Patents by Inventor Terrance Monte Wright

Terrance Monte Wright has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing of multiple material substrates and slurry having improved selectivity
    Patent number: 6114249
    Abstract: A colloidal silica slurry containing triethanolamine is used in a chemical mechanical polishing process to polish multiple material substrates, such as silicon wafers containing silicon oxide where a thin underlayer of silicon nitride is used as a stop layer. The colloidal silica slurry containing triethanolamine is capable of achieving an oxide to nitride selectivity during polishing up to a demonstrated ratio of 28:1.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: September 5, 2000
    Assignee: International Business Machines Corporation
    Inventors: Donald Francis Canaperi, Rangarajan Jagannathan, Mahadevaiyer Krishnan, Clifford Owen Morgan, Terrance Monte Wright
  • Vertical polishing device and method
    Patent number: 5928062
    Abstract: The present invention relates to a chemical mechanical polishing (CMP) machine and method in which at least one polishing device is provided with a vertically-oriented polishing surface and a slurry delivery mechanism. As a result, the footprint of the machine is greatly reduced and the prevention of contaminants embedding in the polishing device can be promoted.
    Type: Grant
    Filed: April 30, 1997
    Date of Patent: July 27, 1999
    Assignee: International Business Machines Corporation
    Inventors: Matthew Kilpatrick Miller, Matthew Jeremy Rutten, Terrance Monte Wright
  • Polishing pad with controlled release of desired micro-encapsulated polishing agents
    Patent number: 5876266
    Abstract: A desired reagent is delivered to a workpiece undergoing a chemical mechanical polishing process with a chemical mechanical planarization apparatus. A slurry and polishing pad are provided for the polishing process. Reagent containing microcapsules are also provided, the microcapsules encapsulating a desired reagent. The workpiece is polished with a combination of the slurry, the polishing pad, and the microcapsules, wherein the encapsulated reagents are controllably released during the polishing step via manipulation of a polishing parameter. In one embodiment, the microcapsules are included in the slurry. In an alternate embodiment, the microcapsules are embedded within the polishing pad.
    Type: Grant
    Filed: July 15, 1997
    Date of Patent: March 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: Matthew Kilpatrick Miller, Clifford Owen Morgan, Matthew Jeremy Rutten, Erick G. Walton, Terrance Monte Wright