Patents by Inventor Terrance D. Kendig

Terrance D. Kendig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140034225
    Abstract: Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (for example, polyethylene and polypropylene), tackifier resins and optional fillers that provide strong hermetic adhesion to fluoropolymers such as PCTFE. These compositions can be useful as an adhesive layer in multilayer structures prepared by extrusion lamination. Also disclosed are packages, such as thermoformed blister packs, rigid containers and pouches that comprise these multilayer structures.
    Type: Application
    Filed: October 7, 2013
    Publication date: February 6, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Terrance D. Kendig
  • Patent number: 8541073
    Abstract: Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (e.g., polyethylene and polypropylene), optional tackifier resins and optional fillers that provide very strong, tight hermetic heat seals yet are easily peelable. These compositions are useful as an adhesive layer in multilayer structures that are useful as packaging lidding films. Also disclosed are packages that comprise these multilayer structures.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: September 24, 2013
    Assignee: E I du Pont de Nemours and Company
    Inventors: Terrance D. Kendig, Stephen Robert Tanny
  • Publication number: 20120074020
    Abstract: Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (e.g., polyethylene and polypropylene), optional tackifier resins and optional fillers that provide very strong, tight hermetic heat seals yet are easily peelable. These compositions are useful as an adhesive layer in multilayer structures that are useful as packaging lidding films. Also disclosed are packages that comprise these multilayer structures.
    Type: Application
    Filed: December 5, 2011
    Publication date: March 29, 2012
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Terrance D. Kendig, Stephen Tanny
  • Patent number: 8137774
    Abstract: Disclosed are compositions comprising ethylene/vinyl acetate copolymers, tackifying resins and optionally polyolefins (for example, polyethylene and polypropylene) that provide strong, tight hermetic heat seals with an easily peelable opening feature to fluoropolymers such as polychlorotrifluoroethylene. Also disclosed are multilayer structures and packages comprising these compositions.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: March 20, 2012
    Assignee: E.I. Du Pont de Nemours and Company
    Inventors: Terrance D. Kendig, Stephen Robert Tanny
  • Publication number: 20110068040
    Abstract: Disclosed are compositions comprising ethylene/vinyl acetate copolymers, tackifying resins and optionally polyolefins (for example, polyethylene and polypropylene) that provide strong, tight hermetic heat seals with an easily peelable opening feature to fluoropolymers such as polychlorotrifluoroethylene. Also disclosed are multilayer structures and packages comprising these compositions.
    Type: Application
    Filed: November 30, 2010
    Publication date: March 24, 2011
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Terrance D. Kendig, Stephen R. Tanny
  • Patent number: 7892391
    Abstract: Disclosed are compositions comprising ethylene/vinyl acetate copolymers, tackifying resins and optionally polyolefins (for example, polyethylene and polypropylene) that provide strong, tight hermetic heat seals with an easily peelable opening feature to fluoropolymers such as polychlorotrifluoroethylene. Also disclosed are multilayer structures and packages comprising these compositions.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: February 22, 2011
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Terrance D. Kendig, Stephen R. Tanny
  • Patent number: 7569276
    Abstract: Disclosed is a thermoformable film laminate that can be useful for packaging comprising or produced from (a) a thermoformable film layer comprising or produced from a polymer composition having at least 80% by weight polyethylene terephthalate polymer, said film having an outer surface and an inner surface; (b) a film layer having a heat shrinkage of at least about 5% less than (a); (c) a heat sealable layer; and optionally, (d) an additional barrier layer.
    Type: Grant
    Filed: December 14, 2004
    Date of Patent: August 4, 2009
    Assignee: DuPont Teijin Films U.S. Limited Partnership
    Inventors: Terrance D. Kendig, Warren S. Sobataka
  • Publication number: 20040033382
    Abstract: The invention provides a packaging film comprising a heat-shrinkable, heat-sealable polyester shrink film. The film comprises a homopolymer or copolymer of polyethylene terephthalate, preferably coated with a solvent-based, heat-seal coating, e.g., an amorphous copolyester. The film may be metallized and/or laminated to other films, e.g., ionomer films.
    Type: Application
    Filed: August 15, 2003
    Publication date: February 19, 2004
    Inventor: Terrance D. Kendig
  • Publication number: 20030198764
    Abstract: The present invention is directed to a heat-shrinkable antifogging laminate for food packaging comprising a heat shinkage film, an adhesive layer, a film having less (or no) shrinkage and an anti-fog coating as well as a food package containing the heat shrunk laminate.
    Type: Application
    Filed: April 19, 2002
    Publication date: October 23, 2003
    Inventor: Terrance D. Kendig
  • Patent number: 6623821
    Abstract: The invention provides a packaging film comprising a heat-shrinkable, heat-sealable polyester shrink film. The film comprises a homopolymer or copolymer of polyethylene terephthalate, preferably coated with a solvent-based, heat-seal coating, e.g., an amorphous copolyester. The film may be metallized and/or laminated to other films, e.g., ionomer films.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: September 23, 2003
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Terrance D. Kendig