Patents by Inventor Terng-Jie Lin

Terng-Jie Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount antenna elements for use in an antenna array
    Patent number: 11824281
    Abstract: An antenna element comprises one or more directors, a resonator, and a three dimensional ground assembly. Parts of the antenna element are arranged on three metal layers. A top layer has an unconnected metal bar which forms a beam director, a resonator and a top part of the ground assembly. The resonator is an integral piece substantially in the form of a loop connected to a feed line and a feed line terminal ending. The feed line terminal ending serves as the ground plane for the feed line as well as providing impedance matching from the external transceiver circuit to the resonator. The ground assembly includes a top layer ground connected to a plurality of metallized half cylindrical hole channels (or metallized via holes) which connect to a ground terminal in a bottom layer.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: November 21, 2023
    Assignee: Micro Mobio Corporation
    Inventors: Guan-Wu Wang, Terng-Jie Lin, Yi-Hung Chen, Wen-Chung Liu, Weiping Wang
  • Surface mount antenna elements for use in an antenna array
    Patent number: 11404788
    Abstract: An antenna element comprises one or more directors, a resonator, and a three dimensional ground assembly. Parts of the antenna element are arranged on three metal layers. A top layer has an unconnected metal bar which forms a beam director, a resonator and a top part of the ground assembly. The resonator is an integral piece substantially in the form of a loop connected to a feed line and a feed line terminal ending. The feed line terminal ending serves as the ground plane for the feed line as well as providing impedance matching from the external transceiver circuit to the resonator. The ground assembly includes a top layer ground connected to a plurality of metallized half cylindrical hole channels (or metallized via holes) which connect to a ground terminal in a bottom layer.
    Type: Grant
    Filed: February 28, 2021
    Date of Patent: August 2, 2022
    Assignee: Micro Mobio Corporation
    Inventors: Guan-Wu Wang, Terng-Jie Lin, Yi-Hung Chen, Wen-Chung Liu, Weiping Wang
  • Compact wireless transceiver board with directional printed circuit antenna
    Patent number: 6046703
    Abstract: A wireless transceiver includes a dielectric substrate having first and second major surfaces on which an RF circuit and a baseband processing circuit are mounted, and a printed circuit antenna formed on the substrate. The printed circuit antenna has at least one director formed by strip conductors disposed on the substrate, a reflector formed by the edge of a ground area disposed on the substrate, and a dipole formed by strip conductors on the substrate. The dipole is positioned between the reflector and the director. An antenna with this low profile and compact antenna structure has high directivity.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: April 4, 2000
    Assignee: Nutex Communication Corp.
    Inventors: Guan-Wu Wang, Wen-Chung Liu, Terng-Jie Lin