Patents by Inventor Tero JARVELAINEN

Tero JARVELAINEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160066475
    Abstract: A capacitor module includes at least one capacitor element (101) and a cooling structure (103) for cooling the capacitor element. The electrical terminals (102a, 102b) of the capacitor element are mechanically connected to the cooling structure to be in heat-conductive relations with the cooling structure so that at least one of the electrical terminals of the capacitor element is mechanically connected to the cooling structure via a flexible connection element (104a, 104b) made of electrically conductive material. The flexible connection element allows the corresponding electrical terminal to move with respect to the cooling structure when the distance (D) between the electrical terminals is changing because of changes in load and/or temperature, and/or because of ageing.
    Type: Application
    Filed: August 21, 2015
    Publication date: March 3, 2016
    Inventors: Matti ISKANIUS, Tero JARVELAINEN, Mikko PIISPANEN
  • Publication number: 20150194273
    Abstract: A capacitor module includes a capacitor element (101), a first voltage terminal (102) connected to a first pole of the capacitor element, and a second voltage terminal (103) connected to a second pole of the capacitor element. The capacitor module further includes a cooling duct system (104) for cooling the capacitor element, and a housing (105) encapsulating the capacitor element and the cooling duct system. The housing includes wiring lead-throughs (106) for the first and second voltage terminals and piping lead-throughs (107) for the cooling duct system. As the capacitive module is encapsulated and includes the cooling ducts and the wiring and piping lead-throughs, modular capacitive energy-storages of different sizes can be built by interconnecting capacitor modules of the kind described above, and there is no need to build separately an encapsulation provided with cooling ducts.
    Type: Application
    Filed: January 3, 2014
    Publication date: July 9, 2015
    Applicant: Visedo Oy
    Inventor: Tero JARVELAINEN