Patents by Inventor Terrel Morris
Terrel Morris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180052295Abstract: In examples provided herein, an optical fiber distribution node comprises a housing assembly that has an input port in the housing assembly and an input optical fiber cable coupled to the input port. The input port comprises multiple optical fibers. A first subset of the optical fibers is routed from the input port through a first output port in the housing assembly, and a second subset of the optical fibers is routed from the input port through a second output port.Type: ApplicationFiled: March 27, 2015Publication date: February 22, 2018Inventors: Terrel MORRIS, Raymond G. BEAUSOLEIL
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Patent number: 9710426Abstract: A computer system has a plurality of computer servers, each including at least one central processing unit (CPU). A memory appliance is spaced remotely from the plurality of computer servers. The memory appliance includes random access memory (RAM). A photonic CPU link is operatively attached to the at least one CPU. A photonic circuit switch is operatively attached to the photonic CPU link. An allocated portion of the RAM is addressable by a predetermined CPU selected from the plurality of computer servers.Type: GrantFiled: July 30, 2010Date of Patent: July 18, 2017Assignee: Hewlett Packard Enterprise Development LPInventor: Terrel Morris
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Patent number: 9634771Abstract: A method for connecting adjacent computing board devices. A source computing board may be provided. An optical engine attaches to the source computing board. A plurality of source optical connectors couples to the optical engine. A first optical connector may be positioned at a location on the source computing board for a first preset type of computing component on an adjacent computing board. A second optical connector may be positioned at a fixed coordinate related to the first optical connector on the source computing board.Type: GrantFiled: October 23, 2015Date of Patent: April 25, 2017Assignee: Hewlett Packard Enterprise Development LPInventors: Terrel Morris, Paul Kessler Rosenberg, Michael Renne Ty Tan, Gary Gostin, Eric Peterson
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Patent number: 9612402Abstract: An integrated grating element system includes a first transparent layer formed on an optoelectronic substrate layer which includes at least two optoelectronic components, a first grating layer disposed on the first transparent layer which includes at least two sub-wavelength grating elements formed therein aligned with active regions of the optoelectronic components, and a second grating layer placed at a distance from the first grating layer such that light propagates between a diffraction grating element formed within the second grating layer and the at least two sub-wavelength grating elements.Type: GrantFiled: January 12, 2012Date of Patent: April 4, 2017Assignee: Hewlett Packard Enterprise Development LPInventors: David A. Fattal, Raymond G. Beausoleil, Marco Fiorentino, Paul Kessler Rosenberg, Terrel Morris
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Patent number: 9582462Abstract: A computer system has a plurality of computer servers, each including at least one central processing unit (CPU). A memory appliance is spaced remotely from the plurality of computer servers. The memory appliance includes random access memory (RAM). A photonic CPU link is operatively attached to the at least one CPU. An optical-electrical converter is operatively attached to the photonic CPU link. An electronic circuit switch is operatively attached to the optical-electrical converter and the memory appliance. An allocated portion of the RAM is addressable by a predetermined CPU selected from the plurality of computer servers.Type: GrantFiled: July 30, 2010Date of Patent: February 28, 2017Assignee: Hewlett Packard Enterprise Development LPInventor: Terrel Morris
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Publication number: 20160301996Abstract: A hybrid circuit-packet switch device includes a packet switch and a circuit switch. The circuit switch selectively passes, under control of a control logic, incoming data received at an optical input of the hybrid circuit-packet switch device to the packet switch or an optical output of the hybrid circuit-packet switch device.Type: ApplicationFiled: October 22, 2013Publication date: October 13, 2016Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPInventors: Terrel Morris, Charles F. Clark, Raymond G. Beausoleil
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Publication number: 20160195679Abstract: The system provides a photonic waveguide formed on a substrate and a plurality of steering mirrors within the photonic waveguide. The steering mirrors can be configured to direct a light beam between two or more computing components. A plurality of steering mirror supports are located within the waveguide having preset locations. The steering mirror supports are configured to enable the steering mirrors to be selectively repositioned at the preset steering mirror supports within the photonic waveguide to create varying configurations. The steering mirrors in the varying configurations direct one or more optical beams to form multiple connectivity channels between computing components within the photonic waveguide.Type: ApplicationFiled: October 14, 2015Publication date: July 7, 2016Inventors: Terrel Morris, Gary Gostin, Eric Peterson
