body of the device. The spring provides tension on the pulley such that it lengthens when the door is opened and contracts when the door is closed.

Abstract: A touch-sensitive interface includes a shell mounting and a touch-sensitive shell having: a main area without attachment; a peripheral area to be supported by the shell mounting; a first face touch-accessible by a user; a second face located opposite the first face, against which are arranged supporting, in the main area, several mechanical stress sensors rigidly connected to the shell mounting. Several attachment elements are arranged such that: each attachment element establishes a localized attachment of the touch-sensitive shell against the mounting thereof, at the border between the peripheral and main areas; each sensor, rigidly connected to the shell mounting at a constant non-zero distance from the associated localized attachment, is subject to minimal out of charge mechanical stress so as to create an out of charge mechanically prestressed pivot link between the touch-sensitive shell and the mounting thereof around the localized attachment.

Abstract: A tray includes support arms and a base. Each support arm includes a top arm portion, a right hook, a right fulcrum portion mounted between the top arm portion and the right hook, a left hook, and a left fulcrum portion mounted between the top arm portion and the left hook. The base includes a base top plate that includes a right fulcrum platform, a left fulcrum platform, and a spring for each support arm. The right fulcrum portion is mounted to rotate on the right fulcrum platform. The left fulcrum portion is mounted to rotate on the left fulcrum platform. The spring is positioned to contact at least one of the right hook or the left hook when the associated support arm rotates on the right fulcrum platform and on the left fulcrum platform. The spring supports the top arm portion in an approximately upright position.

Abstract: A touch-sensitive interface includes a shell mounting and a touch-sensitive shell having: a main area without attachment; a peripheral area to be supported by the shell mounting; a first face touch-accessible by a user; a second face located opposite the first face, against which are arranged supporting, in the main area, several mechanical stress sensors rigidly connected to the shell mounting. Several attachment elements are arranged such that: each attachment element establishes a localized attachment of the touch-sensitive shell against the mounting thereof, at the border between the peripheral and main areas; each sensor, rigidly connected to the shell mounting at a constant non-zero distance from the associated localized attachment, is subject to minimal out of charge mechanical stress so as to create an out of charge mechanically prestressed pivot link between the touch-sensitive shell and the mounting thereof around the localized attachment.

Abstract: The aqueous slurry is useful for chemical mechanical polishing semiconductor substrates having copper interconnects. The aqueous slurry includes by weight percent, 0.01 to 25 oxidizing agent, 0.1 to 50 abrasive particles, 0.001 to 3 polyvinyl pyrrolidone, 0.01 to 10 inhibitor for decreasing static etch of the copper interconnects, 0.001 to 5 phosphorus-containing compound for increasing removal rate of the copper interconnects, 0.001 to 10 complexing agent formed during polishing and balance water; and the aqueous slurry has a pH of at least 8.

Abstract: A calculating apparatus, or system, having a plurality of stages, such as in a pipeline arrangement, has the clocking rail or conductor positioned alongside the stages. With a large number, i.e., hundreds, of stages arranged in parallel sub-arrays, the clocking conductor is snaked alongside the sub-arrays. In individual stages it is arranged that the shortest of the two calculations taking place in a stage, takes place in the return path. An array can be divided into separate sections for independent processing.

Abstract: The polishing solution is useful for preferentially removing barrier materials in the presence of nonferrous interconnect metals with limited erosion of dielectrics. The polishing solution comprises 0 to 20 weight percent oxidizer, at least 0.001 weight percent inhibitor for reducing removal rate of the nonferrous interconnect metals, 10 ppb to 4 weight percent complexing agent, 0 to 50 weight percent abrasive and balance water; and the solution having a pH of less than 7.

Abstract: The present invention provides a multi-step aqueous composition useful for polishing a tantalum barrier material and copper from a semiconductor wafer, comprising by weight percent 0.1 to 30 oxidizer, 0.01 to 3 inorganic salt or acid, 0.01 to 4 inhibitor, 0.1 to 30 abrasive, 0 to 15 complexing agent and balance water, wherein the aqueous composition has a pH between 1.5 to 6.

Abstract: The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer comprising by weight percent 0.001 to 6 inhibitor for a nonferrous metal, 0.05 to 10 complexing agent for the metal, 0.01 to 25 copper removal agent for accelerating the removal of the copper, 0.5 to 40 abrasive, 0 to 10 selected from the group comprising, polyvinylpyrrolidone, thermoplastic polymer and mixtures thereof, wherein the copper removal agent is imidazole.

Abstract: The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer at a down force pressure of at least less than 20.68 kPa, comprising by weight percent 1 to 15 oxidizer, 0.1 to 1 inhibitor for a nonferrous metal, 0.05 to 3 complexing agent for the nonferrous metal, 0.01 to 5 carboxylic acid polymer, 0.01 to 5 modified cellulose, 0.05 to 10 phosphorus-containing compound and 0 to 10 abrasive, wherein the phosphorus-containing compound increases removal of the copper.

Abstract: The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer comprising by weight percent 1 to 15 oxidizer, 0.1 to 1 inhibitor for a nonferrous metal, 0.05 to 3 complexing agent for the nonferrous metal, 0.01 to 5 carboxylic acid polymer, 0.01 to 5 modified cellulose, 0.0001 to 2 salt having a cationic and an anionic component, and balance water, the salt reducing noise level from vibration between the wafer and a polishing pad.