Patents by Inventor Tero HEIKKINEN
Tero HEIKKINEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11914184Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: June 22, 2023Date of Patent: February 27, 2024Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Patent number: 11906774Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: May 31, 2023Date of Patent: February 20, 2024Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Publication number: 20240021764Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: ApplicationFiled: September 28, 2023Publication date: January 18, 2024Inventors: Antti KERÄNEN, Sami TORVINEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20240004119Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: ApplicationFiled: May 31, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20240004120Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective laver towards the plastic layer.Type: ApplicationFiled: June 22, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20240003516Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: ApplicationFiled: June 22, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Sami TORVINEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Patent number: 11817534Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: GrantFiled: July 2, 2022Date of Patent: November 14, 2023Assignee: TACTOTEK OYInventors: Antti Keränen, Sami Torvinen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Patent number: 11703627Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: September 15, 2022Date of Patent: July 18, 2023Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Patent number: 11594482Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.Type: GrantFiled: July 6, 2021Date of Patent: February 28, 2023Assignee: TACTOTEK OYInventors: Jarmo Sääski, Mikko Heikkinen, Tero Heikkinen, Mika Paani, Jan Tillonen, Ronald Haag
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Patent number: 11500142Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: July 2, 2022Date of Patent: November 15, 2022Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Publication number: 20210335702Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.Type: ApplicationFiled: July 6, 2021Publication date: October 28, 2021Inventors: Jarmo SÄÄSKI, Mikko HEIKKINEN, Tero HEIKKINEN, Mika PAANI, Jan TILLONEN, Ronald HAAG
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Patent number: 11088066Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.Type: GrantFiled: March 19, 2018Date of Patent: August 10, 2021Assignee: TACTOTEK OYInventors: Jarmo Sääski, Mikko Heikkinen, Tero Heikkinen, Mika Paani, Jan Tillonen, Ronald Haag
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Publication number: 20210007222Abstract: Integrated multilayer structure for hosting electronics, including a first substrate—including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.Type: ApplicationFiled: September 21, 2020Publication date: January 7, 2021Inventors: Tero HEIKKINEN, Antti KERANEN, Mikko HEIKKINEN, Jarmo SAASKI
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Patent number: 10827609Abstract: An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.Type: GrantFiled: December 12, 2019Date of Patent: November 3, 2020Assignee: TACTOTEK OYInventors: Tero Heikkinen, Antti Keranen, Mikko Heikkinen, Jarmo Saaski
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Publication number: 20200120793Abstract: An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.Type: ApplicationFiled: December 12, 2019Publication date: April 16, 2020Inventors: Tero Heikkinen, Antti Keranen, Mikko Heikkinen, Jarmo Saaski
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Patent number: 10561019Abstract: Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.Type: GrantFiled: August 25, 2017Date of Patent: February 11, 2020Assignee: TACTOTEK OYInventors: Tero Heikkinen, Antti Keranen, Mikko Heikkinen, Jarmo Saaski
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Publication number: 20190287892Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.Type: ApplicationFiled: March 19, 2018Publication date: September 19, 2019Inventors: Jarmo SÄÄSKI, Mikko HEIKKINEN, Tero HEIKKINEN, Mika PAANI, Jan TILLONEN, Ronald HAAG
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Publication number: 20190069403Abstract: Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.Type: ApplicationFiled: August 25, 2017Publication date: February 28, 2019Inventors: Tero HEIKKINEN, Antti KERANEN, Mikko HEIKKINEN, Jarmo SAASKI