Abstract: The present invention describes a piece of furniture and a method of using and making the same according to certain embodiments of the invention may include an organizing structure having a housing with an open front portion, a movable false interior wall capable of fastening at least a single electrical line and a tray at the uppermost portion wherein said electrical line is accessible.

Abstract: A piece of furniture and a method of using it according to certain embodiments of the invention may include a cabinet having a housing with an open front portion, a false interior rear wall defining an electrical line routing space, and an electronic device supporting top tray for communicating with the electrical line routing space.

Abstract: A heat dissipating connector for semiconductor package leads is disclosed. The body of the connector is comprised of two oppositely facing fingers formed from a unitary strip by making a 180 degree bend transverse to the longitudinal axis of the strip. A heat dissipating fin is formed integrally with an edge of one of the fingers, and protrudes substantially perpendicular to the vertical centerline of the heat dissipating connector body. In its installed condition, the facing surfaces of the fingers engage a semiconductor package lead with a spring force urged from the spring configuration of one of the fingers. The integrated circuit electrical lead, when mounted between the engaging surfaces of the oppositely facing fingers, is gripped in place, thereby maintaining a good heat and electrically conductive relationship therewith.