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Patent number: 9341780Abstract: Techniques related to optical connectors are described. A ferrule includes an optical pathway for light transmission through the ferrule. In examples, a sub-wavelength grating (SWG) assembly is integrated in the ferrule, aligned with an end of the optical pathway.Type: GrantFiled: December 9, 2011Date of Patent: May 17, 2016Assignee: Hewlett Packard Enterprise Development LPInventors: Raymond G. Beausoleil, Paul Kessler Rosenberg, David A. Fattal, Terrel Morris, Marco Fiorentino
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Patent number: 9335500Abstract: A hybrid electro-optical package for an opto-electronic engine. The package includes a carrier substrate, and a package base. Electrical vias and an optical via of the carrier substrate communicate between a back side and a front side of the carrier substrate. The package base is coupled to the carrier substrate by intra-package electrical interconnects. The carrier substrate is to interconnect electrically with an opto-electronic component mounted on its back side, and includes an optical aperture at its front side for communication of optical signals. Similarly, lands disposed at a front side of the package base provide for communication of electrical signals to an integrated circuit and the opto-electronic component. A system and an opto-electronic engine that include the hybrid electro-optical package are also provided.Type: GrantFiled: January 31, 2012Date of Patent: May 10, 2016Assignee: Hewlett Packard Enterprise Development LPInventors: Moray McLaren, Paul Kessler Rosenberg, Michael Renne Ty Tan, Terrel Morris
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Patent number: 9274297Abstract: The system (200) provides a photonic waveguide (210) formed on a substrate (220) and a plurality of steering mirrors (230) within the photonic waveguide. The steering mirrors can be configured to direct a light beam (240) between two or more computing components (260). A plurality of steering mirror supports (250) are located within the waveguide having preset locations. The steering mirror supports are configured to enable the steering mirrors to be selectively repositioned at the preset steering mirror supports within the photonic waveguide to create varying configurations. The steering mirrors in the varying configurations direct one or more optical beams to form multiple connectivity channels between computing components within the photonic waveguide.Type: GrantFiled: January 7, 2009Date of Patent: March 1, 2016Assignee: Hewlett Packard Enterprise Development LPInventors: Terrel Morris, Gary Gostin, Eric Peterson
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Publication number: 20160050027Abstract: A method for connecting adjacent computing board devices. A source computing board may be provided. An optical engine attaches to the source computing board. A plurality of source optical connectors couples to the optical engine. A first optical connector may be positioned at a location on the source computing board for a first preset type of computing component on an adjacent computing board. A second optical connector may be positioned at a fixed coordinate related to the first optical connector on the source computing board.Type: ApplicationFiled: October 23, 2015Publication date: February 18, 2016Inventors: Terrel MORRIS, Paul Kessler ROSENBERG, Michael Renne Ty TAN, Gary GOSTIN, Eric PETERSON
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Patent number: 9244232Abstract: A circuit module can include a substrate, a photonic conversion unit placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion unit and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion unit. The photonic conversion unit is removably secured to the substrate by the retention assembly without the use of a bonding material.Type: GrantFiled: June 1, 2015Date of Patent: January 26, 2016Assignee: Hewlett Packard Enterprise Development LPInventor: Terrel Morris
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Patent number: 9207416Abstract: A method for connecting adjacent computing board devices. A source computing board may be provided. An optical engine attaches to the source computing board. A plurality of source optical connectors couples to the optical engine. A first optical connector may be positioned at a location on the source computing board for a first preset type of computing component on an adjacent computing board. A second optical connector may be positioned at a fixed coordinate related to the first optical connector on the source computing board.Type: GrantFiled: October 31, 2008Date of Patent: December 8, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Terrel Morris, Paul Kessler Rosenberg, Michael Renne Ty Tan, Gary Gostin, Eric Peterson
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Patent number: 9164250Abstract: Connectors of a first removable modular optical connection assembly, having a first predefined arrangement of optical signal conduits, are connected to respective connectors on a support structure that are optically connected to corresponding devices. The first modular optical connection assembly is replaceable with a second modular optical connection assembly having a second, different predefined arrangement of optical signal conduits, to change a topology of a network.Type: GrantFiled: March 14, 2012Date of Patent: October 20, 2015Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Jeffrey Clifford Mogul, Dwight L. Barron, Kevin B. Leigh, Jayaram Mudigonda, Praveen Yalagandula, Guodong Zhang, Terrel Morris
