Abstract: A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device is provided. The sensor comprises a substrate, at least one electrically conductive support member connected to the substrate, and a thermally resistive layer supported by the at least one support member and spaced from the substrate by the support member to provide a space between the thermally resistive layer and the substrate. The sensor is arranged such that the thermally resistive layer is substantially thermally insulated from the substrate. The sensor is further arranged to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor.

Abstract: A tire localization system for locating the position of a tire of a vehicle having five or more wheels, includes a number of tire pressure monitoring system (TPMS) wheel modules of a vehicle TPMS, each wheel module being attached to each one of the wheels or a tire thereof, respectively. Each TPMS wheel module includes a radio, frequency identification (RFID) reader. The system further includes a number of RFID tags, each RFID tag being associated with and storing wheel position information of one of the wheels, and each RFID tag being positioned externally of its associated wheel. Each of the RFID readers is arranged, upon activation, to interrogate its associated RFID tag, and the associated RFID tag is arranged, upon interrogation, to transmit its stored position information to the RFID reader for transmission by the TPMS wheel module to a central control unit. A tire localization method is also provided.

Abstract: A micro mechanical backscatter sensor includes a receiver for receiving a modulated electromagnetic signal, a capacitive element operatively connected to the receiver, the capacitive element being arranged such that a voltage is generated across the capacitor in response to the frequency of the received signal, and a resonator operatively connected to the capacitive element such that electrostatic forces that are induced by the voltage generated cause the resonator to vibrate at a resonance frequency, the resonator being arranged such that an applied external force alters the resonance frequency of vibration.

Abstract: An energy harvesting system is arranged to harvest energy generated by a rotating tire. The system comprises a chamber holding fluid and an energy converter arranged to extract kinetic energy generated by a flow of the fluid, the flow being induced by a deformation of the chamber during the tire rotation, and further arranged to convert the kinetic energy into electrical energy. A method of harvesting energy generated by a rotating tire is also provided.

Abstract: A micro-electromechanical package includes a casing and a microelectronic circuit. At least one portion of the casing includes a piezoelectric material arranged such that, in use, dynamically changing mechanical strain in the at least one portion produces an electrical charge usable as a power source by the microelectronic circuit.

Abstract: A tire system includes a plurality of piezoelectric devices mounted to the tire. The piezoelectric devices provide output signals in response to deformation of the tire. A processor has input terminals for receiving the signals from the piezoelectric devices, and the processor is programmed to determine tire parameters in response to the output signals from the piezoelectric devices. A power converter has input terminals for receiving the signals from the piezoelectric devices, and the power converter is connected to the processor to power the processor.

Abstract: A micro-generator includes an integrated circuit (IC) wafer. A micro-electro mechanical system (MEMS) wafer, with a movable micromechanical element, is bonded to the IC wafer. A plurality of first metal coils associated with a plurality of trenches is arranged in one of the IC wafer and the MEMS wafer. A plurality of micro-magnets is provided in the other of the IC wafer and the MEMS wafer. Each micro-magnet is associated with a respective trench and is formed from a magnet layer deposited, plated or bonded to the MEMS wafer or IC wafer. Movement of the micro-mechanical element generates a voltage in the first metal coils.

Abstract: A tire localization system for locating the position of a tire of a vehicle having five or more wheels, includes a number of tire pressure monitoring system (TPMS) wheel modules of a vehicle TPMS, each wheel module being attached to each one of the wheels or a tire thereof, respectively. Each TPMS wheel module includes a radio frequency identification (RFID) reader. The system further includes a number of RFID tags, each RFID tag being associated with and storing wheel position information of one of the wheels, and each RFID tag being positioned externally of its associated wheel. Each of the RFID readers is arranged, upon activation, to interrogate its associated RFID tag, and the associated RFID tag is arranged, upon interrogation, to transmit its stored position information to the RFID reader for transmission by the TPMS wheel module to a central control unit. A tire localization method is also provided.

Abstract: A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device is provided. The sensor comprises a substrate, at least one electrically conductive support member connected to the substrate, and a thermally resistive layer supported by the at least one support member and spaced from the substrate by the support member to provide a space between the thermally resistive layer and the substrate. The sensor is arranged such that the thermally resistive layer is substantially thermally insulated from the substrate. The sensor is further arranged to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor.

Abstract: A micro mechanical backscatter sensor includes a receiver for receiving a modulated electromagnetic signal, a capacitive element operatively connected to the receiver, the capacitive element being arranged such that a voltage is generated across the capacitor in response to the frequency of the received signal, and a resonator operatively connected to the capacitive element such that electrostatic forces that are induced by the voltage generated cause the resonator to vibrate at a resonance frequency, the resonator being arranged such that an applied external force alters the resonance frequency of vibration.

Abstract: A micro-electromechanical device comprises a micro-electromechanical die, a package, and three pillars attaching the micro-electromechanical die to the package, at least one of the shape, position and orientation of the pillars is configured such that any strain transferred from the package to the die by deformation of the package is minimized.

Abstract: A micro-generator includes an integrated circuit (IC) wafer. A micro-electro mechanical system (MEMS) wafer, with a movable micromechanical element, is bonded to the IC wafer. A plurality of first metal coils associated with a plurality of trenches is arranged in one of the IC wafer and the MEMS wafer. A plurality of micro-magnets is provided in the other of the IC wafer and the MEMS wafer. Each micro-magnet is associated with a respective trench and is formed from a magnet layer deposited, plated or bonded to the MEMS wafer or IC wafer. Movement of the micro-mechanical element generates a voltage in the first metal coils.

Abstract: A substrate is provided for supporting a MEMS device. The substrate includes a housing with an integral pedestal mount for supporting the MEMS device. The substrate can be combined with a MEMS device to form a sensor.

Abstract: A capacitive-type sensor comprises a glass plate having an electrode formed thereon, and a micromachined structure formed from a semiconductor material and having an insulating rim formed thereon. A conducting seal is formed on the insulating rim and arranged to be bonded to the glass substrate to define an enclosed cavity containing the electrode, to thereby define a capacitive element, the conducting seal being arranged, in use, to have an electrical signal passed there through to determine a capacitance thereof which is indicative of the parameter to be determined by the sensor.

Abstract: A capacitive-type sensor comprises a glass plate having an electrode formed thereon, and a micromachined structure formed from a semiconductor material and having an insulating rim formed thereon. A conducting seal is formed on the insulating rim and arranged to be bonded to the glass substrate to define an enclosed cavity containing the electrode, to thereby define a capacitive element, the conducting seal being arranged, in use, to have an electrical signal passed there through to determine a capacitance thereof which is indicative of the parameter to be determined by the sensor.

Abstract: A force sensor device for sensing seismic force due to changes in acceleration or pressure, comprising mass-spring system formed by a resonant flexible plate forming system mass and suspended from a rigid frame by means of at least two beams forming system springs and located at different sides of the plate, the plate, frame and beams being made of a silicon. A vibration excitation device upon application of electric signals at an elected one of a plurality of specific frequencies interacts with the plate to create a corresponding specific vibration mode therein, and a detection device detects any vibration frequency change in the plate due to interaction between a stress field thereon caused by the seismic force and a stress field thereon caused by the vibration mode.