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Patent number: 9161105Abstract: Systems, methods, and apparatus to route optical signals are disclosed. An example apparatus to route optical signals includes a plurality of hollow metal waveguide optical switch arrays. Each of the arrays comprises a plurality of optical input ports and a plurality of optical output ports. The input ports and the output ports for a first one of the arrays are arranged in a first plane, the input ports and the output ports for a second one of the arrays are arranged in a second plane, and the plurality of arrays are stacked such that the first and second planes are adjacent. The first one of the arrays is to convey optical signals from a first communication device to a second communication device and the second one of the arrays is to convey optical signals from the second communication device to the first communication device.Type: GrantFiled: April 11, 2012Date of Patent: October 13, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Terrel Morris, Michael Renne Ty Tan, Shih-Yuan Wang, Michael Steven Schlansker
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Publication number: 20150260932Abstract: A circuit module can include a substrate, a photonic conversion unit placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion unit and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion unit. The photonic conversion unit is removably secured to the substrate by the retention assembly without the use of a bonding material.Type: ApplicationFiled: June 1, 2015Publication date: September 17, 2015Inventor: Terrel MORRIS
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Patent number: 9082745Abstract: A circuit module can include a substrate, photonic conversion units placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion units and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion units. The plurality of photonic conversion units are removably secured to the substrate by the retention assembly without the use of a bonding material.Type: GrantFiled: April 30, 2010Date of Patent: July 14, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventor: Terrel Morris
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Patent number: 9052462Abstract: A method for constructing an area array waveguide power splitter includes preparing a reflective layer on a substrate and forming a core of an area array waveguide layer and alignment features for an optical fiber input and a plurality of optical fiber outputs atop the reflective layer, wherein the core of the area array waveguide layer and the alignment features are formed concurrently. The method also includes applying a reflective layer to the top and side surfaces of the core of the area array waveguide layer and exposing an input and exposing a plurality of outputs in the reflective layer.Type: GrantFiled: May 28, 2010Date of Patent: June 9, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Terrel Morris, Michael Renne Ty Tan, Wayne V Sorin, Paul Kessler Rosenberg, Sagi Varghese Mathai
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Publication number: 20150063771Abstract: Connectors of a first removable modular optical connection assembly, having a first predefined arrangement of optical signal conduits, are connected to respective connectors on a support structure that are optically connected to corresponding devices. The first modular optical connection assembly is replaceable with a second modular optical connection assembly having a second, different predefined arrangement of optical signal conduits, to change a topology of a network.Type: ApplicationFiled: March 14, 2012Publication date: March 5, 2015Inventors: Jeffrey Clifford Mogul, Dwight L. Barron, Kevin B. Leigh, Jayaram Mudigonda, Praveen Yalagandula, Guodong Zhang, Terrel Morris
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Patent number: 8965212Abstract: Various embodiments of the present invention are directed to optical-based methods and expansion memory systems for disaggregating memory of computer systems. In one aspect, an expansion memory system comprises a first optical/electronic interface in electrical communication with a processor, a memory expansion board configured with memory, and a second optical/electronic interface attached to the memory expansion board. The first interface converts optical signals into electronic signals that are sent to the processor and converts electronic signals produced by the processor into optical signals. The second interface converts optical signals into electronic signals that are sent to the memory and converts electronic signals produced by the memory into optical signals. The optical signals are exchanged between the first and second interfaces. Embodiments also include methods for sending and receiving data in an expansion memory system.Type: GrantFiled: April 29, 2009Date of Patent: February 24, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Terrel Morris, Michael Renne Ty Tan